INTEL PGA 132 PACKAGING Search Results
INTEL PGA 132 PACKAGING Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) |
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TPH2R408QM |
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MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance |
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XPH2R106NC |
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N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) |
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XPH3R206NC |
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N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) |
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TPH4R008QM |
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MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) |
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INTEL PGA 132 PACKAGING Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
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PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 | |
TSOP 56 socket
Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
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68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 | |
MIL-STD-81705
Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
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MIL-STD-81705
Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
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CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray | |
Side Brazed Ceramic Dual-In-Line Packages
Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
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CERAMIC CHIP CARRIER LCC 68 socket
Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
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MQFP Shipping Trays
Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
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JEDEC TRAY DIMENSIONS
Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
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KU80486SX
Abstract: 240486 KU80486SXSA33 ku80486 272769 240950 A80486SXSA33 SL ENHANCED I486 D1542 a80486sx
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Intel486TM 32-Bit 16-bit 196-Lead 168-Pin 64-Bit KU80486SX 240486 KU80486SXSA33 ku80486 272769 240950 A80486SXSA33 SL ENHANCED I486 D1542 a80486sx | |
D1388
Abstract: 240486 4407 pin details 6T8A 196-LEAD D1846 196LEAD N1711 INTELDX4 PROCESSOR 240950
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Intel486TM 32-Bit 16-bit 196-Lead 168-Pin 64-Bit D1388 240486 4407 pin details 6T8A D1846 196LEAD N1711 INTELDX4 PROCESSOR 240950 | |
29f040b
Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
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DMD2006F 29f040b teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6 | |
TA80960KB
Abstract: LAD1 5V Intel 80960kb programmers reference 80960KA 80960KB 80960MC Intel 80960kb
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80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB LAD1 5V Intel 80960kb programmers reference 80960KA 80960MC Intel 80960kb | |
TA80960KB
Abstract: 80960KA 80960KB 80960MC LAD1 12v
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80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB 80960KA 80960MC LAD1 12v | |
TA80960kb
Abstract: NG80960KB-25 80960KA 80960KB 80960MC
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80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960kb NG80960KB-25 80960KA 80960MC | |
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A80486DX4WB100
Abstract: INTEL A80486DX4WB100 240486 FC80486DX4WB100 intel A3260 A3232 INTELDX4 PROCESSOR Designing the IntelDX4 Processor into WB75 A3232-01
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32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit A80486DX4WB100 INTEL A80486DX4WB100 240486 FC80486DX4WB100 intel A3260 A3232 INTELDX4 PROCESSOR Designing the IntelDX4 Processor into WB75 A3232-01 | |
240486
Abstract: INTELDX4 write-through
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32-Bit 208-Lead 168-Pin 16-bit 64-Bit 240486 INTELDX4 write-through | |
SB80486DX2SC50
Abstract: processor cross reference 240486
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32-Bit 208-Lead 168-Pin 16-bit 64-Bit SB80486DX2SC50 processor cross reference 240486 | |
A10186
Abstract: INTELDX4 PROCESSOR A80486DX4WB100 A80486 240486 FC80486DX4WB100 A3232-01 INTEL A80486DX4WB100 FC80486DX4WB75 241618
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32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit A10186 INTELDX4 PROCESSOR A80486DX4WB100 A80486 240486 FC80486DX4WB100 A3232-01 INTEL A80486DX4WB100 FC80486DX4WB75 241618 | |
240486
Abstract: A80486DX2 SB80486DX2SC50 208-LEAD sqfp INC1F-16 A80486DX2SA66 241618 sb80486dx t35 4 c8 A11182
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32-Bit 208-Lead 16-bit 168-Pin 64-Bit 240486 A80486DX2 SB80486DX2SC50 208-LEAD sqfp INC1F-16 A80486DX2SA66 241618 sb80486dx t35 4 c8 A11182 | |
X80486DX4WB100
Abstract: 240486 INTELDX4 PROCESSOR 273021
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32-Bit 208-Lead 16-Kbyte 168-Pin 16-bit 64-Bit X80486DX4WB100 240486 INTELDX4 PROCESSOR 273021 | |
132 pin PGA socket 80960
Abstract: 80960JA 80960JD 80960JF A80960JD NG80960JD 27248
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80960JD 32-BIT 80960Jx 80960JD 132 pin PGA socket 80960 80960JA 80960JF A80960JD NG80960JD 27248 | |
80960JA
Abstract: 80960JD 80960JF A80960JD NG80960JD 132-lead 27248 intel packaging handbook 240800
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80960JD 32-BIT 80960Jx 80960JD 80960JA 80960JF A80960JD NG80960JD 132-lead 27248 intel packaging handbook 240800 | |
242202
Abstract: a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive
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32-Bit 16-bit 208-Lead 168-Pin BOFFtA20M# 242202 a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive | |
pga 132 packaging
Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
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OCR Scan |
l386TM Intel386 132-pin pga 132 packaging 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket |