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    D1B050000

    Abstract: DIB050000 Reed relay
    Text: PRODUCT SPECIFICATION DATE : REED RELAY: cosmo [e l e c t r o n i c s NO. 50R01007 SHEET 1 OF 2 D1B050000 corporation 03/26/00’ REV. 1. OUTSIDE DIMENSION : UNIT mm S3 CL KUAN HSI D1B050000 •o— d TZ1— LT 19.5 0.4 5.5 T 3.0 _L 0.57.62 10.15 8.9max.


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    D1B050000

    Abstract: KUAN HSI D1b050000 relay reed kuan DIB050000 D1B05 KUAN KUAn HSI
    Text: PRODUCT SPECIFICATION cosmo REED RELAY: SHEET 1 OF 2 D1B050000 ELECTRONICS CORPORATION 1. OUTSIDE DIMENSION : UNIT nun n n n n Date Code ^ KUAN HSI » J D1B050000 ^\~ U — U U U 19 .5 7 .0 — 1 0.25 —U |I— 5 — V T. ¿0 — * 7 .6 2 — I •-


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    Untitled

    Abstract: No abstract text available
    Text: PRODUCT SPECIFICATION DATE : REED RELAY: co sm o NO. 50R01007 SHEET 1 OF 2 D1B050000 [e l e c t r o n i c s CORPORATION 1. OUTSIDE DIMENSION : UNIT mm O CL KUAN HSI D1B050000 •o— O ' T =l— CUT 19.5 7.0 r 0.4 5.5 T 0.5 0.25 3.0 — _L 7.62 10.15 8.9max.


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    Diode c013

    Abstract: KUAN HSI D1B050000
    Text: cosmo Features 1. Molded epoxy body. 2. Dip type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing.In addition, the high sensitivity allows direct driving by TTL, etc. 3. Automatic insertion compatible. 4. Sealed construction permits automatic flow soldering


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    PDF D1B050000 E108430) 100VDC) 10-2000HZ) Diode c013 KUAN HSI