smd w2h
Abstract: SLF0905 KOA RK73H KOA RK73 RK73 RK73G tdb 158 KOA RK73B smd code W2H HV73
Text: PACKAGING SMD TAPE AND REEL Standard packagings are shown in ”bold” letters. RN73-series is available on 7“ ø 178 mm and 10“ (ø 255 mm) reels. EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de
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RN73-series
D-25578
smd w2h
SLF0905
KOA RK73H
KOA RK73
RK73
RK73G
tdb 158
KOA RK73B
smd code W2H
HV73
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c4212
Abstract: transistor c4212 transistor c2307 c4314 c4204 c4212 h c2307 c4304 C4302 C4202
Text: TRIMMER POTENTIOMETER METAL GLAZE • CARBON FILM C2xxx, C3xxx, C4xxx • KVSF807LG TYPE DESIGNATION HOW TO ORDER C 4222 A TE 103 PRODUCT CODE STYLE TERMINATION SURFACE MATERIAL TAPING* NOMINAL RESISTANCE *Please see “PACKAGING” Products with Pb-free terminations
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KVSF807LG
C4315,
KVSF897LG)
C2307,
C3307)
C4315
C4304
C4314)
C4314
KVSF807LG
c4212
transistor c4212
transistor c2307
c4204
c4212 h
c2307
C4302
C4202
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TCR50
Abstract: 100-511K Resistance color bands RN41 size 0204
Text: RESISTORS MELF TYPE 1 2 3 4 5 6 RESISTORS STRUCTURE RN41 METAL FILM • JUMPER RN41 • CC Protective coating Trimming cut Ceramic rod Cap iron solder plated Metal film Marking STRUCTURE CC IDENTIFICATION TYPE Contact our sales representatives before you use our products for applications including
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TCR50
CC25M
D-25578
100-511K
Resistance color bands
RN41
size 0204
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Untitled
Abstract: No abstract text available
Text: FLAT CHIP HIGH FREQUENCY THIN FILM RESISTOR SHDR STRUCTURE 1 Protective coating 2 Electrode 3 Rear metalization TYPE DESIGNATION HOW TO ORDER SHDR 001 G K PRODUCT CODE REFERENCE NUMBER TERMINATION SURFACE MATERIAL K: chip tray 001: 0202 004: 0402 G: Au 391
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D-25578
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RC-2133A
Abstract: RN73h 820 marking E192 RN73H1E RN73H2A
Text: RESISTORS METAL THIN FILM, PRECISION HIGH HEAT RESISTANT RN73H STRUCTURE IDENTIFICATION COATING COLOR RN73H 1E RN73H 1J Black RN73H 2A . 2E * Red marking for T.C.R ± 5 and ±10 ppm/K TYPE 2A STYLE None Yellow, 3 digits E24 * None (E96) Yellow, 4 digits*
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RN73H
RN73H
D-25578
RC-2133A
820 marking
E192
RN73H1E
RN73H2A
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CND1J
Abstract: CND1J10K CND1J10Y CND2B10 CND2B10V MARKING CND
Text: NETWORKS bussed r-networks CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR a b CND1J10VK , CND2B10 a CND1J10K Black CND2B10Vb CND1J10Y, CND2A10Y
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CND1J10VK
CND2B10
CND1J10Ka
CND2B10Vb
CND1J10Y,
CND2A10Y
D-25578
CND1J
CND1J10K
CND1J10Y
CND2B10
CND2B10V
MARKING CND
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kq0603
Abstract: flat ferrit core 12N35
Text: INDUCTORS AIR CORE 4 5 W WIREWOUND CHIP INDUCTOR KQ 0603 STRUCTURE 2 H 1 2 3 4 5 Ht 1 Wt P L 3 Ceramic core Ferrit content at L ≥ 330nH Winding wire Electrode Inner coat Flat top film IDENTIFICATION PRODUCT CODE BODY COLOR MARKING KQ 0603 Black 1 digit
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330nH)
KQ0603
D-25578
kq0603
flat ferrit core
12N35
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4N0404
Abstract: CN1J4 CN1E MARKING 1F R610 CN1J2K CN-k CN1E4K RESISTOR ARRAY 4 0402
Text: NETWORKS THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 CN1H2N CN1H4N P CN1E2K, CN1J2K Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating CN1J4A, CN2B4A CN1E4K, CN1F N 8K, CN1J4K
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D-25578
4N0404
CN1J4
CN1E
MARKING 1F
R610
CN1J2K
CN-k
CN1E4K
RESISTOR ARRAY 4 0402
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Untitled
Abstract: No abstract text available
Text: LOW OHM L METAL PLATE L W W CURRENT SENSING POWER SHUNT CHIP PSI • PSE 2 3 2 3 t t d 4 1 d 4 1 PSI / PSE: 1 mΩ & 2mΩ STRUCTURE 1 2 3 4 L L W LOW OHM W PSI: 3 mΩ & 4 mΩ 2 3 2 t t IDENTIFICATION d 1 d 1 PRODUCT CODE 3 COATING COLOR MARKING No coating
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D-25578
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linear ptc thermistors 0805
Abstract: LA73
Text: THERMAL SENSORS THERMAL SENSORS LINEAR PTC THICK FILM LA 73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Bottom termination Thick film resistor element Protective layer End termination Diffusion barrier Ni Solder plating IDENTIFICATION PRODUCT CODE
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D-25578
linear ptc thermistors 0805
LA73
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KL32
Abstract: LFC32
Text: INDUCTORS FERRITE CORE W L WIREWOUND MOLDED CHIP INDUCTOR LFC32 KL32 1 4 1 STRUCTURE H tH t� W 1 2 3 4 Ferrite core Winding wire Terminal copper base) Molded resin d 2 3 IDENTIFICATION PRODUCT CODE COATING COLOR MARKING Silver LFC32 / KL32 Black 3 digit Inductance
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LFC32
LFC32
D-25578
KL32
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SR73
Abstract: SR73-2B SR732E SR731J SR732A SR731E RC-2134B
Text: LOW OHM Thick Film CURRENT Sensing Chip SR73 STRUCTURE IDENTIFICATION COATING MARKING COLOR SR73 1H Black SR73 1E None SR73 1J 1% SR73 1J (2%, 5%) Indigo White, 3 digits SR73 2A…W3A (2%, 5%) SR73 2A…W3A (0.5%, 1%) White, 4 digits PRODUCT CODE Ceramic substrate
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D-25578
SR73
SR73-2B
SR732E
SR731J
SR732A
SR731E
RC-2134B
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CN1J4
Abstract: No abstract text available
Text: NETWORKS THICK FILM R-NETWORK NETWORKS PASSIVE COMPONENTS CONcave TERMINATIONS Anti sulfuration CN RT • CNZ RT W NE STRUCTURE 1 2 3 4 5 6 Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating IDENTIFICATION
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D-25578
CN1J4
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T-100
Abstract: k3850 k 3850
Text: THERMAL SENSORS THERMAL SENSORS THIN FILM PLATINUM PTC Automotive SDT73V STRUCTURE 1 2 3 4 5 6 Protective coating Platinum thin film element Inner electrode Nickel plating Solder plating Ceramic substrate IDENTIFICATION PRODUCT CODE COATING COLOR MARKING Black
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SDT73V
T-100
k3850
k 3850
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Untitled
Abstract: No abstract text available
Text: NETWORKS THICK FILM R-NETWORKS STRUCTURE LOw profile sip rkl 1 2 3 4 5 6 7 8 Ceramic substrate Pin connection Printed conductor Ag, Pd Resistive layer Glass layer Solder plated copper term. Epoxy powder overcoating Marking coating color marking RKL Black
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D-25578
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RK26
Abstract: No abstract text available
Text: RESISTORS metal FILM metal glaze radial Type LF • LFF radial Type rK 26 STRUCTURE 1 2 3 4 5 6 7 Epoxy resin overcoating Marking Trimming line Ceramic core Steel cap Cu, Sn plated Termination Trimmed resistive layer Identification produCt code coating color
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D-25578
RK26
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LOW RESISTANCE RESISTOR TLR
Abstract: TLR3AW
Text: LOW Ohm Metal plate Current Sensing Milliohm Chip TLR ⑤ STRUCTURE L 1 2 3 4 5 W ② ④ t Low Ohm d ① d ③ Protective bottom coating Electrode Resistive Element Solder Protective top coating 3A, 3AW (1mΩ only IDENTIFICATION PRODUCT CODE COATING TLR3AD,
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TCR50
TCR75
D-25578
LOW RESISTANCE RESISTOR TLR
TLR3AW
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RESISTOR AXIAL 0617
Abstract: M100K
Text: RESISTORS TECHNOLOGY OF TOMORROW METAL GLAZE STRUCTURE AXIAL TYPE RK 1 2 3 4 5 6 7 Ceramic core Trimmed metal glaze layer Steel cap Cu, Sn plated Solder plated copper wire Welding joint Epoxy resin overcoating Marking IDENTIFICATION PRODUCT CODE COATING COLOR
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D-25578
RESISTOR AXIAL 0617
M100K
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Untitled
Abstract: No abstract text available
Text: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS THIN FILM CURRENT FUSE TF10AN • TF16SN STRUCTURE 1 2 3 4 5 6 7 8 W NE Ceramic substrate Top termination Bottom termination Fuse element Cu based Protective coating End termination (Ni Cr)
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TF10AN
TF16SN
D-25578
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106 25v
Abstract: No abstract text available
Text: CAPACITORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC CHIP Y5V 1 2 3 4 5 C Sn plating Ni plating Inner electrode Pd/Ag Internal electrode Dielectric ceramic layer t L W IDENTIFICATION DIELECTRIC COATING COLOR MARKING Y5V Black None TYPE DESIGNATION (HOW TO ORDER)
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D-25578
106 25v
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NPR1
Abstract: NPR1 0.1
Text: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW METAL PLATE POWER CHIP NPR STRUCTURE 1 Resistive element* 2 Mold resin LCP UL: 94 V-O 3 Termination, solder plating on copper plate 4 Joining / Welding POWER TYPE RESISTORS * For values smaller 68 mΩ * a metal plate is used
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D-25578
R0039
NPR1
NPR1 0.1
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470 uH inductors
Abstract: 18 uh 8.2 uH phone 6r8 COIL 220 uh inductors 56 UH COIL
Text: INDUCTORS TECHNOLOGY OF TOMORROW FERRITE CORE POWER CHOKE COIL SDR IDENTIFICATION MARKING Products with Pb-free terminations meet RoHS requirements Black, 3 digits and marking dot Large permissible DC current and low DC resistance Small surface area allows high mounting density
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SDR0603
SDR0604
SDR0805
SDR1006
SDR0906
D-25578
470 uH inductors
18 uh
8.2 uH
phone 6r8 COIL
220 uh inductors
56 UH COIL
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2134A
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW ZERO OHM JUMPER RK73Z RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination
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RK73Z
RK73Z
2134A
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airbag
Abstract: No abstract text available
Text: Tem ic S e m i c o n d u c t o r s About TEMIC TEM IC is the m icroelectronics enterprise of Daim ler-Benz. Organized into four divisions — Semiconductors, M icrosystem s, Automotive Electronics, and Airbag Inflators — TEM IC offers products for the computer, com munications, auto
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OCR Scan
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