240-pin
Abstract: LA-3522A-1
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.
|
Original
|
PDF
|
LA-3522A-1
P240GN-50-LMU,
240-pin
|
NEC 2701
Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.
|
Original
|
PDF
|
LA-3519A-1
LA-0519A-1
S144GJ-50-3EN-3
SC-596-A*
NEC 2701
144 pin qfp
2701 NEC
B108
JEDEC tray dimension
NEC 596
S144GJ-50-3EN-3
|
QFP40
Abstract: P304GL-50-NMU JEDEC TRAY mQFP
Text: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
|
Original
|
PDF
|
LA-A41A
SC-601-C*
P304GL-50-NMU,
QFP40
P304GL-50-NMU
JEDEC TRAY mQFP
|
Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of
|
Original
|
PDF
|
LA-3508A-1
S256GD-40-LMV,
|
2701 NEC
Abstract: nec 2701
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
S80GF-80-3B9-4
2701 NEC
nec 2701
|
NEC 2701
Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
P80GF-80-3B9-4
SC-581-A
NEC 2701
2701 NEC
JEDEC tray dimension
SC-581-A
LA-044A-1
r-2524
|
3eb data
Abstract: S120GJ-50-3EB-2
Text: Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm Mounting Pad 120 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 90 61 91 60 Q R D C S detail of lead end 31 F 120 1 30 G H I M J M P K N L NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of
|
Original
|
PDF
|
LA-3519A-1
LA-0519A-1
SC-596-A*
S120GJ-50-3EB-2
3eb data
S120GJ-50-3EB-2
|
P120GD-80-LBB
Abstract: No abstract text available
Text: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
|
Original
|
PDF
|
LA-3508A-1
OT-001T-01
P120GD-80-LBB,
P120GD-80-LBB
|
LA-0518A-1
Abstract: S160GM-50-JMD
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 detail of lead end C D S Q 160 1 F G R 41 40 H I M J K P M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
|
Original
|
PDF
|
LA-3529A-1
LA-0518A-1
S160GM-50-JMD,
S160GM-50-JMD
|
LA-0518A-1
Abstract: TRAY JEDEC
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 176 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C S D Q 176 1 R 45 44 F G H I J M K M P N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
|
Original
|
PDF
|
LA-3529A-1
LA-0518A-1
S176GM-50-3EU,
TRAY JEDEC
|
Untitled
Abstract: No abstract text available
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 JEDEC Tray MQFP 14x20 2.7mm LA-044A-1 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S Q R 31 30 100 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.15 mm (0.006 inch) of
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
S100GF-65-3BA-3
|
nec 2701
Abstract: JEDEC tray dimension 2701 NEC LA-0518A-1 QFP JEDEC tray
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 S C D R Q 41 40 160 1 F G H I J M P K S N S L NOTE ITEM 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm (0.004 inch) of
|
Original
|
PDF
|
LA-3529A-1
LA-0518A-1
S160GM-50-3ED,
nec 2701
JEDEC tray dimension
2701 NEC
QFP JEDEC tray
|
S100GF-65-JBT-1
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 detail of lead end C S D R Q 31 30 100 1 F G H I M J K P M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
S100GF-65-JBT-1
S100GF-65-JBT-1
|
NEC 2701
Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
SC-582-A
P64GF-100-3B8,
P64GF-100-3B8
NEC 2701
NEC D 582
2701 NEC
LA-1244A-1
transistor NEC D 582
QFP JEDEC tray
1802M
|
|
|
S64GF
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
|
Original
|
PDF
|
LA-2244A-1
LA-1244A-1
LA-044A-1
039ch)
S64GF-100-3B8,
S64GF
|
JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
|
Original
|
PDF
|
MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
|
MO-112
Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,
|
Original
|
PDF
|
|
MO-112
Abstract: MS-029 MATRIX TRAY MS-022 LD240
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced
|
Original
|
PDF
|
|
lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
|
Original
|
PDF
|
MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
|
LD 337
Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material
|
Original
|
PDF
|
|
outline of the heat slug for JEDEC
Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
|
Original
|
PDF
|
MS-029/022
outline of the heat slug for JEDEC
heat slug for JEDEC
JEDEC Matrix Tray outlines
MS-029
QFP JEDEC tray
amkor exposed pad
245C
amkor
|
MS-026
Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is
|
Original
|
PDF
|
|
MS-029
Abstract: 144 QFP body size amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
|
Original
|
PDF
|
out029
MS-029/022
MS-029
144 QFP body size
amkor
|
MS-029
Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through
|
Original
|
PDF
|
|
