JS-A-2007H-XX
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 8 9 A A SPECIFICATIONS Voltage rating: Current rating: Contact resistance: Insulation resistance: Withstanding: Operating temperature: PCB thickness: PCB hole diameter: Pitch between poles: Wire Range: Poles: B C 125VAC, 125VDC 2 amps AWG #26
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Original
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PDF
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125VAC,
125VDC
000VAC
JS-A-2007H-XX
JS-A-2007H-XX
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JS-A-2007WV-XX
Abstract: No abstract text available
Text: 1 2 3 4 5 6 A 7 SPECIFICATIONS Voltage rating: Current rating: Contact resistance: Insulation resistance: Withstanding: Operating temperature: PCB thickness: PCB hole diameter: Pitch between poles: Wire range: Poles: B 8 9 A 125VAC, 125VDC 2 amps AWG #26
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Original
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PDF
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125VAC,
125VDC
000VAC
Drawin26~
JS-A-2007WV-XX
JS-A-2007WV-XX
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JS-A-2007WR-XX
Abstract: No abstract text available
Text: 1 2 3 4 5 6 A 7 SPECIFICATIONS Voltage rating: Current rating: Contact resistance: Insulation resistance: Withstanding: Operating temperature: PCB thickness: PCB hole diameter: Pitch between poles: Wire range: Poles: B 8 9 A 125VAC, 125VDC 2 amps AWG #26
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Original
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PDF
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125VAC,
125VDC
000VAC
JS-A-2007WR-XX
JS-A-2007WR-XX
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JS-A-2007-TP
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Voltage rating: Current rating: Contact resistance: Insulation resistance: Withstanding: Operating temperature: PCB thickness: PCB hole diameter: Pitch between poles: Wire range: Poles: D E F Wire Range Insulation O.D.
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Original
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PDF
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125VAC,
125VDC
000VAC
JS-A-2007-TP
JS-A-2007-TP
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNTING •J LEADS o D E L A Y L IN E S lO TAPS*LOW PROFILE PASSIVE SERIES SERIES JSA AND JSB 13 14 15 16 ^XvLLLLLLLL^ 260- -01 8 GND GND | — •“ 5 |— .050 typ. □□□□□□□ .3 65 .475 • ° H h Suggested PC Board Solder Pads Time Delay
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OCR Scan
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PDF
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JSA35
JSB35
JSA40
JSB45
JSB75
JSB100
JSA150
JSA175
JSB175
JSA200
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNTING* J LEADS DELAY LINES lO TAPS*LOW PROFILE PASSIVE SERIES 13 14 15 16 IN 27. 260GND -0 1 8 GND I — | |— .050typ. .365 .475 •°H h Suggested PC Board Solder Pads Time D e lay ns Impedance * 1 0 % Rise Time (ns) Attenuation (db) max 5
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OCR Scan
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PDF
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260GND
050typ.
JSA30
JSA40
JSA50
JSA60
JSA100
JSA150
JSA175
JSA200
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