KOSTAT BGA 6MM X 6MM Search Results

KOSTAT BGA 6MM X 6MM Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
84520-002LF		Amphenol Communications Solutions	400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
10026846-201		Amphenol Communications Solutions	528 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
84578-002LF		Amphenol Communications Solutions	300 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
74388-101		Amphenol Communications Solutions	400 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
84530-102		Amphenol Communications Solutions	200 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array

KOSTAT BGA 6MM X 6MM Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF