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    IR DATABOOK SCR Search Results

    IR DATABOOK SCR Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    P104 Coilcraft Inc Silicon Controlled Rectifier, Visit Coilcraft Inc
    FSASF214E2 Amphenol Communications Solutions Mini SAS, High Speed Input Output Connector, 1X2 CAGE ASSY 0 DEG NO SCR Visit Amphenol Communications Solutions

    IR DATABOOK SCR Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CON12

    Abstract: CS61584A CS61584A-IL3 CS61584A-IL5 CS61584A-IQ3 CS61584A-IQ5 rneg2
    Text: CS61584A Product Databook = C IR R U S L O G IC FEATURES • Dual T1/E1 Line Interface ■ 3.3 Volt and 5 Volt Versions ■ Crystalless Jitter Attenuator Meets European CTR 12 and ETSI ETS 300 011 Specifications ■ Matched Impedance Transmit Drivers ■ Transmitter Tristate Capability


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    CS61584A TR-NET-00499 ST5175T TD38-1505A PE-65388 PE-65770 PE-65838 PE-68674 PE-65870 T1016 CON12 CS61584A-IL3 CS61584A-IL5 CS61584A-IQ3 CS61584A-IQ5 rneg2 PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


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    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


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    all ic data

    Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
    Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile


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    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


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    conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    822 smd

    Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


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    SMD codes databook

    Abstract: SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap manufacturing process calcium chloride ic shelf life MIL-STD-38510 QFP Shipping Trays
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


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    218-0660017

    Abstract: SB710 northbridge amd k10 imc SB700 AMD SB700 AMD SB710 2180660017 athlon socket AM3 pin diagram 528-FCBGA sb750
    Text: AMD SB710 Databook Technical Reference Manual Rev. 1.25 P/N: 45215_sb710_ds_pub 2009 Advanced Micro Devices, Inc. 42133 Trademarks AMD, the AMD Arrow logo, Athlon, and combinations thereof, ATI, ATI logo, Radeon, and Crossfire are trademarks of Advanced Micro Devices, Inc.


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    SB710 218-0660017 northbridge amd k10 imc SB700 AMD SB700 AMD SB710 2180660017 athlon socket AM3 pin diagram 528-FCBGA sb750 PDF

    SD MOSFET DRIVE 4468 8 PIN

    Abstract: eltek rectifier module circuit diagram IRF830 smps design with TL431 UNITRODE applications handbook uc3842 -96 UC3842 smps design with TL431 3842 smps battery charger circuit electronic transformer halogen ret 220c 500 WATT smps using ka3844 eltek smps 1000 si 48v tpa 5017
    Text: You are in Databook Vol. 2b • Click for Main Menu Product Categories CLICK ANY ITEM Return to Main Menu Volume 2b Table of Contents Volume 2b Part Number and App. Note/Hint Index General Information PC Card Power Protected Switches Low-Dropout Linear Voltage Regulators


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    MIC5014. MIC5014 SN54COO IRLZ24 1N754 MIC5016BN 100pF SD MOSFET DRIVE 4468 8 PIN eltek rectifier module circuit diagram IRF830 smps design with TL431 UNITRODE applications handbook uc3842 -96 UC3842 smps design with TL431 3842 smps battery charger circuit electronic transformer halogen ret 220c 500 WATT smps using ka3844 eltek smps 1000 si 48v tpa 5017 PDF

    RCR20

    Abstract: TLHR RCR1511 RCR20 resistor CS61535A CS61574A CS61575 CS61581 CS62180A CS62180B
    Text: CS62181 — Advanced Product Databook CIRRUS LOGIC FEATURES • Integrated E1 Framer for 2.048 Mbits/s Applications ■ Meets ITU-T G.704, G.706, and G.732, ETSI ETS 300-011, and ITU-T 1.431 ■ Support for CRC-4 Framing Standards and CAS/CCS Signaling Formats


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    CS62181 CS62180A CS62180B DS2181A CS62181 40-pin CS62181-IL CS62181-IQ 44-pin RCR20 TLHR RCR1511 RCR20 resistor CS61535A CS61574A CS61575 CS61581 PDF

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: IPC-SM-780 nickel corrosion electroplating
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


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    Glossary-11 CERAMIC PIN GRID ARRAY wire lead frame IPC-SM-780 nickel corrosion electroplating PDF

    cn/A/U 237 BG

    Abstract: No abstract text available
    Text: CS61584A = Product Databook CIRRUS LOGIC FEATURES • DualT1/E1 Line Interface ■ 3.3 Volt and 5 Volt Versions Dual T1/E1 Line Interface ■ Crystalless Jitter Attenuator Meets European CTR 12 and ETSI ETS 300 011 Specifications DESCRIPTION ■ Matched Impedance Transmit Drivers


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    CS61584A DS261PP4 cn/A/U 237 BG PDF

    IPC-SM-780

    Abstract: No abstract text available
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


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    Glossary-11 IPC-SM-780 PDF

    IR DATABOOK SCR

    Abstract: cmos logic databook BTS 8800 COMCLOK 13.56 CON12 line output transformer for television Transformer te-e TTL databook TTL databook application CS61584A
    Text: CS61584A Product Databook =CIRRUS LOGIC FEATURES • Dual T1/E1 Line Interface ■ 3.3 Volt and 5 Volt Versions D ual T1/E1 Line In terface ■ Crystalless Jitter Attenuator Meets European CTR 12 and ETSI ETS 300 011 Specifications ■ Matched Impedance Transmit Drivers


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    ST5175T TD38-1505A PE-65388 PE-65770 PE-65838 PE-68674 PE-65870 T1016 T1072 ST5112 IR DATABOOK SCR cmos logic databook BTS 8800 COMCLOK 13.56 CON12 line output transformer for television Transformer te-e TTL databook TTL databook application CS61584A PDF

    pick and place robot

    Abstract: programming smt machine .65mm bga land pattern land pattern for SOP A5666-02 2000 Packaging SURFACE MOUNT TECHNOLOGY
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies with higher I/O, increased board density, and reduced


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    AMI 52 732 V

    Abstract: ACT 4060 ASH
    Text: CS61584A Product Databook FEATURES n Dual T1/E1 Line Interface n 3.3 Volt and 5 Volt Versions Dual T1/E1 Line Interface n Crystalless Jitter Attenuator Meets European CTR 12 and ETSI ETS 300 011 Specifications DESCRIPTION n Matched Impedance Transmit Drivers


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    CS61584A TR-NET-00499 AMI 52 732 V ACT 4060 ASH PDF

    218-0697020

    Abstract: bcm50610 AMD Phenom II southbridge block diagram AMD Phenom II x4 218-0697014 pin diagram AMD phenom II - X4 SB820M BROADCOM AC131 605-FCBGA
    Text: AMD SB810/850 Southbridge Databook Publication # Issue Date: 44758 Revision: 2.10 Dec 2010 Advanced Micro Devices 44758 Rev. 2.10 Dec 2010 AMD SB810/850 Southbridge Databook 2010 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced


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    SB810/850 218-0697020 bcm50610 AMD Phenom II southbridge block diagram AMD Phenom II x4 218-0697014 pin diagram AMD phenom II - X4 SB820M BROADCOM AC131 605-FCBGA PDF

    Motorola modem schematic diagram 56k

    Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram MC330780 MC78L05 TOTX173 cirrus ac-link Motorola modem schematic diagram microphone mixer schematic amr designed in orcad ORCAD PCB LAYOUT BOOK
    Text: CRD4297-1 AMR CIRRUS LOGIC Advanced Product Databook FEATURES CrystalClear AC 97 AMR Audio Modem Riser Reference Design • AMR Audio Codec add-in card designed to meet the Intel Audio/Modem Riser Specification ■ High quality, low cost, 2-layer, single sided


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    CS4297 CRD4297-1 1/10W, 1/10W Motorola modem schematic diagram 56k intel i5 MOTHERBOARD pcb CIRCUIT diagram MC330780 MC78L05 TOTX173 cirrus ac-link Motorola modem schematic diagram microphone mixer schematic amr designed in orcad ORCAD PCB LAYOUT BOOK PDF

    eltek smps 1000 si 48v

    Abstract: eltek smps 600 24v smps circuit using ka3842 Marking Code SMD CM sot-23-5 AS Eltek smps 250 smps power circuit using ka3842 pwm schematic inverter uc2844 atx power supply UC3842 diagram uc3844 schematic diagram 24v dc dc UC3843 smps diagrams
    Text: You are in Databook Vol. 3 • Click for Main Menu Product Categories CLICK ANY ITEM Return to Main Menu Volume 3 Table of Contents Volume 3 Part Number and App. Note/Hint Index General Information PC Card Power Protected Switches Low-Dropout Linear Voltage Regulators


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    400mW 625mW MIC5204BS OT-223 MIC5204 eltek smps 1000 si 48v eltek smps 600 24v smps circuit using ka3842 Marking Code SMD CM sot-23-5 AS Eltek smps 250 smps power circuit using ka3842 pwm schematic inverter uc2844 atx power supply UC3842 diagram uc3844 schematic diagram 24v dc dc UC3843 smps diagrams PDF

    BTA08-600W

    Abstract: working of speed control of dc motor using ir remote DC motor speed control using diac and triac ABSTRACT FOR DC MOTOR SPEED CONTROL USING triac AN392A abstract for remote control for home appliances abstract of Touch screen sensor halogen touch dimmer ST6210 touch dimmer
    Text: APPLICATION NOTE A MINI GUIDE TO THE APPLICATION NOTE INDEX IN THE 8-BIT MCUs BULLETIN BOARD SYSTEM By Ian Blythe How to Use this Guide This guide shows how to use the Application Note Index program from SGS-THOMSON. This program is available on-line through the SGS-THOMSON Bulletin Board Systems BBSs telephone numbers are listed in this document , and also can be downloaded from the BBSs


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    application note triac protection

    Abstract: abstract on mini ups system BTA08-600W ST6210 abstract on mini ups system circuit design abstract of Touch screen sensor working of speed control of dc motor using ir remote DC motor speed control using diac and triac diac 240V ST6210 TOUCH SENSOR. PUSH BUTTON. POTENTIOMETER
    Text: APPLICATION NOTE A MINI GUIDE TO THE APPLICATION NOTE INDEX IN THE 8-BIT MCUs BULLETIN BOARD SYSTEM By Ian Blythe How to Use this Guide This guide shows how to use the Application Note Index program from SGS-THOMSON. This program is available on-line through the SGS-THOMSON Bulletin Board Systems BBSs telephone numbers are listed in this document , and also can be downloaded from the BBSs


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    64X16 led matrix

    Abstract: TDA8172A 12v 400W AUDIO AMPLIFIER TEA2037 tda2824s TDA8214A CQFP-100 12v 40w tda2040 amplifier circuit tda2030 CQFP100
    Text: SELECTION GUIDE For detailed information on products referred to in the selection guide but not included as datasheet in this book, please refer to the databook indicated in column "DB" SG S-THOMSON DATABOOKS DB O RDER CODE a 4 BIT MCU FAMILY ET9400 DBET9400ST/1


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    ET9400 EF6801/04/05 CB12000 ISB12000 ISB9000 ISB18000 ST6326/27/28/ ST6356/57/58 ST6340/42/44/46 64X16 led matrix TDA8172A 12v 400W AUDIO AMPLIFIER TEA2037 tda2824s TDA8214A CQFP-100 12v 40w tda2040 amplifier circuit tda2030 CQFP100 PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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