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    INTEL SMALL OUTLINE PACKAGE GUIDE Search Results

    INTEL SMALL OUTLINE PACKAGE GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL SMALL OUTLINE PACKAGE GUIDE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sop package tray

    Abstract: 29754* intel weight of SOP package SOP JEDEC tray
    Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.


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    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    28F640J5a

    Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
    Text: Flash Memory Quick Reference Guide ion 4 Vers ’98 June Flash Memory Components for New Designs New designs should be based on Intel’s “components for new designs” shown in bold text in this guide. For information on our full product line, including extended temperature products, contact your Intel Sales representative/distributor or refer to our linecard available on Intel’s Web site.


    Original     		PDF 28F320C3a 28F032C3a 28F320LSA USA/698/10K/MS 28F640J5a iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3

    28F032SA

    Abstract: AP-644 5v strataflash 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 28f320s5
    Text: E AP-644 APPLICATION NOTE Intel StrataFlash Memory Migration Guide September 1997 Order Number: 292202-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-644 AP-646 AP-647 28F032SA AP-644 5v strataflash 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 28f320s5

    IPC-J-STD-001

    Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
    Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures


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    SmartDie

    Abstract: 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
    Text: Flash Memory Quick Reference Guide ion 5 Vers ’98 Aug. Intel package lineup Intel Package Lineup Refer to Intel’s World Wide Web Site for Additional Flash Information Development Tools/Electronic Tools Catalog http://developer.intel.com/design/flash/swtools/


    Original     		PDF USA/0898/15K/MS SmartDie 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3

    28F032SA

    Abstract: 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 AP-644 Intel 56 TSOP 29220* intel
    Text: E AP-644 APPLICATION NOTE Intel StrataFlash Memory Migration Guide December 1997 Order Number: 292202-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-644 AP-646 AP-647 28F032SA 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 AP-644 Intel 56 TSOP 29220* intel

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    DAEWON tray tsop 48LD

    Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
    Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures


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    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


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    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    MO-195

    Abstract: Intel BGA Solder BGA PACKAGE OUTLINE flash memory databook World transistors databook 28F008B3 28F016B3 28F016S3 28F160B3 28F160S3
    Text: 1.0 THE µBGA* PACKAGE: INTEL’S LATEST FLASH MEMORY PACKAGE 1.1 Introduction During the last several years, Intel’s Flash Memory Components Division has conducted research on next-generation Chip-Size Packaging CSP for flash memory. Intel’s customers in


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    28F160S3

    Abstract: 28F320J5 28F640J5 29221* intel intel 44-lead psop
    Text: E AP-660 APPLICATION NOTE Intel StrataFlash Memory 0.25 µ Generation Migration Guide May 1998 Order Number: 292218-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-660 28F160S3, 28F320S3 AP-646 AP-647 28F160S3 28F320J5 28F640J5 29221* intel intel 44-lead psop

    Meritec 800 860-9014

    Abstract: LFS File Manager Software vhdl code for home automation ,vhdl code for implementation of eeprom intel Programmers Reference Manual pAL programming Guide Block Management Layer Programmer eeprom programmer schematic flash memory databook Flash Memory Product Selector Guide
    Text: 6.0 THE µBGA* PACKAGE TOOLS AND SOFTWARE SUPPORT 6.1 Tools and Software Support Overview Regardless of what stage you are at in the definition, design, prototyping, or production process of your product, Intel supplies the tools and software support that saves you time and


    Original     		PDF 24-hours Meritec 800 860-9014 LFS File Manager Software vhdl code for home automation ,vhdl code for implementation of eeprom intel Programmers Reference Manual pAL programming Guide Block Management Layer Programmer eeprom programmer schematic flash memory databook Flash Memory Product Selector Guide

    intel pentium 4 motherboard schematic diagram

    Abstract: pentium 4 motherboard schematic diagram intel pentium 3 motherboard schematic diagram intel MOTHERBOARD pcb CIRCUIT diagram 40 pin zif socket free circuit diagram of motherboard 423 motherboard intel schematics diagram ATX MOTHERBOARD schematic intel MOTHERBOARD pcb design in pentium 4 motherboard CIRCUIT diagram
    Text: 423 Pin Socket PGA423 Design Guidelines November, 2000 Order Number: 249207-001 ® 423 Pin Socket Design Guidelines Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and


    Original     		PDF PGA423) IEC60 intel pentium 4 motherboard schematic diagram pentium 4 motherboard schematic diagram intel pentium 3 motherboard schematic diagram intel MOTHERBOARD pcb CIRCUIT diagram 40 pin zif socket free circuit diagram of motherboard 423 motherboard intel schematics diagram ATX MOTHERBOARD schematic intel MOTHERBOARD pcb design in pentium 4 motherboard CIRCUIT diagram

    3 Volt Intel StrataFlash Memory

    Abstract: INTEL STRATAFLASH AP-660 56-Lead TSOP Package Date Code Formats intel Intel CSP memory 1998 TSOP 56 Package 28F008S3 28F320J5 28F640J5
    Text: E AP-660 APPLICATION NOTE Migration Guide to 3 Volt Intel StrataFlash Memory December 1998 NOTE: This document formerly known as Intel® StrataFlash™ Memory 0.25 µ Generation Migration Guide. Order Number: 292218-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-660 AP-647 AP-646 AP-644 3 Volt Intel StrataFlash Memory INTEL STRATAFLASH AP-660 56-Lead TSOP Package Date Code Formats intel Intel CSP memory 1998 TSOP 56 Package 28F008S3 28F320J5 28F640J5

    INTEL fcBGA PACKAGE thermal resistance

    Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
    Text: Ultra Low Voltage Intel Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide October 2002 Order Number: 273802-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"

    E11663-001

    Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
    Text: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original     		PDF 5M-1994 E11663-001 Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force