K7D803671B-HC30 Search Results

K7D803671B-HC30 Result Highlights (6)

Part	ECAD Model	Manufacturer	Description	Download	Buy
74HC30FPEL-E		Renesas Electronics Corporation	HD/RD74HC Series
74HC30P-E		Renesas Electronics Corporation	HD/RD74HC Series
74HC30TELL-E		Renesas Electronics Corporation	HD/RD74HC Series
L717SDC37PA4CHC309		Amphenol Communications Solutions	Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=8.08mm (.318in), Row Pitch 2.84mm, 37 Pin, 0.76um (30u\\) Gold, Bright Tin Shell+Grounding Dimples, 3.05mm (.120in) Clear Hole, Ground Tab with Boardlock
L717SDB25PA4CHC309		Amphenol Communications Solutions	Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=8.08mm (.318in), Row Pitch 2.84mm, 25 Pin, 0.76um (30u\\) Gold, Bright Tin Shell+Grounding Dimples, 3.05mm (.120in) Clear Hole, Ground Tab with Boardlock
L717HDE15PD1CHC309		Amphenol Communications Solutions	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 15 Pin, 0.76m (30 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

K7D803671B-HC30 Price and Stock

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Samsung Semiconductor K7D803671B-HC30 256K X 36 DDR SRAM, 0.2 ns, PBGA153
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	K7D803671B-HC30		4			1 $58 10 $55.1 100 $55.1 1000 $55.1 10000 $55.1	Buy Now
	K7D803671B-HC30		1			1 $19.5 10 $19.5 100 $19.5 1000 $19.5 10000 $19.5	Buy Now

K7D803671B-HC30 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Type	PDF
K7D803671B-HC30		Samsung Electronics	256Kx36 & 512Kx18 SRAM		Original	PDF