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    JEDEC TSSOP 28 LEAD PACKAGE Search Results

    JEDEC TSSOP 28 LEAD PACKAGE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    JEDEC TSSOP 28 LEAD PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MO-153-AE

    Abstract: RU-28 MO-153AE JEDEC TSSOP 28 LEAD PACKAGE
    Text: a 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.65 BSC 0.15 0.05 COPLANARITY 0.10 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 COMPLIANT TO JEDEC STANDARDS MO-153AE


    Original     		PDF 28-Lead RU-28) MO-153AE MO-153-AE RU-28 MO-153AE JEDEC TSSOP 28 LEAD PACKAGE

    MO-153

    Abstract: JEDEC MO-153 MO-153-AE JEDEC TSSOP 28 LEAD PACKAGE coplanarity RU-28
    Text: 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters a 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.15 0.05 COPLANARITY 0.10 0.65 BSC 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AE


    Original     		PDF 28-Lead RU-28) MO-153-AE MO-153 JEDEC MO-153 MO-153-AE JEDEC TSSOP 28 LEAD PACKAGE coplanarity RU-28

    Untitled

    Abstract: No abstract text available
    Text: Package Information Vishay Siliconix TSSOP: 8-LEAD POWER IC ONLY JEDEC Part Number: MO-153 R 0.10 Corners) e A1 A A2 D 0.25 (Gage Plane) E1 MILLIMETERS E C B Document Number: 72803 28-Jan-04 L R 0.10 (4 Corners) L1 oK1 Dim A A1 A2 B C D E E1 e L L1 Y oK1


    Original     		PDF MO-153 28-Jan-04 S-40079--Rev. 02-Feb-04

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)


    Original     		PDF DS571J

    MO-153

    Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
    Text: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research


    Original     		PDF

    JEDEC MO-153

    Abstract: 78 mo 5 MO-153 tip55 JEDEC MO-187
    Text: LEADFRAME data sheet TSSOP/MSOP Features Thin Shrink Small Outline Package, Micro Small Outline Package TSSOP/MSOP : TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.


    Original     		PDF DS351) MO-153 MO-194 JEDEC MO-153 78 mo 5 tip55 JEDEC MO-187

    MO-153

    Abstract: JEDEC MO-153 38 MO-187 MO-194
    Text: LEADFRAME data sheet ExposedPad TSSOP Features: ExposedPad TSSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages. The ExposedPad TSSOP can increase heat dissipation


    Original     		PDF

    JEDEC MO-153

    Abstract: MO-153 JEDEC MO-153 38
    Text: PACKAGE OUTLINES PLASTIC THIN, SHRINK SMALL OUTLINE PACKAGE TSSOP 4.4 mm width, 38 leads Package Designator LD 9.8 9.6 38 .386 .378 8º 0º A B 0.20 .008 0.09 .004 Preliminary dimensions, for reference only Dimensions in millimeters U.S. Customary dimensions (in.) in brackets, for reference only


    Original     		PDF MO-153 JEDEC MO-153 JEDEC MO-153 38

    JEDEC MO-187

    Abstract: JEDEC MO-153
    Text: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic


    Original     		PDF DS350N JEDEC MO-187 JEDEC MO-153

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    SOT23W-3

    Abstract: MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW PUB26013 transistor crossreference DUAL ROW QFN leadframe MS-018AC
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW transistor crossreference DUAL ROW QFN leadframe MS-018AC

    SOT23W-3

    Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW

    93c46ln

    Abstract: 93s46 eprom marking codes fairchild 24U02 93S46 eeprom FAIRCHILD SEMICONDUCTOR PRODUCT MARKING CODES F46L 24C02 code example assembly 93S46 24C02LN
    Text: Non-Volatile Memory - EEPROM Physical Dimensions Contents Tape and Reel . 2 Part Marking . 3 Package Outlines M08A .


    Original     		PDF MTC08 VBH48A VEH64A 93c46ln 93s46 eprom marking codes fairchild 24U02 93S46 eeprom FAIRCHILD SEMICONDUCTOR PRODUCT MARKING CODES F46L 24C02 code example assembly 93S46 24C02LN

    SNJ54HC365

    Abstract: 5962-86812012A 5962-8681201EA 5962-86828012A 5962-8682801EA 8500101EA 8500201EA SN54HC365J Level-1-260C-UNLIM
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8681201EA ACTIVE CDIP J 16 1 TBD


    Original     		PDF 26-Sep-2005 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5962-86828plifiers SNJ54HC365 5962-86812012A 5962-8681201EA 5962-86828012A 5962-8682801EA 8500101EA 8500201EA SN54HC365J Level-1-260C-UNLIM

    CD4067BE

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003 The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR


    Original     		PDF SCHS052B CD4067B CD4097B 24-lead 9-Oct-2007 CD4067BE CD4067BEE4

    Ablebond 8390

    Abstract: ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG/03/380 DSG-DISCRETES & STANDARD IC s- LEADFREE PLATING FOR SOP, TSSOP, SSOP, QSOP PACKAGES. 2003/11/28 PCN DSG/03/380 Product Family /Commercial Product All products in SOP, TSSOP, SSOP, QSOP PACKAGES. Type Of Change


    Original     		PDF DSG/03/380 24-Feb-2004 28-Nov-2003 Ablebond 8390 ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type


    Original     		PDF 29-Jun-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1 TBD


    Original     		PDF 6-Feb-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1


    Original     		PDF 12-Jan-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type


    Original     		PDF 18-Jul-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type


    Original     		PDF 6-Dec-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1 TBD


    Original     		PDF 6-Feb-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365

    SNJ54HC365

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type


    Original     		PDF 6-Dec-2006 962-86812012A 5962-8681201EA 962-86828012A 5962-8682801EA 5001012A SNJ54HC365