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    JEDEC QFN Search Results

    JEDEC QFN Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    LTC3210EUD#TRPBF Analog Devices MAIN/CAM LED Cntr in 3 × 3 QFN Visit Analog Devices Buy
    HMC695LP4 Analog Devices 24 Id QFN (4x4mm w/2.8mm ep) Visit Analog Devices Buy
    HMC695LP4TR Analog Devices 24 Id QFN (4x4mm w/2.8mm ep) Visit Analog Devices Buy
    LTC3210EUD#PBF Analog Devices MAIN/CAM LED Cntr in 3 × 3 QFN Visit Analog Devices Buy

    JEDEC QFN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ht 13003

    Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
    Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature


    Original     		PDF com/products/18012 com/products/18003 com/products/18013 350000-HT com/products/18005 com/products/18013RC 35W000 com/products/18007 com/products/18014 35W000-11-RC ht 13003 LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196

    glass

    Abstract: No abstract text available
    Text: 80D0 Glass seal 80pin QFN EIAJ Package Code – JEDEC Code – 21.0±0.2 Weight g 18.4±0.15 3.32MAX 0.8TYP 1.78TYP 0.6TYP 41 64 65 INDEX 0.5TYP 0.8TYP 12.0±0.15 1.2TYP 15.6±0.2 0.8TYP 40 25 80 24 1.2TYP 1


    Original     		PDF 80pin 32MAX 78TYP glass

    Technical Brief TB389

    Abstract: MO-220VJJC TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L28.6x6 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VJJC -30mm TB389. Technical Brief TB389 TB389

    MO-220-VJJD-2

    Abstract: TB389 tip 410
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VJJD-2 TB389. MO-220-VJJD-2 TB389 tip 410

    MO-220-VGGC

    Abstract: MO-220 TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.4x4 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220-VGGC TB389. MO-220 TB389

    jedec package MO-220 vggc

    Abstract: MO-220-VGGC 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L12.4x4 12 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220-VGGC TB389. jedec package MO-220 vggc 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389

    10N20

    Abstract: 015mm TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VJJB -30mm TB389. 10N20 015mm TB389

    land pattern for QFN 7x7

    Abstract: MO-220-VKKD-2 qfn 7x7 jedec
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L48.7x7 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VKKD-2 TB389. land pattern for QFN 7x7 MO-220-VKKD-2 qfn 7x7 jedec

    MO-220-VGGD-2

    Abstract: TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VGGD-2 TB389. MO-220-VGGD-2 TB389

    MO-220vggd-1

    Abstract: TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.4x4 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-1 ISSUE I) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VGGD-1 TB389. TB389

    MO-220-VGGD-2

    Abstract: TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4B 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VGGD-2 P30mm TB389. MO-220-VGGD-2 TB389

    TB389

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6B 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VJJB -30mm TB389. TB389

    jedec do 35

    Abstract: QFN weight JEDEC Code
    Text: 100D0 Glass seal 100pin QFN EIAJ Package Code – JEDEC Code – Weight g 18.85±0.15 5.0MAX 21.0±0.13 3.5TYP 0.65TYP 0.45TYP 51 80 81 INDEX 0.35TYP 0.65TYP 12.35±0.15 1.075TYP 15.6±0.13 0.65TYP 50 31 100 30 1.075TYP 1 Mar.’98


    Original     		PDF 100D0 100pin 65TYP 45TYP 35TYP 075TYP jedec do 35 QFN weight JEDEC Code

    MO-220-VGGD-2

    Abstract: TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4C 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VGGD-2 TB389. MO-220-VGGD-2 TB389

    21002

    Abstract: JEDEC Code
    Text: 80D0 Glass seal 80pin QFN EIAJ Package Code – JEDEC Code – 21.0±0.2 Weight g 18.4±0.15 3.32MAX 0.8TYP 1.78TYP 0.6TYP 41 64 65 INDEX 0.5TYP 0.8TYP 12.0±0.15 1.2TYP 15.6±0.2 0.8TYP 40 25 80 24 1.2TYP 1 Mar.’98


    Original     		PDF 80pin 32MAX 78TYP 21002 JEDEC Code

    Technical Brief TB389

    Abstract: MO-220 TB389 e 380
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.6x6 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.85 0.90


    Original     		PDF MO-220) TB389. Technical Brief TB389 MO-220 TB389 e 380

    64-pinQFN

    Abstract: 10-TYP JEDEC Code 1200-15
    Text: 64D0 Metal seal 64pin QFN EIAJ Package Code – JEDEC Code – Weight g 12.0±0.15 3.13MAX 15.6±0.15 1.8TYP 0.8TYP 0.6TYP 33 48 49 INDEX 0.5TYP 1.0TYP 15.6±0.15 0.8TYP 0.8TYP 12.0±0.15 32 17 64 16 1.0TYP 1 Mar.’98


    Original     		PDF 64pin 13MAX 64-pinQFN 10-TYP JEDEC Code 1200-15

    qfn 3X3 land pattern

    Abstract: L8 Package TB389 MO-220-VEEC
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L8.3x3 8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VEEC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VEEC 6030mm TB389. qfn 3X3 land pattern L8 Package TB389 MO-220-VEEC

    MO-220-vhhd-2

    Abstract: TB389 3NE8
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x5 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHD-2 ISSUE C MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VHHD-2 TB389. MO-220-vhhd-2 TB389 3NE8

    TB389

    Abstract: 10n16
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5B 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VHHB TB389. TB389 10n16

    TB389

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220VHHB P30mm TB389. TB389

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L56.8x8A 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VLLD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A


    Original     		PDF MO-220VLLD-2 TB389.

    QFN56

    Abstract: No abstract text available
    Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10510D QUAD FLAT NON-LEADED PACKAGE QFN CASE NUMBER: 1674-02 56 TERMINAL, 0.5 PITCH ( 8X8X0. 9) STANDARD: NON-JEDEC CASE-OUTLINE


    OCR Scan     		PDF 98ARJ10510D 98ARJ10510D QFN56

    Untitled

    Abstract: No abstract text available
    Text: VIEW ROTATED 90° CW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10509D QUAD FLAT NON-LEADED PACKAGE QFN; CASE NUMBER: 1657-01 56 TERMINAL, 0.5 PITCH (8X8X1 STANDARD: NON-JEDEC


    OCR Scan     		PDF 98ARJ10509D 20MECHANICAL 5M-1994. 98ARJ10509D