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    INTEL PACKAGING HANDBOOK 240800 SOLDER Search Results

    INTEL PACKAGING HANDBOOK 240800 SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL PACKAGING HANDBOOK 240800 SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    intel packaging handbook 240800

    Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
    Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and


    Original     		PDF CH08WIP intel packaging handbook 240800 Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Text: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759

    intel packaging handbook 240800

    Abstract: hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133
    Text: Intel Embedded Processor Module Thermal Design Guide Application Note June 1998 Order Number: 273143-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF IASK9801 NP970255 intel packaging handbook 240800 hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    a4490

    Abstract: 80960MC A80960MC25 i960 mc errata 80960KA 80960KB M8259A intel packaging handbook 240800
    Text: 80960MC EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT Commercial • High-Performance Embedded Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ On-Chip Floating Point Unit


    Original     		PDF 80960MC 32-BIT 80-Bit 512-Byte LAD31_ A4492-01 A80960MC. a4490 80960MC A80960MC25 i960 mc errata 80960KA 80960KB M8259A intel packaging handbook 240800

    a4490

    Abstract: 80960MC Intel i960 architecture 80960KA 80960KB M8259A 273123
    Text: 80960MC EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT Commercial • High-Performance Embedded Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ On-Chip Floating Point Unit


    Original     		PDF 80960MC 32-BIT 80-Bit 512-Byte LAD31_ A4492-01 a4490 80960MC Intel i960 architecture 80960KA 80960KB M8259A 273123

    QFP PACKAGE thermal resistance

    Abstract: 80960SA 80960SB N80960SB1 65A176 AD928
    Text: 80960SB EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • High-Performance Embedded Architecture ■ Built-in Interrupt Controller — 16 MIPS* Burst Execution at 16 MHz — 5 MIPS Sustained Execution at 16 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960SB 32-BIT 16-BIT 512-Byte 80960SA 80960SA 80960SB QFP PACKAGE thermal resistance N80960SB1 65A176 AD928

    TA80960KB

    Abstract: LAD1 5V Intel 80960kb programmers reference 80960KA 80960KB 80960MC Intel 80960kb
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB LAD1 5V Intel 80960kb programmers reference 80960KA 80960MC Intel 80960kb

    TA80960kb

    Abstract: NG80960KB-25 80960KA 80960KB 80960MC
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960kb NG80960KB-25 80960KA 80960MC

    TA80960KB

    Abstract: 80960KA 80960KB 80960MC LAD1 12v
    Text: 80960KB 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded ■ Built-in Interrupt Controller Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960KB 32-BIT 512-Byte 132-Lead 80960KB TA80960KB 80960KA 80960MC LAD1 12v

    a4490

    Abstract: 80960MC LAD12 80960KA 80960KB M8259A i960 mc errata
    Text: PRELIMINARY 80960MC EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT Commercial • High-Performance Embedded Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ On-Chip Floating Point Unit


    Original     		PDF 80960MC 32-BIT 80-Bit 512-Byte LAD31_ A4492-01 A80960MC. a4490 80960MC LAD12 80960KA 80960KB M8259A i960 mc errata

    80960SA

    Abstract: 80960SB 65A176 AD427
    Text: 80960SA EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • High-Performance Embedded ■ Pin Compatible with 80960SB Architecture — 20 MIPS* Burst Execution at 20 MHz — 7.5 MIPS Sustained Execution at 20 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960SA 32-BIT 16-BIT 80960SB 512-Byte 80960SA 80960SB 65A176 AD427

    QFP PACKAGE thermal resistance

    Abstract: 65a176 AD427 80960SA 80960SB x80960SB 272207 D010D
    Text: 80960SB EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • High-Performance Embedded Architecture ■ Built-in Interrupt Controller — 16 MIPS* Burst Execution at 16 MHz — 5 MIPS Sustained Execution at 16 MHz ■ 512-Byte On-Chip Instruction Cache


    Original     		PDF 80960SB 32-BIT 16-BIT 512-Byte 80960SA 80960SA 80960SB QFP PACKAGE thermal resistance 65a176 AD427 x80960SB 272207 D010D

    80960SA

    Abstract: 80960SB 65A176 272206-003
    Text: 80960SA EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • High-Performance Embedded Architecture — 20 MIPS* Burst Execution at 20 MHz — 7.5 MIPS Sustained Execution at 20 MHz ■ 512-Byte On-Chip Instruction Cache — Direct Mapped — Parallel Load/Decode for Uncached


    Original     		PDF 80960SA 32-BIT 16-BIT 512-Byte 80960SB 80-Lead 80960SA 80960SB 65A176 272206-003

    TA80960KB

    Abstract: ADS-132 80960KA 80960KB 80960MC LAD26
    Text: 80960KB EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT • High-Performance Embedded Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache — Direct Mapped


    Original     		PDF 80960KB 32-BIT 512-Byte 80960KA 80960KB TA80960KB ADS-132 80960KA 80960MC LAD26

    80960KA

    Abstract: 80960KB 80960MC TA80960KA pga 132 packaging
    Text: 80960KA EMBEDDED 32-BIT MICROPROCESSOR • High-Performance Embedded Architecture — 25 MIPS Burst Execution at 25 MHz — 9.4 MIPS* Sustained Execution at 25 MHz ■ 512-Byte On-Chip Instruction Cache — Direct Mapped — Parallel Load/Decode for Uncached Instructions


    Original     		PDF 80960KA 32-BIT 512-Byte 132-Lead 80960KA 80960KB 80960MC TA80960KA pga 132 packaging

    M87C196KC

    Abstract: 8XC196KC user manual a5521 80C196KC20 USER MANUAL 8XC196KC manual
    Text: iU D IM D K l^ V i n t e i M87C196KC/M87C196KD 16-BIT HIGH-PERFORMANCE CHMOS MICROCONTROLLERS WITH ON-CHIP EPROM Special Environment M87C196KC— 16 KBytes EPROM, 512 Bytes RAM M87C196KD—32 KBytes EPROM, 1024 Bytes RAM M87C196KC: 16 MHz Operation M87C196KD: 16 and 20 MHz Operation


    OCR Scan     		PDF M87C196KC/M87C196KD 16-BIT M87C196KC-- M87C196KD--32 M87C196KC: M87C196KD: Sources/16 68-Lead M87C196KC 8XC196KC user manual a5521 80C196KC20 USER MANUAL 8XC196KC manual

    Untitled

    Abstract: No abstract text available
    Text: Ì3C 196E A — A U T O M O T IV E 1.0 PRODUCT OVERVIEW Figure 1. 83C19SEA Block Diagram The S3C198EA is highly integrated with an enhanced peripheral set. The serial debug unit SDU provides system debug and development capabilities. The SDU can set a single hardware breakpoint and provides


    OCR Scan     		PDF 83C19SEA S3C198EA 16-channel

    Untitled

    Abstract: No abstract text available
    Text: ir r te . 8XL196NP COMMERCIAL CHMOS 16-BIT MICROCONTROLLER • 14 MHz Operation at 2.7-3.3 Volts ■ 1 Mbyte of Linear Address Space ■ Optional 4 Kbytes of ROM ■ 1000 Bytes of Register RAM ■ Register-register Architecture ■ 32 I/O Port Pins ■ 16 Prioritized Interrupt Sources


    OCR Scan     		PDF 8XL196NP 16-BIT 16bit) 4fi2bl75

    Untitled

    Abstract: No abstract text available
    Text: 80960SA EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • ■ ■ High-Performance Embedded Architecture — 20 MIPS* Burst Execution at 20 MHz — 7.5 MIPS Sustained Execution at 20 MHz 512-Byte On-Chip Instruction Cache — Direct Mapped — Parallel Load/Decode for Uncached


    OCR Scan     		PDF 80960SA 32-BIT 16-BIT 512-Byte 80960SB 80-Lead 84-Le

    advantages of instruction set architecture intel i3

    Abstract: No abstract text available
    Text: 80960SB EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS • H ig h -P e rfo rm a n c e E m bedded A rc h ite c tu re — 16 M IPS* B u rst E xecution at 16 M H z — 5 M IPS S u stain ed E xecution at 16 M Hz ■ B uilt-in In te rru p t C o n tro lle r


    OCR Scan     		PDF 80960SB 32-BIT 16-BIT 80960SA at50-1000 advantages of instruction set architecture intel i3