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    IOR 229H Search Results

    IOR 229H Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68031-229HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. Visit Amphenol Communications Solutions
    68604-229HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68002-229HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68016-229HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100) Pitch. Visit Amphenol Communications Solutions
    68015-229HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    IOR 229H Datasheets Context Search

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    8X305

    Abstract: 8X305 assembly manual HP1650A d3800 dp8340 ior 227h Specification of seven segment 5250 PC327 TK 9107 8X305 manual
    Text: MPA-II National Semiconductor Application Note 641 Thomas Norcross Paul J Patchen Thomas J Quigley Tim Short Debra Worsley Laura Johnson April 1995 Table of Contents 1 0 INTRODUCTION About This System User Guide Contents of the MPA-II Design Evaluation Kit


    Original     		DP8344B 20-3A 8X305 8X305 assembly manual HP1650A d3800 dp8340 ior 227h Specification of seven segment 5250 PC327 TK 9107 8X305 manual PDF