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    KOSTAT CARRIER TAPE Search Results

    KOSTAT CARRIER TAPE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    AD2S82AHPZ-REEL Analog Devices MONO R/D PLCC REEL IC Visit Analog Devices Buy
    ADRV1CRR-FMC Analog Devices SDR Module Carrier/FMC Carrier Visit Analog Devices Buy
    EV-SOMCRR-EZKIT Analog Devices SOM Carrier EZKIT Evaluation B Visit Analog Devices Buy
    OP177GSZ-REEL Analog Devices OP177GS WITH TAPE AND REEL Visit Analog Devices Buy
    OP249GSZ-REEL Analog Devices OP249GS W/TAPE AND REEL Visit Analog Devices Buy
    SMP04ESZ-REEL Analog Devices SMP04ES W/TAPE AND REEL Visit Analog Devices Buy

    KOSTAT CARRIER TAPE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


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    PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    kostat tray qfn 5 x 3

    Abstract: ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the popular sizes of current modules. APPLICATION NOTE


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    PDF 101568E kostat tray qfn 5 x 3 ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6

    EPAK TRAY

    Abstract: GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE


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    PDF 101568G EPAK TRAY GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D

    101568i

    Abstract: SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE


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    PDF 101568I 101568i SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY

    wireless mobile charger block diagram

    Abstract: Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460 CX20460-12 CX20505-14
    Text: PRODUCT SUMMARY CX20460 Power Management Integrated Circuit for GSM and GPRS Applications Description APPLICATIONS • GSM and GPRS handsets/data modules FEATURES • • • • • • • • • • Power on/off control Generation of system voltages from a single power source


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    PDF CX20460 48-pin 03185A 376-3000fax 376-3100sales wireless mobile charger block diagram Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460-12 CX20505-14

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount


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    PDF SKY77155

    SKY77189

    Abstract: KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape
    Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range


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    PDF SKY77189 10-pad KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape

    design of multi section directional coupler

    Abstract: class d power amplifier Kostat tray MMIC code D sky77189 Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3
    Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range


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    PDF SKY77189 10-pad design of multi section directional coupler class d power amplifier Kostat tray MMIC code D Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3

    JESD-A115

    Abstract: SKY77155 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10
    Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount


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    PDF SKY77155 JESD-A115 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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