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    INTEL TRAY MECHANICAL DRAWINGS Search Results

    INTEL TRAY MECHANICAL DRAWINGS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MD82C288-10/R Rochester Electronics LLC Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MD87C51/BQA Rochester Electronics LLC Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MG87C196KC/B Rochester Electronics LLC Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy

    INTEL TRAY MECHANICAL DRAWINGS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ATMEL 220 24C16

    Abstract: datasheet for atmel 416 24c16 an 24C16 pinout detail IPMB PICMG 2 11 R1 0 CompactPCI Power Interface IPMB Address AT24C16 ZT 7102 intel tray mechanical drawings carrier fru information
    Text: Intel NetStructureTM ZT 7102 Chassis Management Module Design Guide September 2002 Order Number: 273774-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


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    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING

    L358

    Abstract: 80523PY400512PE L357 q738
    Text: Product Change Notification Please respond your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth


    Original     		PDF 50-Unit L358 80523PY400512PE L357 q738

    processor Mobile Intel Pentium 4 socket 478

    Abstract: 512484799
    Text: Processor and IC Sockets Micro PGA Sockets. J-2 to J-3 Visit www.molex.com to access more part numbers and product information,


    Original     		PDF PS-51248-005 PS-51248-020 Area--10m" processor Mobile Intel Pentium 4 socket 478 512484799

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    SECC material

    Abstract: 80523PY350512PE L356 q558
    Text: Change Notification #: 685 Change Title: Pentium II Processor on 0.25µ Packaging and Cover-mark Conversion 350 MHz dB0 PLGA Date of PCN Publication: September 16, 1998 Type of Change Notification: Addendum to Previous Form-Fit-Function Notification Key Characteristics of the Change:


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    sop package tray

    Abstract: 29754* intel weight of SOP package SOP JEDEC tray
    Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.


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    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


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    ic 6116 datasheet from texas instruments

    Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
    Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


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    transistor d525

    Abstract: transistor D525 equivalent FCBGA559 PBGA437 SLB73 intel i5 MOTHERBOARD pcb CIRCUIT diagram SLBXC D525 AU80610006237AA SLBX9 NM10 Express Chipset N475 SLBX5
    Text: Intel Atom Processor 230∆ Series Datasheet April 2010 Document Number: 319977-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT


    Original     		PDF i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. 07-Sep-2011 transistor d525 transistor D525 equivalent FCBGA559 PBGA437 SLB73 intel i5 MOTHERBOARD pcb CIRCUIT diagram SLBXC D525 AU80610006237AA SLBX9 NM10 Express Chipset N475 SLBX5

    T2300 intel

    Abstract: PPGA478 intel 945 motherboard 945 chip intel motherboard intel core solo overview product LE80538UE0092M ICH7M-DH INTEL 945 FAMILY express chipset T2700 LE80539LF0282M
    Text: Intel Core Duo Processor and Intel® Core™ Solo Processor on 65 nm Process Datasheet January 2007 Document Number: 309221-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		PDF ts/27247/Intel-Core-Solo-Processor-U1400- 06-Sep-2011 U1400 i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. T2300 intel PPGA478 intel 945 motherboard 945 chip intel motherboard intel core solo overview product LE80538UE0092M ICH7M-DH INTEL 945 FAMILY express chipset T2700 LE80539LF0282M

    intel 2102 Static RAM

    Abstract: AF000047 50-pin lcd connector pinout sata hot plug CIRCUIT diagram 50-pin ATAPI dimensions hot swap connectors SR2500AL lsi 7622 r1 SR2500 pcie riser
    Text: Intel Server Chassis SR2500 Intel® Server System SR2500AL Technical Product Specification Intel order number D31980-004 Revision – 1.00 June 2006 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server System SR2500AL Revision History


    Original     		PDF SR2500 SR2500AL D31980-004 S5000PAL SR2500 intel 2102 Static RAM AF000047 50-pin lcd connector pinout sata hot plug CIRCUIT diagram 50-pin ATAPI dimensions hot swap connectors SR2500AL lsi 7622 r1 pcie riser

    pcie X1 edge

    Abstract: PCIE peg footprint pcie x16 right angle connector
    Text: www.erni.com www.erni.com Catalog E XXXXXX 09/08 Edition 1 PCI Express Right Angle Connector System Table of Contents General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		PDF 23230/USA pcie X1 edge PCIE peg footprint pcie x16 right angle connector

    Untitled

    Abstract: No abstract text available
    Text: PCI Express Right Angle Connector System www.erni.com Catalog E XXXXXX 09/08 Edition 1  www.erni.com Catalog E XXXXXX 09/08 Edition 1 PCI Express Right Angle Connector System Table of Contents General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		PDF 23230/USA

    PPGA478

    Abstract: sl6pc manual 865gv motherboard intel 845GL users manual RK80532PE072512 SL6PF figure intel pentium 4 processor input 777 socket fcpga pentium m ppga478 845 intel chipset motherboard circuit 478 SOCKET
    Text: Intel Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process and Intel® Pentium® 4 Processor Extreme Edition Supporting Hyper-Threading Technology1 Datasheet 2 GHz – 3.40 GHz Frequencies Supporting Hyper-Threading Technology1 at 3.06 GHz with 533 MHz System Bus and All


    Original     		PDF 512-KB roducts/27447/Intel-Pentium-4-Processor-2 80-GHz-512K-Cache-. 21-Sep-2011 PPGA478 sl6pc manual 865gv motherboard intel 845GL users manual RK80532PE072512 SL6PF figure intel pentium 4 processor input 777 socket fcpga pentium m ppga478 845 intel chipset motherboard circuit 478 SOCKET

    E4400

    Abstract: E6750 12V FAN CONTROL BY USING THERMISTOR E6600 Intel E4400 Intel Core 2 Duo E6750 Intel Core 2 Duo Processor E4500 e4300 LGA 2011 cooler intel i5 MOTHERBOARD pcb CIRCUIT diagram
    Text: Intel Core 2 Extreme Processor X6800Δ and Intel® Core™2 Duo Desktop Processor E6000Δ and E4000Δ Sequences Datasheet —on 65 nm Process in the 775-land LGA Package and supporting Intel® 64 Architecture and supporting Intel® Virtualization Technology±


    Original     		PDF X6800 E6000 E4000 775-land 72630QM 72635QM 72670QM 72675QM 52430M 52435M E4400 E6750 12V FAN CONTROL BY USING THERMISTOR E6600 Intel E4400 Intel Core 2 Duo E6750 Intel Core 2 Duo Processor E4500 e4300 LGA 2011 cooler intel i5 MOTHERBOARD pcb CIRCUIT diagram

    82801gb

    Abstract: Intel 82801GB ich7 82801GB circuit 945G MOTHERBOARD CIRCUIT diagram 945p 82801gr 82801HH 82801HB intel 915gl
    Text: Intel Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531 and 520/521∆ Supporting Hyper-Threading Technology1 Datasheet On 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ May 2005 Document Number: 302351-004


    Original     		PDF 775-land i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. entium-4-Processor-530J-supporting-HT-Tec 05-Sep-2011 82801gb Intel 82801GB ich7 82801GB circuit 945G MOTHERBOARD CIRCUIT diagram 945p 82801gr 82801HH 82801HB intel 915gl

    PPGA478

    Abstract: X7800 82801hbm ICH8M intel 965 motherboard circuit diagram 82801HBM Intel BGA U770 U7700 intel core i5-2430m U7600
    Text: Intel Core 2 Duo Processors and Intel® Core™2 Extreme Processors for Platforms Based on Mobile Intel® 965 Express Chipset Family Datasheet January 2008 Document Number: 316745-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		PDF i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. 12-Sep-2011 PPGA478 X7800 82801hbm ICH8M intel 965 motherboard circuit diagram 82801HBM Intel BGA U770 U7700 intel core i5-2430m U7600