TSSOP 8PIN MARK 21
Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP
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SC-82AB
SC-88A
OT-23-3
OT-23-5
OT-23-6
OT-89-3
OT-89-5
14-Pin
10-Pin
16-Pin
TSSOP 8PIN MARK 21
land pattern for TSsOP 16
6pin
land pattern for TSsOP 8
2952 8pin
HA005-A-P
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MO178AB
Abstract: MO-178-AB BSC -23-01n15 MO-178AB
Text: a 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 Dimensions shown in millimeters 2.90 BSC 6 5 4 2.80 BSC 1.60 BSC 1 2 3 PIN 1 0.95 BSC 1.30 1.15 0.90 1.90 BSC 1.45 MAX 0.15 MAX 0.50 0.30 SEATING PLANE 0.22 0.08 10؇ 4؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178AB
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OT-23]
MO-178AB
MO178AB
MO-178-AB
BSC -23-01n15
MO-178AB
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MO-178-AB
Abstract: MO-178AB MO178AB BSC -23-01n15
Text: a 6-Lead Small Outline Transistor Package [SOT-23] RT-6 Dimensions shown in millimeters 2.90 BSC 6 5 4 2.80 BSC 1.60 BSC 1 2 3 PIN 1 0.95 BSC 1.30 1.15 0.90 1.90 BSC 1.45 MAX 0.15 MAX 0.50 0.30 SEATING PLANE 0.22 0.08 10؇ 4؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178AB
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OT-23]
MO-178AB
MO-178-AB
MO-178AB
MO178AB
BSC -23-01n15
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MO-178-AB
Abstract: MO178AB
Text: a 6-Lead Plastic Surface Mount Package [SOT-23] RT-6 Dimensions shown in millimeters 2.90 BSC 6 5 4 1 2 3 2.80 BSC 1.60 BSC PIN 1 0.95 BSC 1.30 1.15 0.90 1.90 BSC 1.45 MAX 0.15 MAX 0.50 0.30 SEATING PLANE 0.22 0.08 10؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178AB
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OT-23]
MO-178AB
MO-178-AB
MO178AB
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Untitled
Abstract: No abstract text available
Text: a 6-Lead Plastic Surface-Mount Package [SOT-23] RT-6 Dimensions shown in millimeters 2.90 BSC 6 5 4 1 2 3 2.80 BSC 1.60 BSC PIN 1 0.95 BSC 1.30 1.15 0.90 1.90 BSC 1.45 MAX 0.15 MAX 0.50 0.30 SEATING PLANE 0.22 0.08 10؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178AB
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OT-23]
MO-178AB
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BSC -23-01n15
Abstract: MO-178BA package sot-23
Text: a 8-Lead Plastic Surface-Mount Package [SOT-23] RT-8 Dimensions shown in millimeters 2.90 BSC 8 7 6 5 1 2 3 4 2.80 BSC 1.60 BSC PIN 1 0.65 BSC 1.30 1.15 0.90 1.95 BSC 1.45 MAX 0.15 MAX 0.38 0.22 SEATING PLANE 0.22 0.08 10؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178BA
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OT-23]
MO-178BA
BSC -23-01n15
MO-178BA
package sot-23
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MO-178-BA
Abstract: MO-178BA BSC -23-01n15 transistor
Text: a 8-Lead Small Outline Transistor Package [SOT-23] RT-8 Dimensions shown in millimeters 2.90 BSC 8 7 6 5 1 2 3 4 2.80 BSC 1.60 BSC PIN 1 0.65 BSC 1.30 1.15 0.90 1.95 BSC 1.45 MAX 0.15 MAX 0.38 0.22 SEATING PLANE 0.22 0.08 10؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178BA
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OT-23]
MO-178BA
MO-178-BA
MO-178BA
BSC -23-01n15
transistor
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MO-178BA
Abstract: MO-178-BA BSC -23-01n15
Text: a 8-Lead Small Outline Transistor Package [SOT-23] RJ-8 Dimensions shown in millimeters 2.90 BSC 8 7 6 5 1 2 3 4 2.80 BSC 1.60 BSC PIN 1 0.65 BSC 1.30 1.15 0.90 1.95 BSC 1.45 MAX 0.15 MAX 0.38 0.22 SEATING PLANE 0.22 0.08 8؇ 4؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-178BA
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OT-23]
MO-178BA
MO-178BA
MO-178-BA
BSC -23-01n15
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STMicroelectronics smd marking code
Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved
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CRP/04/744
2002/95/EC)
STMicroelectronics smd marking code
BGA and QFP Package 14x14
STMICROELECTRONICS MSL
STMicroelectronics date code tssop-14
HiQuad package
STMicroelectronics pentawatt date code
opto mold compound
infineon msl
TQFP 14X20
ST TSSOP Marking
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SO14W
Abstract: siemens rotating diode assembly SO32W 301 miniature smd transistor plcc-44 smd paper phenolic PCB SO24W 20L SMD SOT-23 TSOP infrared
Text: Issued March 1997 232-5569 Data Pack H An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering
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AN-450 surface mounting methods
Abstract: PLCC20 SO16W SO20W SO24W SO28W VSO40 VSO56 SMD ic catalogue Packaging trends
Text: Issued July 1995 020-420 Data Pack H An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering
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SO14W
Abstract: siemens rotating diode assembly SO24W MELF 0207 PLCC20 SO16W SO20W SO28W VSO40 VSO56
Text: Data Pack H Issued November 2005 1502325569 An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering
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flux F-SW32
Abstract: smd glue machine paper phenolic PCB SOT192 Appnote38 JEDEC to 243 Siemens Semiconductor Manual, Discrete
Text: Surface Mounting Appnote 38 1. What is Surface Mounting? In conventional board assembly technology the component leads are inserted into holes through the PC board and connected to the solder pads by wave soldering on the reverse side through-hole assembly . In hybrid circuits (thick and thin
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mark 642 sot 363
Abstract: mark 642 sot 6 EN6100-4 SC-75 mark tw sot323 mark us sot-563
Text: ESDA6V1-5P6 5-Line TVS Array Power Dissipation 150m Watts Reverse Working Voltage 6.1 VOLTS P b Lead Pb -Free Features: * Monolithic Structure * Low Clamping Voltage * IEC Compatibility(EN6100-4) 61000-4-2(ESD): Air–15kV, Contact-8kV * MIL STD 883E-Method 3015-7: class 3
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EN6100-4)
883E-Method
OT-563
OT-563
02-Apr-09
150mm
200mm
200mm
mark 642 sot 363
mark 642 sot 6
EN6100-4
SC-75
mark tw sot323
mark us sot-563
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JESD22A121
Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were
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SZZA051B
JESD22A121
IC SEM 2005
SZZA051B
chopin
JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al
JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes
SZZA031
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POD-SOT23
Abstract: MO-178 sot 23- POD
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ−01 ISSUE O D e E1 E DATE 19 DEC 2008 SYMBOL MIN NOM A 0.90 A1 0.00 A2 0.90 b 0.30 0.50 c 0.08 0.22 1.45 0.15 1.15 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 BSC L 0.45 0.30 0.60 0.60 REF
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OT-23,
527AJ-01
MO-178.
98AON34321E
527AJ
POD-SOT23
MO-178
sot 23- POD
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STMicroelectronics smd marking code
Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product
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MLD-MIC/05/943
MLD-MIC/05/943
STMicroelectronics smd marking code
smd marking code stmicroelectronics
BGA bga 10x13
BGA 15X15
BGA 23X23
HEPTAWATT SMD
Marking STMicroelectronics tqfp
INFINEON package tqfp PART MARKING
PLCC Part Marking STMicroelectronics
Date Code Marking STMicroelectronics PACKAGE DPAK
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Untitled
Abstract: No abstract text available
Text: US1881 CMOS Multi-purpose latch Features and Benefits • • • • • Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost
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US1881
ISO14001
Feb/04
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Untitled
Abstract: No abstract text available
Text: DATA SHEET PD16-73LF: Two-Way 0° Power Splitter Combiner 1.42–1.66 GHz Features Low cost Low profile ● Available in small SOT-6 lead package ● Available on tape and reel ● Footprint consistent with other parts in the “PD” series ● Available lead Pb -free and RoHS-compliant MSL-1 @ 260 °C
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PD16-73LF:
J-STD-020
PD16-73LF
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CAT5120TBI-10-T
Abstract: CAT5120 CAT5121 CAT5122 MO-203 ARRAY resistor 5pin CAT5122TBI-00-T3 digital potentiometer
Text: CAT5120, CAT5121, CAT5122 16-Tap MiniPott Digitally Programmable Potentiometers with 2-Wire Interface http://onsemi.com Description CAT5120/5121/5122 linear−taper digitally programmable potentiometers perform the same function as a mechanical potentiometer or a variable resistor. These devices consist of a fixed
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CAT5120,
CAT5121,
CAT5122
16-Tap
CAT5120/5121/5122
CAT5120
CAT5121
CAT5122
SC-70
CAT5120TBI-10-T
MO-203
ARRAY resistor 5pin
CAT5122TBI-00-T3
digital potentiometer
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YW 431
Abstract: sot-23 MARKING CODE 431 MAX809 68HC11 MAX809J MAX809L MAX810 code marking MAX809R
Text: MAX809, MAX810 3-Pin Microprocessor Reset Monitors The MAX809 and MAX810 are cost–effective system supervisor circuits designed to monitor VCC in digital systems and provide a reset signal to the host processor when necessary. No external components are required.
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MAX809,
MAX810
MAX809
MAX810
140msec
MAX809/810
YW 431
sot-23 MARKING CODE 431
68HC11
MAX809J
MAX809L
code marking MAX809R
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hall effect sensor 013
Abstract: hall effect sensor ic 013
Text: US3881 CMOS Low Voltage Hall Effect Latch Features and Benefits • • • • • Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 2.2V CMOS for optimum stability, quality and cost
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US3881
US3881
ISO14001
Feb/04
hall effect sensor 013
hall effect sensor ic 013
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On semiconductor date Code sot-143
Abstract: 846AB SOT23 A1 TSSOP-8 footprint and soldering sot-23 d056 sot23 8X SOT23-5 318 SOT23 marking L2 sot23 MARKING CODE SOT23-5 HE marking L2 SOT23 6
Text: PACDN042 Transient Voltage Suppressors and ESD Protectors Product Description The PACDN042/43/44/45/46 family of transient voltage suppressor arrays provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge ESD .
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PACDN042
PACDN042/43/44/45/46
MIL-STD-883D
OT23-3
OT23-5
PACDN042/D
On semiconductor date Code sot-143
846AB
SOT23 A1
TSSOP-8 footprint and soldering sot-23
d056 sot23
8X SOT23-5
318 SOT23
marking L2 sot23
MARKING CODE SOT23-5 HE
marking L2 SOT23 6
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Untitled
Abstract: No abstract text available
Text: CAT5120, CAT5121, CAT5122 16-Tap Digitally Programmable Potentiometers with 2-Wire Interface http://onsemi.com Description CAT5120/5121/5122 linear−taper digitally programmable potentiometers perform the same function as a mechanical potentiometer or a variable resistor. These devices consist of a fixed
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CAT5120,
CAT5121,
CAT5122
16-Tap
CAT5120/5121/5122
CAT5120
CAT5121
CAT5122
CAT5120/D
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