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    INTEL PACKAGE DIMENSIONS 32 PLCC Search Results

    INTEL PACKAGE DIMENSIONS 32 PLCC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL PACKAGE DIMENSIONS 32 PLCC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


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    PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    18027

    Abstract: PLCC 32 intel package dimensions 40 PIN IC
    Text: P/N 1109342 for Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter FEATURES • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 80/83C652 40-pin C36000, B16/B16M 18027 PLCC 32 intel package dimensions 40 PIN IC

    PLCC 32 intel package dimensions

    Abstract: PLCC 44 intel package dimensions 80c251 80C31BH 80C51BH 87C51 AMS-QQ-N-290
    Text: P/N 1109342 for Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter FEATURES • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 80/83C652 40-pin C36000, B16/B16M PLCC 32 intel package dimensions PLCC 44 intel package dimensions 80C31BH 80C51BH 87C51 AMS-QQ-N-290

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-85. MIL-T-10727

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-00. SAE-AMS-QQ-N-290.

    PLCC 32 intel package dimensions

    Abstract: PLCC 44 intel package dimensions
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-85. MIL-P-81728 PLCC 32 intel package dimensions PLCC 44 intel package dimensions

    80C251

    Abstract: PLCC 32 intel package dimensions 80C31BH 80C51BH 87C51 ASTM-B16-85 MIL-T-10727 83C652 87C51 40 pin PLCC 44 intel package dimensions
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 80C251 C36000 ASTM-B16-85. MIL-T-10727 PLCC 32 intel package dimensions 80C31BH 80C51BH 87C51 ASTM-B16-85 MIL-T-10727 83C652 87C51 40 pin PLCC 44 intel package dimensions

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-80C251 DIP to PLCC Adapter for Intel 80/83C652 and 80C251 Microprocessors FEATURES: •Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. •Allows user to switch package styles and avoid shortage problems. •Designed to plug directly into your 44 pin PLCC socket.


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    PDF 97-80C251 80/83C652 80C251 QQ-B-750. MIL-T10727 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: PA54-44 Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of two Intel devices: The adapter is made up of 2 sub-assemblies. They assemble via connectors making the adapter modular. This way the subassemblies can be replaced easily.


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    PDF PA54-44 socket/40 87C54, 87C54 PA54-44 PA51-PD-J PA54-44Z PA51-PDZ-J

    Untitled

    Abstract: No abstract text available
    Text: PA51GB-68 Z Data Sheet 68 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Intel 87C51GB microcontroller in either PLCC or CLCC package can be programmed on 40 pin DIP programmers capable of programming an 87C52.


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    PDF PA51GB-68 socket/40 87C51GB 87C52. 87C51GB 87C52 PA51GB68

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


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    PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    PLCC 32 SOCKET pinout

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80/83C652 80C251 B545-97 SAE-AMS-QQ-N-29fications PLCC 32 SOCKET pinout

    SAE AMS-QQ-N-290

    Abstract: PLCC 32 SOCKET pinout
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M SAE AMS-QQ-N-290 PLCC 32 SOCKET pinout

    AMS-QQ-N-290

    Abstract: SAE AMS-QQ-N-290 SOCKET p PINOUT 80c251 capacitor c652 C17200
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M AMS-QQ-N-290 SAE AMS-QQ-N-290 SOCKET p PINOUT capacitor c652 C17200

    18026

    Abstract: 40-Pin DIP-to-Socketable PLCC Adapter SAE AMS-QQ-N-290
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M 18026 40-Pin DIP-to-Socketable PLCC Adapter SAE AMS-QQ-N-290

    PLCC 32 SOCKET pinout

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80/83C652 80C251 MIL-T-10727 MIL-P-81728 PLCC 32 SOCKET pinout

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


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    PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    80c251

    Abstract: 44 pin plcc socket ASTM-B16-85 C17200 PLCC 44 intel package dimensions 94v-0 board PLCC 32 SOCKET pinout
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80/83C652 80C251 MIL-P-81728 44 pin plcc socket ASTM-B16-85 C17200 PLCC 44 intel package dimensions 94v-0 board PLCC 32 SOCKET pinout

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


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    PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


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    PDF 80/83C652 80C251 MIL-T-10727 MIL-P-81728

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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