W3J512M40G
Abstract: M41K256M32
Text: W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G T -XB3X *PRELIMINARY 2GB – 512M x 32/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 74% Space savings vs. FBGA Packages: Reduced part count
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W3J512M32G-XBX
W3J512M32GT-XB2X
W3J512M40G
x36/40
W3J512M36K
W3J512M32K
M41K256M32
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W3J512M32G
Abstract: M41K256M32
Text: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 74% Space savings vs. FBGA Packages:
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W3J512M32G-XBX
W3J512M32G
W3J512M36/40G
x36/40
M41K256M32
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M41K256M32
Abstract: No abstract text available
Text: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 74% Space savings vs. FBGA Packages:
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W3J512M32K-XBX
W3J512M36K
W3J512M36/40K
M41K256M32
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MPR 55 F resistor
Abstract: M41K256M32
Text: W3J512M32G-XBX W3J512M32/36/40G T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 74% Space savings vs. FBGA Packages: Reduced part count
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W3J512M32G-XBX
W3J512M32/36/40G
MPR 55 F resistor
M41K256M32
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PDF
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M41K256M32
Abstract: No abstract text available
Text: W3J512M32K-XBX W3J512M32/36/40K T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 74% Space savings vs. FBGA Packages: Reduced part count
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W3J512M32K-XBX
W3J512M32/36/40K
8n-b6/40K
x32-bit
M41K256M32
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tn0008
Abstract: mobile ddr2 TN-00-08 micron BGA SDRAM
Text: TN-00-08: Thermal Applications Introduction Technical Note Thermal Applications Introduction This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. The specified temperatures will help ensure the reliability and
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TN-00-08:
09005aef805ec8a5/S
09005aef805ec8b1
TN0008
mobile ddr2
TN-00-08
micron BGA SDRAM
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Untitled
Abstract: No abstract text available
Text: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s Differential clock terminations included
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W3J512M72K-XPBX
W3J512M72K-XLBX
1600Mb/s
W3J512M72K-XLBX
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Untitled
Abstract: No abstract text available
Text: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s 35%* Space savings vs. FBGA Packages: Reduced part count
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W3J128M72K-XLBX
W3J128M72K-XPBX
1600Mb/s
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w3j128m72
Abstract: w3j512m72
Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s Differential clock terminations included
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W3J512M72G-XPBX
W3J512M72G-XLBX
1600Mb/s
w3j128m72
w3j512m72
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Untitled
Abstract: No abstract text available
Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s Differential clock terminations included
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W3J512M64G-XPBX
W3J512M64G-XLBX
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Untitled
Abstract: No abstract text available
Text: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s Differential clock terminations included
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W3J512M64G-XPBX
W3J512M64G-XLBX
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Untitled
Abstract: No abstract text available
Text: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES Address/control terminations included DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s Differential clock terminations included
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W3J512M64K-XPBX
W3J512M64K-XLBX
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Untitled
Abstract: No abstract text available
Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 1.5V – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1,333, 1,600* Mb/s 35%* Space savings vs. FBGA Packages: Reduced part count
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W3J128M72G-XLBX
W3J128M72G-XPBX
1600Mb/s
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PDF
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Untitled
Abstract: No abstract text available
Text: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333 Mb/s 35%* Space savings vs. FBGA Packages: Reduced part count • 375 Plastic Ball Grid Array PBGA , 20.5 mm x 21.5 mm
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W3J128M72G-XLBX
W3J128M72G-XPBX
AC100
DC100;
DDR3-1333
DC100
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Untitled
Abstract: No abstract text available
Text: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s 35%* Space savings vs. FBGA Packages: Reduced part count
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W3J128M72K-XLBX
W3J128M72K-XPBX
1600Mb/s
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE PMIC N/A 1 2 3 4 5 6 7 8 9 PREPARED BY CHECKED BY APPROVED BY Thomas M. Hess SIZE A REV AMSC N/A 12 TITLE Phu H. Nguyen
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V62/12602
5962ms/Smcr/.
V62/12602-01XE
51116M
TPS51116MPWPEP
TPS51116MPWPREP
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Untitled
Abstract: No abstract text available
Text: W3J128M64K-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s 31%* Space savings vs. FBGA Package: Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm
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Untitled
Abstract: No abstract text available
Text: W3J128M64G-XLBX *ADVANCED 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s 31%* Space savings vs. FBGA Package: Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm
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Untitled
Abstract: No abstract text available
Text: W3J128M64G-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s 31%* Space savings vs. FBGA Package: Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm
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QorIQ P4040 reference manual
Abstract: TX-6-G QorIQ P4080 reference manual flotherm MODEL e500mc P4080 PME P4040EC Data Path Acceleration Architecture freescale P4040 P4080 PCI-E
Text: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network
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P4040EC
P4040
QorIQ P4040 reference manual
TX-6-G
QorIQ P4080 reference manual
flotherm MODEL
e500mc
P4080 PME
Data Path Acceleration Architecture
freescale P4040
P4080 PCI-E
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Untitled
Abstract: No abstract text available
Text: P4040 QorIQ Integrated Processor Hardware Specifications Datasheet - Preliminary The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high performance data path acceleration logic and network and peripheral bus interfaces required for power intensive
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P4040
P4040
e500-mc
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network
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P4040
P4040EC
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freescale p2040
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: P2040EC Rev. 2, 02/2013 P2040 P2040 QorIQ Integrated Processor Hardware Specifications The P2040 QorIQ integrated communication processor combines four Power Architecture processor cores with
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P2040EC
P2040
P2040
freescale p2040
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QorIQ P4080 reference manual
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: P4080EC Rev. 4, 04/2013 P4080/P4081 QorIQ Integrated Processor Hardware Specifications The P4080/P4081 QorIQ integrated communication processor combines eight Power Architecture processor
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P4080EC
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QorIQ P4080 reference manual
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