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    JEDEC PIN1 QFN TAPE & REEL Search Results

    JEDEC PIN1 QFN TAPE & REEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74AC521SC REEL Rochester Electronics LLC 74AC521 - Identity Comparator, AC Series, 8-Bit, Inverted Output, CMOS Visit Rochester Electronics LLC Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    ISL59920IRZ-T7 Renesas Electronics Corporation Triple Analog Video Delay Line, QFN, /Reel Visit Renesas Electronics Corporation
    ISL59482IRZ-T13 Renesas Electronics Corporation Dual, 500MHz Triple, Multiplexing Amplifiers, QFN, /Reel Visit Renesas Electronics Corporation
    ISL59445IRZ-T13 Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Reel Visit Renesas Electronics Corporation

    JEDEC PIN1 QFN TAPE & REEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ATMEL 740

    Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
    Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer


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    PDF JESD97. 4845C ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


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    PDF SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


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    PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    TPS59611

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TPS59611

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT

    TPS59610

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT TPS59610

    40spq

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT 40spq

    TI QFN marking

    Abstract: TPS59611
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TI QFN marking TPS59611

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    JEDEC MO 224

    Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
    Text: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps


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    PDF CY2SSTU877 500-MHz, 10-Output 52-ball 40-pin CY2SSTU877 JEDEC MO 224 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape

    FMS2016-001

    Abstract: FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die
    Text: FMS2016-001 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch High isolation: >30dB at 1.8GHz Low Insertion loss: 0.65dB at 1.8GHz Excellent low control voltage performance


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    PDF FMS2016-001 2002/95/EC) FMS2016-001 22-A114. MIL-STD-1686 MIL-HDBK-263. FMS2016-001-TR FMS2016-001-TB FMS2016-001-EB FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die

    tps5161

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT tps5161

    CDC857-2

    Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 CY2SSTV857LFI-32

    PC3200-Compliant

    Abstract: No abstract text available
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant 400-MHz CDC857-2 48-pin CY2SSTV857-32 250MHz 230MHz PC3200-Compliant

    TSC2020

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit TSC2020

    TI QFN marking

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit TI QFN marking

    Untitled

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit

    lf24a

    Abstract: fs211 CY2544FI CY2544 CY2546
    Text: CY2544 CY2546 PRELIMINARY Quad PLL Programmable Clock Generator with Spread Spectrum Features Benefits • Four fully integrated phase-locked loops PLLs • Input Frequency range: — External crystal: 8 to 48 MHz — External reference: 8 to 166 MHz clock


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    PDF CY2544 CY2546 nineY2546 CY2544 CY2546 lf24a fs211 CY2544FI

    FMS2016-005-TB

    Abstract: FMS2016-005TR FMS2016-005 FMS2016-005-TR FMS2016QFN MIL-HDBK-263
    Text: FMS2016-005 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch NiPdAu finish for Military and High reliability applications High isolation: >30dB at 1.8GHz Excellent low control voltage performance


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    PDF FMS2016-005 2002/95/EC) FMS2016-005 22-A114. MIL-STD-1686 MIL-HDBK-263. FMS2016-005-TR FMS2016-005-TB FMS2016-005-EB FMS2016-005-TB FMS2016-005TR FMS2016-005-TR FMS2016QFN MIL-HDBK-263