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    KOKI SOLDER PASTE Search Results

    KOKI SOLDER PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    KOKI SOLDER PASTE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527 PDF

    S3X58-M405

    Abstract: koki solder paste
    Text: Comata 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Comata antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE030097-D S3X58-M405 koki solder paste PDF

    S3X58-M405

    Abstract: 702 smd FE010315-G mica material capacitor
    Text: Mica 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Mica antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) FE010315-G S3X58-M405 702 smd FE010315-G mica material capacitor PDF

    A5645

    Abstract: koki solder paste
    Text: Mica 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Mica antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) FE010315-I A5645 koki solder paste PDF

    S3X58-M405

    Abstract: No abstract text available
    Text: Rufa 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Rufa antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE020157-H S3X58-M405 PDF

    S3X58-M405

    Abstract: A6150 A6250 3030A6150-01 30-30A koki solder paste
    Text: Impexa 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Impexa antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE040034-D S3X58-M405 A6150 A6250 3030A6150-01 30-30A koki solder paste PDF

    60068-2-21

    Abstract: ASBESTOS 3030A6150-01 3030a6250-01 2.4 antenna connector 702 smd PCB Antenna matching S3X58 smd transistor 3d A6150
    Text: Impexa 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Impexa antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE040034-B 60068-2-21 ASBESTOS 3030A6150-01 3030a6250-01 2.4 antenna connector 702 smd PCB Antenna matching S3X58 smd transistor 3d A6150 PDF

    702 N smd transistor

    Abstract: 702 smd
    Text: Comata 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Comata antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE030097-B 702 N smd transistor 702 smd PDF

    702 N smd transistor

    Abstract: 702 smd CB9 smd transistor 3030A5839-01
    Text: Rufa 2.4 GHz SMD Antenna Product Specification 1 Features • Designed for 2.4 GHz applications [Bluetooth , WiFi™ 802.11b/g , Zigbee™, WiMedia™ etc.] • Intended for SMD mounting • Supplied in tape on reel 2 Description The Rufa antenna is intended for use with all 2.4 GHz applications. The antenna requires a groundplane,


    Original     		11b/g) AE020157-F 702 N smd transistor 702 smd CB9 smd transistor 3030A5839-01 PDF

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT PDF

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux PDF

    koki solder paste

    Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY


    Original     		JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1 PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste PDF

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00 PDF

    sem 2106 inverter diagram

    Abstract: induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual
    Text: This version: Jan. 1998 Previous version: Nov. 1996 E2S0001-27-Y3 Introduction Thank you for supporting OKI Semiconductor products. In the rapidly advancing electronics industry, types of semiconductor applications are diversified, and customer demands for


    Original     		E2S0001-27-Y3 MIL-STD-883 MIL-STD-202 sem 2106 inverter diagram induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual PDF

    8051 program code for the weighing scales

    Abstract: 8051 assembly program weighing scales assembly CODE program for weighing scales thermal printer 8051 microcontroller p120 2d motor dc motor interface with 8051 using uln2003 thermistor M53 weighing machine using 8051 WEIGHING SCALE 8051 ULN2003 PIN DIAGRAM configuration
    Text: SOC-4000/i Scale-On-Chip ASIC Technical Specification August 2002 Document order number: SOC-4000-0001-SP SOC-4000/i Scale-On-Chip ASIC Technical Specification August 2002 Document order number: SOC-4000-0001-SP CybraTech 2000 Ltd. SOC-4000/i Scale-On-Chip ASIC


    Original     		SOC-4000/i SOC-4000-0001-SP SOC-4000/i D-64297 8051 program code for the weighing scales 8051 assembly program weighing scales assembly CODE program for weighing scales thermal printer 8051 microcontroller p120 2d motor dc motor interface with 8051 using uln2003 thermistor M53 weighing machine using 8051 WEIGHING SCALE 8051 ULN2003 PIN DIAGRAM configuration PDF

    weighing machine using 8051

    Abstract: WEIGHING SCALE 8051 8051 weighing scale circuit 8051 program code for the weighing scales 8x8 keyboard and microcontroller interfacing PCF8756 digital weighing scales c code program 8x8 DOT MATRIX LED DISPLAY DRIVER 8051 assembly program weighing scales assembly CODE program for weighing scales
    Text: SOC-3000/i Scale-On-Chip ASIC Technical Specification Rev.B1 July 2002 Document order number: SOC-3000-0001-SP  2001 CybraTech 1998 Ltd. All rights reserved. CybraTech (1998) Ltd. reserves the right to alter the equipment specifications and descriptions in this publication


    Original     		SOC-3000/i SOC-3000-0001-SP SOC-3000/i D-64297 weighing machine using 8051 WEIGHING SCALE 8051 8051 weighing scale circuit 8051 program code for the weighing scales 8x8 keyboard and microcontroller interfacing PCF8756 digital weighing scales c code program 8x8 DOT MATRIX LED DISPLAY DRIVER 8051 assembly program weighing scales assembly CODE program for weighing scales PDF