Waveguide Gaskets
Abstract: MIL-DTL-85328 WR137 gasket dimensions M83528 001 Waveguide Gaskets WR187 ZZ-R-765 CLASS 2B, GRADE 50 SHELF LIFE m83528 MIL-DTL-83528C WR340 waveguide fluorosilicone curing
Text: Elastomeric EMI Shielding Solutions www.lairdtech.com Innovative Technology for a Connected World ANTENNAS & RECEPTION WIRELESS REMOTE CONTROL EMI SOLUTIONS THERMAL MANAGEMENT WIRELESS M2M & TELEMATICS ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical
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diamond antenna
Abstract: T-Flex 200 CP177 Tgon T-gon 22 CP230 K177 K228 K200 FSF52
Text: THERMAL_SHORTFORM3 14/12/05 4:52 pm Page 1 global solutions : local support Laird Technologies is the world’s leading designer and manufacturer of electromagnetic interference [EMI] shielding materials, thermal interface products, and wireless antenna
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Laird thermal grease
Abstract: viscometer
Text: TgreaseTM 2500 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 2500 is a silicone-free thermal grease for use in high performance CPU’s and GPU’s. With a high thermal conductivity of 3.8 W/mK, Tgrease™ 2500 thoroughly wets
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A14265-00
Laird thermal grease
viscometer
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TGREASE-980
Abstract: No abstract text available
Text: TgreaseTM 980 Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 980 is a silicone-based thermal grease for use in high performance CPUs and GPUs. Tgrease 980 has a high thermal conductivity of 3.8 W/mK and superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
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Laird thermal grease
Abstract: viscometer D257 transistors IGBT A15296-00
Text: TgreaseTM 880 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE TgreaseTM 880 is a silicone based, high performance thermal grease designed to meet the thermal, reliability and price requirements of high end CPUs, GPUs and custom ASICS chips.
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A15092-00
Laird thermal grease
viscometer
D257
transistors IGBT
A15296-00
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D150
Abstract: D257 E595 ASTM D5470 igbt to220
Text: TgreaseTM 1500 Series Thermal Grease Innovative Technology for a Connected World TgreaseTM 1500 SERIES SOLVES OVERHEATING AND RELIABILITY ISSUES TgreaseTM 1500 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issues.
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A14876-00
D150
D257
E595
ASTM D5470
igbt to220
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Untitled
Abstract: No abstract text available
Text: TpcmTM 580SP Series Screen Printable Phase Change Material Preliminary Innovative Technology for a Connected World HIGH-PERFORMANCE SCREEN PRINTABLE PHASE CHANGE MATERIAL Tpcm 580SP is an exceptionally high-performance, screen printable or stencilable thermal interface material TIM which proves to be a great alternative to grease.
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580SP
A16425-00
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ASTM D5470
Abstract: a1371 Tputty
Text: TputtyTM 504 Series Innovative Technology for a Connected World SOFT, SILICONE GEL Tputty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.
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A13850-00
739-A13717-03
A13717-03
ASTM D5470
a1371
Tputty
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FSF52
Abstract: No abstract text available
Text: TpcmTM FSF-52 Innovative Technology for a Connected World Tpcm FSF-52 Tpcm™ FSF-52 is a free standing film. It contains no substrate. At temperatures greater than 52°C, Tpcm™ FSF-52 changes into a molten state and, under low closure force, wets the heat sink and component surfaces to create a very thin, low thermal resistance
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FSF-52
FSF-52
FSF52
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Untitled
Abstract: No abstract text available
Text: TputtyTM 506 Series Gap Filler Material Innovative Technology for a Connected World SOFT, SILICONE PUTTY Tputty 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is ideal for applications where large gap tolerances are present and in which traditional gap filler
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A16421-00
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Untitled
Abstract: No abstract text available
Text: TputtyTM 504 Series Innovative Technology for a Connected World Soft, Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.
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A13850-00
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Abstract: No abstract text available
Text: DA Tunnel Series, DA-011-05-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance
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DA-011-05-02
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THR-DS-DA-025-24-02
Abstract: No abstract text available
Text: DA Tunnel Series, DA-025-24-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance
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DA-025-24-02
THR-DS-DA-025-24-02
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Untitled
Abstract: No abstract text available
Text: DA Tunnel Series, DA-039-12-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance
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DA-039-12-02
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Abstract: No abstract text available
Text: DA PowerCool Series, DA-034-24-02 Thermoelectric Assembly Innovative Technology for a Connected World PowerCool series Direct-to-air thermoelectric assembly The DA PowerCool Series is a Direct-to-Air thermoelectric assembly TEA that uses impingement flow to transfer heat. It offers dependable, compact performance by
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KS-886H
Abstract: Kostat tray
Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
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AN-657-1
KS-886H
Kostat tray
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FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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Untitled
Abstract: No abstract text available
Text: EMI CATALOG www.lairdtech.com ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic
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M83528/002D-017
Abstract: No abstract text available
Text: EMI CATALOG www.lairdtech.com ABOUT LAIRD Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and
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Untitled
Abstract: No abstract text available
Text: global solutions : local support |FINGERSTOCK, GASKETS AND METAL GROUNDING PRODUCTS engineered emi, antenna and thermal applications BERYLLIUM COPPER SOLUTIONS AND BEYOND. Beryllium copper has remarkable stability, superior tensile strength, impressive thermal and electrical conductivity, and high shielding
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FING-GASK-META-BRO-English-2006
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Abstract: No abstract text available
Text: Laird Technologies Web site: www.LairdTech.com Item # AL-52 /, Tpcm AL-52 Phase Change Material Tpcm™ AL-52 Phase Change Material Tpcm™ Al-52 is a thermally conductive phase change material coated on both side of aluminum foil. At temperature greater than 52°C, Tpcm™ Al-52 changes into a molten state and, Under low closure force, wets the heat sink and
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AL-52
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microwave products
Abstract: 97-438 ASTM B488 9752 BMIC-004 electromechanical catalog coldrol 77079 semi catalog 77057
Text: LT-3034 Metals_catalog 10/8/04 10:29 AM Page 1 FINGERSTOCK, GASKETS AND METAL GROUNDING PRODUCTS LT-3034 Metals_catalog 10/8/04 10:29 AM Page 2 BERYLLIUM COPPER SOLUTIONS AND BEYOND. Beryllium copper has remarkable stability, superior tensile strength, impressive thermal and electrical conductivity, and high shielding
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datasheet of Z40-12.7B heat sink
Abstract: UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X
Text: Thermal Management for FPGAs December 2009 AN-358-2.0 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power
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AN-358-2
datasheet of Z40-12.7B heat sink
UB35-25B
Chomerics
of Z40-12.7B heat sink
Z3512
EP2S15
JESD51-9
T412
laird gasket
JESD51-X
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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AN-358-3
Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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