HT 1200-4
Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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March/98
intern844-347360
HT 1200-4
IC51-2084-1052-11
IC51-0242-1341
YAMAICHI ic234
transistor fpq 630
IC51-0404-1511
fpq-144-0.5-03
648-0482211-A01
IC189 Series Open Top SOP, SSOP, TSOP Type I a
HLQFP 176 Package drawing
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E94661
Abstract: GBPC35 GBPC3506
Text: SPICE MODEL: GBPC3506 GBPC35005/W - GBPC3510/W 35A GLASS PASSIVATED BRIDGE RECTIFIER Features • · · · · · · · Glass Passivated Die Construction · Lead Free Finish, RoHS Compliant Note 4 GBPC Diffused Junction H Low Reverse Leakage Current B Low Power Loss, High Efficiency
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GBPC3506
GBPC35005/W
GBPC3510/W
HPC35005/W
GBPC35005
100/Tray
GBPC3501
GBPC3502
E94661
GBPC35
GBPC3506
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thick bga tray size
Abstract: K179 PEAK TRAY bga K180 PEAK tray drawing TRAY JEDEC BGA DRAWING Datum Electronics type 121 HASL summit
Text: Application Specification 114- 13101 STEP- Z* Printed Circuit PC Board Connectors NOTE i 12 AUG 09 Rev H All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
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MQFP 28x28
Abstract: No abstract text available
Text: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS
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OCR Scan
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5M-1994.
1X1012
28X28
28X28
MQFP 28x28
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BGA Solder Ball 0.35mm collapse
Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table
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TB-2241
S1647
S1884
BGA Solder Ball 0.35mm collapse
TB-2241
reballing
circular thermocouple connector
JEDEC tray standard dimension
tb224
BGA Solder Ball 0.35mm
BGA PROFILING
SAC305 solder paste
SAC305 reflow 13mm
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tray lqfp
Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional
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32-bit
tray lqfp
JEDEC qfn tray
QFn Package tray
JEDEC TRAY DIMENSIONS QFN
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TB-2082
Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02
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TB-2082
28mil
TB-2082
TB208
470-2075-100
reballing
programming smt machine
470-1075-100
470-3105-100
programming for smt machine
C-471-1025-500
Amphenol MIL CIRCULAR CONNECTORS
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E323964
Abstract: JEDEC TRAY 10 X 10
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
23-NOV-07
11-DEC-06
29-MAR-04
05-FEB-99
E323964
JEDEC TRAY 10 X 10
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E323964
Abstract: 613218
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS A MATERIAL INSULATOR: PBT COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
23-NOV-07
19-DEC-06
30-MAR-04
10-MAR-04
11-JUN-02
E323964
06-Feb-2012
613218
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JEDEC tray standard dimension
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
E323964
612-212-R
15-MAR-
612-R
JEDEC tray standard dimension
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DD306
Abstract: PEAK TRAY
Text: DD300/S – DD306/S WTE POWER SEMICONDUCTORS 30A 8.4mm/9.5mm DISH DIODE Features ! Glass Passivated Die Construction ! ! ! ! ! Low Leakage Low Cost High Surge Current Capability Low Forward C-Band Terminal Construction C D Mechanical Data B ! ! ! ! ! Case: All Copper Case and Components
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DD300/S
DD306/S
DD302R
DD304SR)
DD306
PEAK TRAY
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1-1735438-2
Abstract: DDR3 DIMM 6-1773454-7 PEAK TRAY 2-2013289-1 2013289-1 1735438-2 1735438-4 2-2013289 2-2013287-2 2-2013287-3
Text: DDR3 DIMM Sockets The Tyco Electronics’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to
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3-201e
1-1735438-2
DDR3 DIMM
6-1773454-7
PEAK TRAY
2-2013289-1 2013289-1
1735438-2
1735438-4
2-2013289
2-2013287-2
2-2013287-3
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2013310-2
Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Text: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to
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0853.12
Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
Text: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use
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com/pg02b
W/10A
500VAC/DC
E39328
0853.12
J-STD-020-C
JEDEC J-STD-020c
J-STD-020C
TRAY JEDEC j-std-033c
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BD5002R
Abstract: BD5003 BD5004 BD5005 BD5006 BD5000 BD5001 BD5002
Text: BD5000 – BD5006 WTE POWER SEMICONDUCTORS 50A BOSCH TYPE PRESS-FIT DIODE Features ! Diffused Junction ! Low Leakage ! Low Cost ! High Surge Current Capability ! Typical IR less than 10µA
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BD5000
BD5006
BD5002R
BD5004R)
BD5003
BD5004
BD5005
BD5006
BD5000
BD5001
BD5002
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PFW3500
Abstract: PFW3501 PFW3502 PFW3504 PFW3506 PFW3508 PFW3510 ic shipping tray jedec tray
Text: PFW3500 – PFW3510 W TE PO WE R SEM IC O ND U C TO RS 35A 1/2" FLAG LEAD PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA J D Mechanical Data ! ! ! ! ! H Case: All Copper Case and Components
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PFW3500
PFW3510
PFW3502R
PFW3510R)
DO-21
10accuracies.
PFW3500
PFW3501
PFW3502
PFW3504
PFW3506
PFW3508
PFW3510
ic shipping tray
jedec tray
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PF5004
Abstract: PF5001 PF5000 PF5002 PF5006 PF5008 PF5010 JEDEC TRAY DIMENSIONS
Text: PF5000 – PF5010 W TE PO WE R SEM IC O ND U C TO RS 50A 1/2" PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA A DO-21 Dim Min Max A 15.63 16.14 B 12.75 12.83 C 8.89 10.04 D
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PF5000
PF5010
DO-21
PF5002R
PF5010R)
PF5004
PF5001
PF5000
PF5002
PF5006
PF5008
PF5010
JEDEC TRAY DIMENSIONS
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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EAI-481
Abstract: AUH005A0D-SJZ TYCO converter marking code date AUH005A0F-SJZ AUM005A0Y-SRZ Titania Power Modules 500LFM PEAK tray drawing CC109101697
Text: Data Sheet March 20, 2006 Titania TM Power Modules Austin Series SMT Non-Isolated dc-dc Power Modules: 3.0 Vdc - 5.5 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 6 A Features RoHS Compliant Q Compatible with RoHS EU Directive 200295/EC -Z versions Q Compatible with RoHS EU Directive 200295/EC with lead
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200295/EC
200295/EC
FDS01-064EPS
EAI-481
AUH005A0D-SJZ
TYCO converter marking code date
AUH005A0F-SJZ
AUM005A0Y-SRZ
Titania Power Modules
500LFM
PEAK tray drawing
CC109101697
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EAI-481
Abstract: kester Sn62Pb36Ag02 108505710 108468356 lucent titania lucent DC-DC POWER MODULE
Text: Data Sheet August 2000 Titania Power Modules Austin Series Non-Isolated SMT DC-DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc to 3.3 Vdc Output, 6A Features • • • • • • The Austin Power Module Series provides precise voltage and fast transient response in
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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IC179-28375-301
Abstract: IC179 SOP JEDEC tray
Text: SOP SMT IC179 SERIES ORDERING INFORMATION IC179- * * - 31 * * Socket Series No. of Contacts Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Row Spacing Mil Materials and Finish
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IC179
IC179-
10mA/20mV
Thermoplastic-UL94V-0
IC179-28375-301
SOP JEDEC tray
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