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    JEDEC MS-013 AB Search Results

    JEDEC MS-013 AB Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    JEDEC MS-013 AB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MS-013

    Abstract: WOMC
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element


    Original     		PDF MS-013 08-Apr-05 MS-013 WOMC

    MS-013

    Abstract: WOMC
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element


    Original     		PDF MS-013 18-Jul-08 MS-013 WOMC

    WOMC

    Abstract: No abstract text available
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element


    Original     		PDF MS-013 18-Jul-08 WOMC

    MS-013

    Abstract: No abstract text available
    Text: WOMC Vishay Thin Film Molded, 50 mil Pitch, Dual In-Line Resistor, Wide Body, Surface Mount Network FEATURES • Standard 16 pins and 20 pins counts 0.300" wide body JEDEC MS-013 variation AA and AC • Rugged, molded case construction • High stable thin film element ratio stability


    Original     		PDF MS-013 2002/95/EC 18-Jul-08

    WOMC

    Abstract: No abstract text available
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -Free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged molded case construction • High stable thin film element • Leads copper alloy, solderable


    Original     		PDF MS-013 08-Apr-05 WOMC

    Untitled

    Abstract: No abstract text available
    Text: WOMC Vishay Thin Film Molded, 50 mil Pitch, Dual In-Line Resistor, Wide Body, Surface Mount Network FEATURES • Standard 16 pins and 20 pins counts 0.300" wide body JEDEC MS-013 variation AA and AC • Rugged, molded case construction • High stable thin film element ratio stability


    Original     		PDF MS-013 2002/95/EC 11-Mar-11

    material abs 757

    Abstract: 8 pin SURFACE MOUNT RESISTOR 50mWatt abs 757 WOMC MS-013
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks, Wide Body FEATURES • Standard 16 and 20 Pin Counts 0.300" Wide Body JEDEC MS-013 • Rugged molded case construction Actual Size 20 Pin • High stable thin film element • Leads copper alloy, solderable


    Original     		PDF MS-013 03-May-01 material abs 757 8 pin SURFACE MOUNT RESISTOR 50mWatt abs 757 WOMC MS-013

    WOMC

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS WOMC Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element


    Original     		PDF MS-013 08-Apr-05 WOMC

    WOMC

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS WOMC Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element


    Original     		PDF MS-013 08-Apr-05 WOMC

    WOMC

    Abstract: No abstract text available
    Text: Vishay Thin Film Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -Free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged molded case construction • High stable thin film element • Leads copper alloy, solderable


    Original     		PDF MS-013 05-May-05 WOMC

    jedec MS-013

    Abstract: MS-013-AA
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


    Original     		PDF MS-013-AA 5M-1982. jedec MS-013

    MS-013-AC

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


    Original     		PDF MS-013-AC 5M-1982.

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


    Original     		PDF MS-013-AD 5M-1982.

    jedec ms-013 ab

    Abstract: MS-013-AB
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M18.3 (JEDEC MS-013-AB ISSUE C) N INDEX AREA 18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


    Original     		PDF MS-013-AB jedec ms-013 ab

    MS-013-AE

    Abstract: 28 MS-013 Package
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e


    Original     		PDF MS-013-AE 5M-1982. 28 MS-013 Package

    jedec ms-013 ad

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M24.3 (JEDEC MS-013-AD ISSUE C) N INDEX AREA 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1


    Original     		PDF MS-013-AD jedec ms-013 ad

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1


    Original     		PDF MS-013-AE

    28 MS-013 Package

    Abstract: MS-013-AE
    Text: Plastic Package Small Outline Plastic Package SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AE 28 MS-013 Package

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Package Small Outline Plastic Package SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AA

    MS-013-AC

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


    Original     		PDF MS-013-AC

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


    Original     		PDF MS-013-AA

    MS-013-AD

    Abstract: No abstract text available
    Text: Plastic Package Small Outline Plastic Package SOIC M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AD

    MS-013 Package

    Abstract: MS-013-AC
    Text: Plastic Package Small Outline Plastic Package SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AC MS-013 Package

    MS-013

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS P R E C I S I O N T H I N F I L M T E C H N O L O G Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks WOMC Series Wide Body FEATURES • Standard 16 and 20 Pin Counts (.300" Wide Body) JEDEC MS-013 • Rugged molded case construction


    Original     		PDF MS-013 MS-013