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    JESD51-2 DDR3 85 Search Results

    JESD51-2 DDR3 85 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    SSTE32882HLBAKG Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation
    SSTE32882HLBAKG8 Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation
    4MX0121VA13AVG Renesas Electronics Corporation Switch / Multiplexer for DDR3 / DDR4 NVDIMM Visit Renesas Electronics Corporation
    4MX0121VA13AVG8 Renesas Electronics Corporation Switch / Multiplexer for DDR3 / DDR4 NVDIMM Visit Renesas Electronics Corporation
    SSTE32882KA1AKG8 Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation
    SSTE32882KA1AKG Renesas Electronics Corporation DDR3 Register + PLL Visit Renesas Electronics Corporation

    JESD51-2 DDR3 85 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    W3J512M40G

    Abstract: M41K256M32
    Text: W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G T -XB3X *PRELIMINARY 2GB – 512M x 32/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G x36/40 W3J512M36K W3J512M32K M41K256M32

    W3J512M32G

    Abstract: M41K256M32
    Text: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:


    Original     		PDF W3J512M32G-XBX W3J512M32G W3J512M36/40G x36/40 M41K256M32

    M41K256M32

    Abstract: No abstract text available
    Text: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:


    Original     		PDF W3J512M32K-XBX W3J512M36K W3J512M36/40K M41K256M32

    MPR 55 F resistor

    Abstract: M41K256M32
    Text: W3J512M32G-XBX W3J512M32/36/40G T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J512M32G-XBX W3J512M32/36/40G MPR 55 F resistor M41K256M32

    M41K256M32

    Abstract: No abstract text available
    Text: W3J512M32K-XBX W3J512M32/36/40K T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J512M32K-XBX W3J512M32/36/40K 8n-b6/40K x32-bit M41K256M32

    tn0008

    Abstract: mobile ddr2 TN-00-08 micron BGA SDRAM
    Text: TN-00-08: Thermal Applications Introduction Technical Note Thermal Applications Introduction This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. The specified temperatures will help ensure the reliability and


    Original     		PDF TN-00-08: 09005aef805ec8a5/S 09005aef805ec8b1 TN0008 mobile ddr2 TN-00-08 micron BGA SDRAM

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M72K-XPBX W3J512M72K-XLBX 1600Mb/s W3J512M72K-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J128M72K-XLBX W3J128M72K-XPBX 1600Mb/s

    w3j128m72

    Abstract: w3j512m72
    Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M72G-XPBX W3J512M72G-XLBX 1600Mb/s w3j128m72 w3j512m72

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M64G-XPBX W3J512M64G-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M64G-XPBX W3J512M64G-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M64K-XPBX W3J512M64K-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 1.5V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1,333, 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J128M72G-XLBX W3J128M72G-XPBX 1600Mb/s

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count • 375 Plastic Ball Grid Array PBGA , 20.5 mm x 21.5 mm


    Original     		PDF W3J128M72G-XLBX W3J128M72G-XPBX AC100 DC100; DDR3-1333 DC100

    Untitled

    Abstract: No abstract text available
    Text: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count


    Original     		PDF W3J128M72K-XLBX W3J128M72K-XPBX 1600Mb/s

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE PMIC N/A 1 2 3 4 5 6 7 8 9 PREPARED BY CHECKED BY APPROVED BY Thomas M. Hess SIZE A REV AMSC N/A 12 TITLE Phu H. Nguyen


    Original     		PDF V62/12602 5962ms/Smcr/. V62/12602-01XE 51116M TPS51116MPWPEP TPS51116MPWPREP

    Untitled

    Abstract: No abstract text available
    Text: W3J128M64K-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm


    Original     		PDF W3J128M64K-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J128M64G-XLBX *ADVANCED 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm


    Original     		PDF W3J128M64G-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J128M64G-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm


    Original     		PDF W3J128M64G-XLBX

    QorIQ P4040 reference manual

    Abstract: TX-6-G QorIQ P4080 reference manual flotherm MODEL e500mc P4080 PME P4040EC Data Path Acceleration Architecture freescale P4040 P4080 PCI-E
    Text: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network


    Original     		PDF P4040EC P4040 QorIQ P4040 reference manual TX-6-G QorIQ P4080 reference manual flotherm MODEL e500mc P4080 PME Data Path Acceleration Architecture freescale P4040 P4080 PCI-E

    Untitled

    Abstract: No abstract text available
    Text: P4040 QorIQ Integrated Processor Hardware Specifications Datasheet - Preliminary The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high performance data path acceleration logic and network and peripheral bus interfaces required for power intensive


    Original     		PDF P4040 P4040 e500-mc

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network


    Original     		PDF P4040 P4040EC

    freescale p2040

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: P2040EC Rev. 2, 02/2013 P2040 P2040 QorIQ Integrated Processor Hardware Specifications The P2040 QorIQ integrated communication processor combines four Power Architecture processor cores with


    Original     		PDF P2040EC P2040 P2040 freescale p2040

    QorIQ P4080 reference manual

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: P4080EC Rev. 4, 04/2013 P4080/P4081 QorIQ Integrated Processor Hardware Specifications The P4080/P4081 QorIQ integrated communication processor combines eight Power Architecture processor


    Original     		PDF P4080EC P4080/P4081 QorIQ P4080 reference manual