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    INTEL PGA 132 PACKAGING Search Results

    INTEL PGA 132 PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL PGA 132 PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    KU80486SX

    Abstract: 240486 KU80486SXSA33 ku80486 272769 240950 A80486SXSA33 SL ENHANCED I486 D1542 a80486sx
    Text: Embedded Intel486 SX Processor Datasheet Product Features • ■ ■ ■ ■ 32-Bit RISC Technology Core 8-Kbyte Write-Through Cache Four Internal Write Buffers Burst Bus Cycles Dynamic Bus Sizing for 8- and 16-bit Data Bus Devices SL Technology ■ ■


    Original     		PDF Intel486TM 32-Bit 16-bit 196-Lead 168-Pin 64-Bit KU80486SX 240486 KU80486SXSA33 ku80486 272769 240950 A80486SXSA33 SL ENHANCED I486 D1542 a80486sx

    D1388

    Abstract: 240486 4407 pin details 6T8A 196-LEAD D1846 196LEAD N1711 INTELDX4 PROCESSOR 240950
    Text: Embedded Intel486 SX Processor Datasheet Product Features • ■ ■ ■ ■ 32-Bit RISC Technology Core 8-Kbyte Write-Through Cache Four Internal Write Buffers Burst Bus Cycles Dynamic Bus Sizing for 8- and 16-bit Data Bus Devices SL Technology ■ ■


    Original     		PDF Intel486TM 32-Bit 16-bit 196-Lead 168-Pin 64-Bit D1388 240486 4407 pin details 6T8A D1846 196LEAD N1711 INTELDX4 PROCESSOR 240950

    29f040b

    Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
    Text: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3


    Original     		PDF DMD2006F 29f040b teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6

    TA80960KB

    Abstract: LAD1 5V Intel 80960kb programmers reference 80960KA 80960KB 80960MC Intel 80960kb
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB LAD1 5V Intel 80960kb programmers reference 80960KA 80960MC Intel 80960kb

    TA80960KB

    Abstract: 80960KA 80960KB 80960MC LAD1 12v
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB 80960KA 80960MC LAD1 12v

    TA80960kb

    Abstract: NG80960KB-25 80960KA 80960KB 80960MC
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960kb NG80960KB-25 80960KA 80960MC

    A80486DX4WB100

    Abstract: INTEL A80486DX4WB100 240486 FC80486DX4WB100 intel A3260 A3232 INTELDX4 PROCESSOR Designing the IntelDX4 Processor into WB75 A3232-01
    Text: EMBEDDED WRITE-BACK ENHANCED IntelDX4 PROCESSOR • Up to 100 MHz Operation ■ SL Technology ■ Integrated Floating-Point Unit ■ Data Bus Parity Generation and Checking ■ Speed-Multiplying Technology ■ Boundary Scan JTAG ■ 32-Bit RISC Technology Core


    Original     		PDF 32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit A80486DX4WB100 INTEL A80486DX4WB100 240486 FC80486DX4WB100 intel A3260 A3232 INTELDX4 PROCESSOR Designing the IntelDX4 Processor into WB75 A3232-01

    240486

    Abstract: INTELDX4 write-through
    Text: EMBEDDED IntelDX2 PROCESSOR • Integrated Floating-Point Unit ■ SL Technology ■ Speed-Multiplying Technology ■ Data Bus Parity Generation and Checking ■ 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor, 50 MHz, 25 MHz CLK


    Original     		PDF 32-Bit 208-Lead 168-Pin 16-bit 64-Bit 240486 INTELDX4 write-through

    SB80486DX2SC50

    Abstract: processor cross reference 240486
    Text: EMBEDDED IntelDX2 PROCESSOR • Integrated Floating-Point Unit ■ SL Technology ■ Speed-Multiplying Technology ■ Data Bus Parity Generation and Checking ■ 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor, 50 MHz, 25 MHz CLK


    Original     		PDF 32-Bit 208-Lead 168-Pin 16-bit 64-Bit SB80486DX2SC50 processor cross reference 240486

    A10186

    Abstract: INTELDX4 PROCESSOR A80486DX4WB100 A80486 240486 FC80486DX4WB100 A3232-01 INTEL A80486DX4WB100 FC80486DX4WB75 241618
    Text: A EMBEDDED WRITE-BACK ENHANCED IntelDX4 PROCESSOR • Up to 100 MHz Operation ■ SL Technology ■ Integrated Floating-Point Unit ■ Data Bus Parity Generation and Checking ■ Speed-Multiplying Technology ■ Boundary Scan JTAG ■ 32-Bit RISC Technology Core


    Original     		PDF 32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit A10186 INTELDX4 PROCESSOR A80486DX4WB100 A80486 240486 FC80486DX4WB100 A3232-01 INTEL A80486DX4WB100 FC80486DX4WB75 241618

    240486

    Abstract: A80486DX2 SB80486DX2SC50 208-LEAD sqfp INC1F-16 A80486DX2SA66 241618 sb80486dx t35 4 c8 A11182
    Text: A EMBEDDED IntelDX2 PROCESSOR • Integrated Floating-Point Unit ■ SL Technology ■ Speed-Multiplying Technology ■ Data Bus Parity Generation and Checking ■ 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor, 50 MHz, 25 MHz CLK


    Original     		PDF 32-Bit 208-Lead 16-bit 168-Pin 64-Bit 240486 A80486DX2 SB80486DX2SC50 208-LEAD sqfp INC1F-16 A80486DX2SA66 241618 sb80486dx t35 4 c8 A11182

    X80486DX4WB100

    Abstract: 240486 INTELDX4 PROCESSOR 273021
    Text: EMBEDDED WRITE-BACK ENHANCED IntelDX4 PROCESSOR • Up to 100 MHz Operation ■ SL Technology ■ Integrated Floating-Point Unit ■ Data Bus Parity Generation and Checking ■ Speed-Multiplying Technology ■ Boundary Scan JTAG ■ 32-Bit RISC Technology Core


    Original     		PDF 32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit X80486DX4WB100 240486 INTELDX4 PROCESSOR 273021

    132 pin PGA socket 80960

    Abstract: 80960JA 80960JD 80960JF A80960JD NG80960JD 27248
    Text: PRELIMINARY 80960JD EMBEDDED 32-BIT MICROPROCESSOR • Pin/Code Compatible with all 80960Jx ■ High Bandwidth Burst Bus Processors ■ High-Performance Embedded Architecture ■ ■ ■ ■ — One Instruction/Clock Execution — Core Clock Rate is 2x the Bus Clock


    Original     		PDF 80960JD 32-BIT 80960Jx 80960JD 132 pin PGA socket 80960 80960JA 80960JF A80960JD NG80960JD 27248

    80960JA

    Abstract: 80960JD 80960JF A80960JD NG80960JD 132-lead 27248 intel packaging handbook 240800
    Text: A PRELIMINARY 80960JD EMBEDDED 32-BIT MICROPROCESSOR • Pin/Code Compatible with all 80960Jx Processors ■ High-Performance Embedded Architecture — One Instruction/Clock Execution — Core Clock Rate is 2x the Bus Clock — Load/Store Programming Model


    Original     		PDF 80960JD 32-BIT 80960Jx 80960JD 80960JA 80960JF A80960JD NG80960JD 132-lead 27248 intel packaging handbook 240800

    242202

    Abstract: a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive
    Text: intei EMBEDDED ln te lD X 2 T M Integrated Floating-Point Unit Speed-Multiplying Technology PROCESSOR Data Bus Parity Generation and Checking 32-Bit RISC Technology Core Boundary Scan JTAG 8-Kbyte Write-Through Cache 3.3V Processor, 50 MHz, 25 MHz CLK — 208-Lead Shrink Quad Flat Pack


    OCR Scan     		PDF 32-Bit 16-bit 208-Lead 168-Pin BOFFtA20M# 242202 a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive

    pga 132 packaging

    Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
    Text: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar­ ranged 0.100 inch (2.54mm) center-to-center, In a


    OCR Scan     		PDF l386TM Intel386 132-pin pga 132 packaging 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket