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    IPC7525 LGA MATERIAL Search Results

    IPC7525 LGA MATERIAL Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    UE62B46230S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    UE62B46200S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions

    IPC7525 LGA MATERIAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		PDF 101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    Untitled

    Abstract: No abstract text available
    Text: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •


    Original     		PDF TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA

    Untitled

    Abstract: No abstract text available
    Text: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •


    Original     		PDF TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA

    Untitled

    Abstract: No abstract text available
    Text: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •


    Original     		PDF TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA

    Untitled

    Abstract: No abstract text available
    Text: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3A – JUNE 2014 – REVISED JUNE 2014 TPS82740x 360nA IQ MicroSIPTM Step Down Converter Module for Low Power Applications 1 Features • • •


    Original     		PDF TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA