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    JEDEC PIN1 QFN TAPE Search Results

    JEDEC PIN1 QFN TAPE Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    OP177GSZ-REEL Analog Devices OP177GS WITH TAPE AND REEL Visit Analog Devices Buy
    OP249GSZ-REEL Analog Devices OP249GS W/TAPE AND REEL Visit Analog Devices Buy
    SMP04ESZ-REEL Analog Devices SMP04ES W/TAPE AND REEL Visit Analog Devices Buy
    OP249GSZ-REEL7 Analog Devices OP249GS W/TAPE AND REEL Visit Analog Devices Buy

    JEDEC PIN1 QFN TAPE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ATMEL 740

    Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
    Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer


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    PDF JESD97. 4845C ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


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    PDF SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


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    PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    TPS59611

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TPS59611

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT

    TPS59610

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT TPS59610

    40spq

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT 40spq

    TI QFN marking

    Abstract: TPS59611
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TI QFN marking TPS59611

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    tps5161

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT tps5161

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    ML200M

    Abstract: F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2 12065A104JAT2A
    Text: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 2, 4/2005 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    PDF MMG2401 MMG2401NR2 ML200M F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2 12065A104JAT2A

    Schematics 5250

    Abstract: schematic 5250 GP 035 F QFN 3X3 A113 A114 A115 AN1955 C101 JESD22
    Text: Document Number: MMG5004N Rev. 0, 8/2006 Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology InGaP HBT MMG5004NR2 WLAN Power Amplifier Designed for 802.11a applications with frequencies from 4900 to 5900 MHz. • 23 dBm P1dB CW @ 5.25 GHz


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    PDF MMG5004N MMG5004NR2 Schematics 5250 schematic 5250 GP 035 F QFN 3X3 A113 A114 A115 AN1955 C101 JESD22

    12065A104JAT2A

    Abstract: 12065A105JAT2A F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2
    Text: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 3, 5/2006 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    PDF MMG2401 MMG2401NR2 12065A104JAT2A 12065A105JAT2A F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    QFN-40 weight

    Abstract: No abstract text available
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CDC857-2 48-pin CY2SSTV857-32 QFN-40 weight

    12065A104JAT2A

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 3, 5/2006 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    PDF MMG2401 MMG2401NR2 12065A104JAT2A

    12065A104JAT2A

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 2, 4/2005 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    PDF MMG2401 MMG2401NR2 MMG2401 12065A104JAT2A

    CDC857-2

    Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 CY2SSTV857LFI-32

    JEDEC MO 224

    Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
    Text: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps


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    PDF CY2SSTU877 500-MHz, 10-Output 52-ball 40-pin CY2SSTU877 JEDEC MO 224 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape

    PC3200-Compliant

    Abstract: No abstract text available
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant 400-MHz CDC857-2 48-pin CY2SSTV857-32 250MHz 230MHz PC3200-Compliant