Untitled
Abstract: No abstract text available
Text: A Sockets for IC-PLCC SMD sockets for PLCC - low profile housing B These sockets conform to EIA/JEDEC "A" package requirements for leaded plastic chip carriers. B ±0,2 D ±0,2 A C ±0,2 C Q 1,27 A 0,5 4 1,27 art. no. PLCC PLCC PLCC PLCC PLCC PLCC PLCC 20
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84 Pin PLCC Socket DIP
Abstract: plcc thru hole socket 32 PLCC
Text: WINSLOW ADAPTICs WAxx127DSAJT PLCC TO PGA ADAPTER This is a complete range of Adapters which convert a PLCC package to a PGA male thru hole footprint. This range of adapters are supplied with PLCC production sockets mounted for ease of device insertion. Sockets are to JEDEC standard PLCC dimensions.
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WAxx127DSAJT
84 Pin PLCC Socket DIP
plcc thru hole socket 32 PLCC
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Untitled
Abstract: No abstract text available
Text: MP1000VS32JC 1M x 32 Fast SRAM PLCC Issue 1.0 December 2005 General Description Features The MP1000VS32JC device is a 1M x 32 SRAM module housed in a 68 Jleaded package which complies with the JEDEC 68 PLCC standard. Access times of 12, 15 or 20 ns are available. The 3V device is
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MP1000VS32JC
MP1000VS32JC
435mton
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D0-D31
Abstract: No abstract text available
Text: MP512S32JC 512K x 32 Fast SRAM PLCC Issue 1.1 December 2007 General Description Features The MP512S32JC device is a 512K x 32 SRAM module housed in a 68 Jleaded package which complies with the JEDEC 68 PLCC standard. Access times of 15, 20 or 25 ns are available. The 5V device is
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MP512S32JC
MP512S32JC
D0-D31
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JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
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PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
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augat tyco
Abstract: PCS-044A-1 Augat PCS-032A-1 PCS-068A-1 PCS-084A-1 1-822473-6 AUGAT SOCKET 1-822473-3 1571539-2
Text: Introducing. AUGAT PLCC Sockets Thru-Hole PCS Series PRODUCT FACTS • The RoHS Compliant PCS Series Chip Carrier socket accepts Jedec Type "A" plastic leaded chip carriers on 1.27 centres. These dependable sockets combine positive retention of the package with high normal force
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MS-016
Abstract: MS-016 plcc32 PLCC32
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PLCC 32 CASE 776AK−01 ISSUE O DATE 19 DEC 2008 PIN#1 IDENTIFICATION E1 E E2 D1 A2 D A3 TOP VIEW END VIEW b1 b e D2 SIDE VIEW Notes: 1 All dimensions are in millimeters. (2) Complies with JEDEC MS-016. DOCUMENT NUMBER:
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776AK-01
98AON34227E
MS-016.
776AK
MS-016
MS-016 plcc32
PLCC32
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PCS-068A-1
Abstract: Augat, PCS Series PCS-020A-1 PCS-044A-1 MO-047 MO-052 PCS-028A-1 PCS020A1 PCS068A-1 PCS068A1
Text: PCS Series Sockets for PLCC Packages C PCS-068A-1 FEATURES: PERFORMANCE SPECIFICATIONS: The Augat PCS Series Chip Carrier sockets accepts Jedec Type "A" plastic leaded chip carriers on .050" 1.27 centers. These dependable sockets combine positive retention of the package with high normal force to
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PCS-068A-1
MIL-STD-1344,
PCS-032A-1
PCS-068A-1
Augat, PCS Series
PCS-020A-1
PCS-044A-1
MO-047
MO-052
PCS-028A-1
PCS020A1
PCS068A-1
PCS068A1
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23C4096-12
Abstract: MX23C4096 MX23C4096PC-10 MX23C4096PC-12 MX23C4096PC-15 MX23C4096PC-20 N 690
Text: Introduction Selection Guide MX23C4096 4M-BIT 256K x 16 CMOS MASK ROM FEATURES • • • • • • Operating current: 60mA • Standby current: 100µA • Package - 40 pin DIP(600 mil) - 44 pin PLCC 256Kx16 organization(JEDEC pin out) Single +5V power supply
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MX23C4096
256Kx16
100/120/150/200ns
MX23C4096
150/200ns.
23C4096-12
MX23C4096PC-10
MX23C4096PC-12
MX23C4096PC-15
MX23C4096PC-20
N 690
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MX23C2048
Abstract: No abstract text available
Text: Introduction Selection Guide MX23C2048 2M-BIT 128K x 16 CMOS MASK ROM FEATURES • • • • • • Operating current: 60mA • Standby current: 100µA • Package - 40 pin DIP(600 mil) - 44 pin PLCC 128Kx16 organization(JEDEC pin out) Single +5V power supply
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MX23C2048
128Kx16
120/150/200ns
MX23C2048
200ns.
MX23C204at
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
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rh 115-2
Abstract: MS-018 MS-016 amkor
Text: LEADFRAME data sheet PLCC Features: Plastic Leaded Chip Carrier PLCC Packages: Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC products are offered with and without
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Appli18
MS-018
MS-016
rh 115-2
MS-018
MS-016
amkor
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MS-018
Abstract: MS-016 MS-018 PLCC 68 MS016
Text: LEADFRAME data sheet PLCC Features: Plastic Leaded Chip Carrier PLCC Packages: Amkor’s PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC
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set018
MS-016
MS-018
MS-016
MS-018 PLCC 68
MS016
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Untitled
Abstract: No abstract text available
Text: • DISTINCTIVE CHARACTERISTICS * Single 5.0 V read, write and erase Minimizes system level power requirements * Compatible with JEDEC-standard commands Uses same software commands as E2PRO!\/ls a -ym 1 Compatible with JEDEC-standard byte-wide pinoutjm 32-pin PLCC Package suffix: PD
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32-pin
P9604
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Untitled
Abstract: No abstract text available
Text: PLCC Socket - 709-2000 Series / The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the
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UL94V-0
UL94V-0
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Untitled
Abstract: No abstract text available
Text: The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the PLCC socket complements CAMBION’s other
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UL94V-0
UL94V-0
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Untitled
Abstract: No abstract text available
Text: The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the PLCC socket complements CAMBION's other
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UL94V-0
UL94V-0
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Untitled
Abstract: No abstract text available
Text: Siptos IsemIconductor AP29F040 PRELIMINARY 512K x 8 CMOS Flash EPROM Features • Low Vc c write inhibit < 3.2 V • Packaged in: 32-Pin PLCC and TSOP • 5 V ± 10% program and erase for low power consumption and simplified system design • JEDEC-standard software commands, pinout and package
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AP29F040
32-Pin
AP29F040-70JC
AP29F040-70TC
AP29F040-90JC
AP29F040-90TC
AP29F040-120JC
AP29F040-120TC
AP29F040-150JC
AP29F040-150TC
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Untitled
Abstract: No abstract text available
Text: m A MX23C4Q96 MACftONIX. INC. 4M-BIT 258K x 18 CMOS MASK ROM FEATURES • • • • • Operating current: 60mA Standby current: 100(iA Package - 40 pin DIP(600 mil) - 44 pin PLCC 256Kx16 organization(JEDEC pin out) Single +5V power supply Fast access time: 100/120/150/200ns
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MX23C4Q96
256Kx16
100/120/150/200ns
MX23C4096
150/200ns.
MX23C4096PC-10
MX23C4096PC-12
MX23C4096PC-15
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Untitled
Abstract: No abstract text available
Text: R I A MX23C1Q24 MACRONIX, INC. 1 M-BIT 64K x 1 B CMOS MASK ROM FEATURES • • • • • Operating current: 60mA Standby current: lOO^A Package - 40 pin DIP(600 mil) •44 pin PLCC 64Kx16 organization(JEDEC pin out) Single +5V power supply Fast access time: 120/150/200ns
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MX23C1Q24
64Kx16
120/150/200ns
MX23C1024
MX23C1024PC-12
MX23C1024PC-15
MX23C1024PC-20
MX23C1024QC-12
MX23C1024QC-15
MX23C1024QC-20
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