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    INTEL PLCC 68 DIMENSIONS TAPE Search Results

    INTEL PLCC 68 DIMENSIONS TAPE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    DP83910AV/63SN Texas Instruments CMOS SNI Serial Network Interface 28-PLCC Visit Texas Instruments
    TPS51624RSMR Texas Instruments 4.5V to 28V, 1/2-Phase Step-Down Driverless Controller for Intel VR12.6 CPUs 32-VQFN -40 to 105 Visit Texas Instruments Buy
    TPS51624RSMT Texas Instruments 4.5V to 28V, 1/2-Phase Step-Down Driverless Controller for Intel VR12.6 CPUs 32-VQFN -40 to 105 Visit Texas Instruments Buy
    TPS62134DRGTR Texas Instruments 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 Visit Texas Instruments Buy
    TPS62134BRGTT Texas Instruments 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 Visit Texas Instruments Buy
    TPS62134ARGTR Texas Instruments 17-V Input, Step-down Converter With Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 Visit Texas Instruments Buy

    INTEL PLCC 68 DIMENSIONS TAPE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    Untitled

    Abstract: No abstract text available
    Text: XR16C854/854D 2.97V TO 5.5V QUAD UART WITH 128-BYTE FIFO APRIL 2013 REV. 3.1.0 GENERAL DESCRIPTION FEATURES The XR16C854/854D1 854 is an enhanced quad Universal Asynchronous Receiver and Transmitter (UART) each with 128 bytes of transmit and receive FIFOs, transmit and receive FIFO counters and


    Original     		PDF XR16C854/854D 128-BYTE XR16C854/854D1 64-pin 68-pin 100-pin 64-phe

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		PDF CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    manual FW82801BA motherboard

    Abstract: intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard
    Text: NOTE: PLEASE ADJUST SPINE TO PROPER WIDTH Europe Intel Corporation UK Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK Phone: England (44) 1793 403 000 France (33) 1 4694 7171 Germany (49) 89 99143 0 Italy (39) 02 575 441 Israel (972) 2 589 7111 Netherlands (31) 20 659 1800


    Original     		PDF USA/2004/10K/MD/HP manual FW82801BA motherboard intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard

    LG color tv Circuit Diagram schematics

    Abstract: Solid state CCIR ca 152 LG 631 TV LG power supply CC211 LG color tv Circuit of vertical section Diagram schematics Color TV Signal Encoder pal LG lg tv electronic schematic s/ksmh12/2.27/30/ecg philips semiconductor master book
    Text: ; CL-GD1052IGD1053 'CIRRUS LOGIC FEATURES Digital NTSC/PAL Encoder with Flicker-Filter Preprocessor • TV encoder — VGA controller and MPEG digital encoder inputs — NTSC and PAL output ■ S-Video and composite video output — S-Video luminance and chrominance


    OCR Scan     		PDF CL-GD1052IGD1053 CL-GD1052: CL-GD1053: CL-GD1053) CL-GD1052/GD1053 CL-GD1052/system, LG color tv Circuit Diagram schematics Solid state CCIR ca 152 LG 631 TV LG power supply CC211 LG color tv Circuit of vertical section Diagram schematics Color TV Signal Encoder pal LG lg tv electronic schematic s/ksmh12/2.27/30/ecg philips semiconductor master book

    LG color tv Circuit Diagram schematics

    Abstract: CL-GD1052IGD1053 IRf 9112 schematic diagram tv monitor advance 17 CL-GD5465 GD1Q Solid state CCIR ca 152 LG color tv Circuit of vertical section Diagram schematics lg tv electronic board schematic LG 631 TV LG power supply
    Text: ; CL-GD1052IGD1053 'CIRRUS LOGIC FEATURES Digital NTSC/PAL Encoder with Flicker-Filter Preprocessor • TV encoder — VGA controller and MPEG digital encoder inputs — NTSC and PAL output ■ S-Video and composite video output — S-Video luminance and chrominance


    OCR Scan     		PDF CL-GD1052IGD1053 CL-GD1052: CL-GD1053: CL-GD1053) D1052/G D1053 CL-GD1052 LG color tv Circuit Diagram schematics CL-GD1052IGD1053 IRf 9112 schematic diagram tv monitor advance 17 CL-GD5465 GD1Q Solid state CCIR ca 152 LG color tv Circuit of vertical section Diagram schematics lg tv electronic board schematic LG 631 TV LG power supply

    CL-GD1052IGD1053

    Abstract: schematic diagram tv monitor advance 17 data book electronique schematic diagram tv monitor advance schematic diagram vga to tv 8893 single chip tv processor cirrus logic cl-gd CL-GD5465 westlake capacitors Composite Video to VGA decoder
    Text: CL-GD1052/GD1053 'CIRRUS LOG/C Advance Data Book FEATURES Digital NTSC/PAL Encoder with Flicker-Filter Preprocessor • TV encoder — VGA controller and MPEG digital encoder inputs — NTSC and PAL output C L -G D 10 52: w ith o u t M acrovision® C L -G D 10 53: w ith M acrovision® Rev. 7


    OCR Scan     		PDF CL-GD1053) CL-GD1052IGD1053 schematic diagram tv monitor advance 17 data book electronique schematic diagram tv monitor advance schematic diagram vga to tv 8893 single chip tv processor cirrus logic cl-gd CL-GD5465 westlake capacitors Composite Video to VGA decoder

    INTEL 3226

    Abstract: 1666B
    Text: 34E D MACRONIX INC MX2332/33 St=00005 □QQDlt.3 L, p r e l im in a r y 4 0 9 6 X Ö STATIC READ ONLY MEMORY FEATURES DESCRIPTION . 4096 X 8-bit organization . Single +5V supply . Access time - 300 ns [max] . Totally static operation . Complete TTL compatible


    OCR Scan     		PDF MX2332/33 MX2332 MX2333 MX2332/3 Interfa29 000sq. INTEL 3226 1666B