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    JC INTEL FCBGA PACKAGE THERMAL RESISTANCE Search Results

    JC INTEL FCBGA PACKAGE THERMAL RESISTANCE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    JC INTEL FCBGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ipx2800

    Abstract: IXP2400 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance
    Text: Intel IXP2400 Network Processor Thermal and Mechanical Design Guideline Application Note March 2003 Document Number: 301148-001 IXP2400 Network Processor Thermal/Mechanical Design INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF IXP2400 ipx2800 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance

    JEDEC-51-2

    Abstract: x23-7783D 82801DB MM2K JEDEC51 37.5x37.5 Shinetsu X23 855GME Al grade 6063 mmx black anodized aluminum plate
    Text: White Paper Chun Howe Sim Thermal Mechanical Application Engineer Jason Loh Thermal Mechanical Application Engineer Fanless Cooling for Embedded Applications Intel Corporation January 2009 321057 Fan-less Cooling for Embedded Application Executive Summary


    Original     		PDF

    nokia 1600 schematic diagram

    Abstract: TUNDRA Tsi568 Tundra Tsi568a Alcatel fcbga theta jc FCBGA 10GIL TSI568 005 tx1 nortel
    Text: Title Tsi568A Serial RapidIO Switch Hardware Manual Formal April 2007 80B8000_MA002_04 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi568A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor


    Original     		PDF Tsi568A 80B8000 Tsi568A, nokia 1600 schematic diagram TUNDRA Tsi568 Tundra Tsi568a Alcatel fcbga theta jc FCBGA 10GIL TSI568 005 tx1 nortel

    nokia 1600 schematic diagram

    Abstract: TSI564 TUNDRA Tsi568
    Text: Titl Tsi564A Serial RapidIO Switch Hardware Manual Formal May 2007 80B802A_MA002_04 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi564A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor


    Original     		PDF Tsi564A 80B802A Tsi564A, nokia 1600 schematic diagram TSI564 TUNDRA Tsi568

    NAND Flash Programmer with TSOP-48 adapter

    Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5
    Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF

    X557-AT2

    Abstract: lp 8029 l4
    Text: Intel X557-AT/AT2/AT4 10 GbE PHY Datasheet Networking Division ND Features:  10GBASE-T Performance — Ability to support worst case channels while reducing power and latency when channel characteristics permit:    Built-in thermal management capabilities — Enables deployment in thermally constrained


    Original     		PDF X557-AT/AT2/AT4 10GBASE-T H7137NL G13-152T-038 G17-188T-038 G12-1JJT-038 JT4-1108HL RJTGE1G4172J H130A-50 000-16-F-1010-TR-NS1 X557-AT2 lp 8029 l4

    Untitled

    Abstract: No abstract text available
    Text: VSC6134 Datasheet Features ● ● ● ● ● ● ● ● ● ● Two ITU-T G.709-compliant processors GR253-compliant STS192 section and line processor OTU synchronous and asynchronous mapping 10 GbE transport with RMON MIB per IEEE 802.3 ITU-T G.975 Reed Solomon encoder and decoder


    Original     		PDF VSC6134 709-compliant GR253-compliant STS192 16-bit STS192/10 97-free 897-pin VMDS-10185 VSC6134

    a3568

    Abstract: S-80141ALMC aplication notes w25q32b quanta 6320 XL710 26 Pin GPIO Connector Header Extender 90 Degree Angle TXAL 228 B
    Text: Intel Ethernet Controller XL710 Datasheet Networking Division ND Revision: 2.1 December 2014 Legal Lines and Disclaimers No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a


    Original     		PDF XL710 a3568 S-80141ALMC aplication notes w25q32b quanta 6320 XL710 26 Pin GPIO Connector Header Extender 90 Degree Angle TXAL 228 B

    M8260

    Abstract: Marking W36 AG34 Frequency detector 31n w6 marking w35 W39 marking AP36
    Text: Hardware Design Guide July 2002 TFEC0410G 2.5/10 Gbits/s Optical Networking Interface with Strong/Weak FEC and Digital Wrapper 1 Document Organization This document is primarily intended for designers and engineers whom require I/O characteristics for board


    Original     		PDF TFEC0410G DS02-229SONT M8260 Marking W36 AG34 Frequency detector 31n w6 marking w35 W39 marking AP36

    RXLFI

    Abstract: No abstract text available
    Text: Operational Description July 2002 TFEC0410G 2.5/10 Gbits/s Optical Networking Interface with Strong/Weak FEC and Digital Wrapper 1 Document Organization This document is primarily intended for designers who require design implementation information and block


    Original     		PDF TFEC0410G 37--Section DS02-229SONT RXLFI

    PIC16F72 inverter ups

    Abstract: UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186
    Text: the solutions are out there you just haven’t registered yet. RoadTest the newest products in the market! View the latest news, design support and hot new technologies for a range of applications Join the RoadTest group and be in with a chance to trial exclusive new products for free. Plus, read


    Original     		PDF element-14 element14. element14, PIC16F72 inverter ups UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186