2331-ZX
Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than
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2331-ZX
2331-ZX.
J-STD-004,
IPC-TM-650,
04Jun07
Sn62Pb36Ag02
sn63pb37 solder wire
Kester LIQUID FLUX
IPC-TM650
sn63pb37 solder wire shelf life
ZX 650
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NORTHBRIDGE* reflow
Abstract: pin diagram AMD phenom II - X4 RX980 990FX RD990 ATI RADEON reflow profile RD980 amd RADEON igp 215-0716046 AMD Phenom II x4
Text: AMD 990FX/990X/970 Databook Technical Reference Manual Rev 3.00 P/N: 48691_990FX_ds_nda 2012 Advanced Micro Devices, Inc. Trademarks AMD, the AMD Arrow logo, AMD Phenom, AMD Cool'n'Quiet, and combinations thereof, ATI, the ATI logo, Radeon, and CrossFire are trademarks of Advanced
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990FX/990X/970
RD990
NORTHBRIDGE* reflow
pin diagram AMD phenom II - X4
RX980
990FX
ATI RADEON reflow profile
RD980
amd RADEON igp
215-0716046
AMD Phenom II x4
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SN62PB36AG02
Abstract: sn63pb37 solder wire J-STD-004 solder wire rom1 sn63pb37 solder wire shelf life kester Sn62Pb36Ag02 J-STD-004 Rosin Activated Core Wire kester 44 rosin SN63PB37 IPC-TM-650
Text: 44 Activated Rosin Cored Wire Product Description Reliability Properties Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An
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J-STD-004,
IPC-TM-650,
26Mar10
SN62PB36AG02
sn63pb37 solder wire
J-STD-004 solder wire rom1
sn63pb37 solder wire shelf life
kester Sn62Pb36Ag02
J-STD-004
Rosin Activated Core Wire
kester 44 rosin
SN63PB37
IPC-TM-650
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bellcore GR-78
Abstract: sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire GR-78 sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245
Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have
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MIL-F-14256.
GR-78
J-STD-004,
IPC-TM-650,
J-STD-00ions
15Jun07
bellcore GR-78
sn63pb37 solder wire
sn63pb37 solder wire shelf life
kester 245 solder wire
sn63pb37
Sn62Pb36Ag02
ROSIN FLUX TYPE ROL0
245 Rosin Flux Cored Solder
Kester 245
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Abstract: kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650
Text: 48 Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester
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J-STD-004,
IPC-TM-650,
J-STD-00ions
14Jun07
J-STD-004 solder wire rom1
kester 285 solder wire
J-STD-004
Kester
Kester* 1544
kester 245 solder wire
kester Sn62Pb36Ag02
Sn62Pb36Ag02
IPC-TM-650
IPC-TM650
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RS600ME
Abstract: amd athlon 64 x2 motherboard schematic block diagram RS600ME-SB600-DDR2 ATI SB460 218S6ECLA21FG 8254 TIMER amd SB600 218S6ECLA21FG sb600 amd RADEON igp SB460
Text: SB600 Databook Technical Reference Manual Rev. 3.05 P/N: 42119_sb600_ds_3.05 2007-2008 Advanced Micro Devices, Inc. Trademarks AMD, the AMD Arrow logo, Athlon, and combinations thereof, ATI, ATI logo, Radeon, and CrossFire are trademarks of Advanced Micro Devices, Inc.
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SB600
RS600ME
amd athlon 64 x2 motherboard schematic block diagram
RS600ME-SB600-DDR2
ATI SB460
218S6ECLA21FG
8254 TIMER
amd SB600 218S6ECLA21FG
amd RADEON igp
SB460
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astm D150
Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™
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D5470
IPC-TM-650
astm D150
D412
ASTM D412
ASTM D5470
ASTM D2240, D412
ASTM D2240
T-Flex 200
Outgassing
CVCM
ASTM
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H9723
Abstract: h9740 l9718 L9712 L9709 L9727 T9934 l9731 L9706 l9735
Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS April 1998 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 QUALITY & RELIABILITY MONITOR REPORT April 1998 TABLE OF CONTENTS Section I: Introduction Section II:
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9808M
9806M
9807M
H9723
h9740
l9718
L9712
L9709
L9727
T9934
l9731
L9706
l9735
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RO4403
Abstract: Rogers RO4003 rt/duroid 5880 RO4450F rogers 5880 RO3006 RO4350B rogers laminate materials RO4450B RO3210
Text: Ordering Information: Standard Thickness, Tolerance and Panel Size Rogers’ high frequency laminates can be purchased by contacting a Rogers Customer Service Representative at 480 961-1382 or one of our international offices listed below. To ensure that you receive the material for your application, please include order information for each of the
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6010LM,
RO3003
RO3035
RO3203
RO3006
RO3206
RO3010
RO3210
RO4003C
RO4350B
RO4403
Rogers RO4003
rt/duroid 5880
RO4450F
rogers 5880
RO3006
rogers laminate materials
RO4450B
RO3210
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IPC-SM-786A
Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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Thermal Gap Filler
Abstract: D149 D2240 D257 D412 E595
Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this
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A14175-00
Thermal Gap Filler
D149
D2240
D257
D412
E595
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Untitled
Abstract: No abstract text available
Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing
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50psi,
300-H
A15293-00
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Untitled
Abstract: No abstract text available
Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR200
A16503-00
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D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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Abstract: No abstract text available
Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil
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EP256
21Sep09
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Untitled
Abstract: No abstract text available
Text: SMT International, LLC P.O. Box 989 Deep River, CT 06417 Toll Free: 800.435.0317 Phone: 860.526.8243 Fax: 860.526.8243 AMTECH Advanced SMT Solder Products www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet for Chip Quik Pt # SMD4300AX10 w/lead
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SMD4300AX10
900Kcps
450Kcps
IPC-TM-650
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Untitled
Abstract: No abstract text available
Text: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish
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833FRB
833FRB
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Untitled
Abstract: No abstract text available
Text: 3M Moisture Barrier Bag Dri-Shield 2000 Product Data Sheet Product Data Sheet 3M™ Moisture Barrier Bag Dri-Shield 3000 This foil moisture barrier bag is designed to provide a static safe environment for sensitive electronic devices. A nylon layer helps to strengthen the bag. The bags are
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F1249
MIL-STD-3010C
IPC-TM-650
051A/3052.
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS TDS #CW 8300 Technical Data Sheet CircuitWorks Water Soluble Flux Pen PRODUCT DESCRIPTION CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic
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Abstract: No abstract text available
Text: Product Data Sheet Product Data Sheet 3M Moisture Barrier Bag 3370 This aluminized moisture barrier bag is designed to provide a static safe environment for sensitive electronic devices. The bags are heat sealable and suitable for vacuum packaging. Bags are printed with ESD and moisture warning symbols and a lot code for traceability.
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grams/100
051A/3052.
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Untitled
Abstract: No abstract text available
Text: Product Data Sheet Product Data Sheet 3M Metal-Out Static Shielding Bag 1500 This transparent metal-out static shielding bag is designed to provide a static safe environment for sensitive electronic devices. Bags are printed with an ESD warning symbol and a lot code for traceability. Open top and ZipTop styles are available. The
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Bag1500
MIL-STD-3010C
IPC-TM-650
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jedec package MO-247
Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB
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AC322
jedec package MO-247
qfn 88 stencil
QN180
IEC-68-2-32
QFN PCB Layout guide
QN108
Amkor TSCSP
qfn 32 land pattern
IPC-TM-650 2.6.9
QN180 outline
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kester 245 solder wire
Abstract: bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 GR-78 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650
Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have
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MIL-F-14256.
GR-78
12Jul06
kester 245 solder wire
bellcore GR-78
kester 245
sn63pb37 solder wire
ROSIN FLUX TYPE ROL0
sn63pb37 solder wire shelf life
J-STD-004
Kester
IPC-TM650
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SMD-291AX
Abstract: No abstract text available
Text: SMT International, LLC P.O. Box 989 AMTECH D e e p R ive r , C T 0 6 4 1 7 Toll free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 Advanced SMT Solder Products www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet for Chip Quik Pt#
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SMD291AX
SMD291AX10
900Kcps
IPC-TM-650
SMD-291AX
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