L717HDC62PC309
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L717HDC62POL2C309
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L717HDC62PD1CO4R
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock
L777HRC62P
Amphenol Communications Solutions
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
L777HDC62PD1CH3F
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
