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    INTEL MECHANICAL DRAWINGS Search Results

    INTEL MECHANICAL DRAWINGS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MD82C288-10/R Rochester Electronics LLC Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MD87C51/BQA Rochester Electronics LLC Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MG87C196KC/B Rochester Electronics LLC Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy

    INTEL MECHANICAL DRAWINGS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PCM45

    Abstract: INTEL 5520 honeywell 95C TCONTROL PCM45F honeywell pcm45 foxconn motherboard la 7630
    Text: Intel 5520 and Intel® 5500 Chipsets Thermal/Mechanical Design Guidelines November 2009 Document Number: 321330, Revision: -003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


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    honeywell pcm45

    Abstract: PCM45 HB9703E-M3W HB9703E-DW A13494008 HB9703EDW A13494-008 BGA heatsink compressive force PCM45F D82348-004
    Text: Intel 7500 Chipset Thermal/Mechanical Design Guidelines March 2010 Reference Number: 322825-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


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    ipx2800

    Abstract: IXP2400 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance
    Text: Intel IXP2400 Network Processor Thermal and Mechanical Design Guideline Application Note March 2003 Document Number: 301148-001 IXP2400 Network Processor Thermal/Mechanical Design INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    IXP2400 ipx2800 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance PDF

    E29477-002

    Abstract: LGA1366 Intel socket 1366 PIN LAYOUT i7900 FOXCONN fan lga 1366 PE136627-4371-01F LGA Lotes foxconn 241 1366LGA
    Text: Intel Core i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series and LGA1366 Socket Thermal and Mechanical Design Guide March 2011 Document Number: 320837-005 2 Thermal and Mechanical Design Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


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    i7-900 LGA1366 E29477-002 Intel socket 1366 PIN LAYOUT i7900 FOXCONN fan lga 1366 PE136627-4371-01F LGA Lotes foxconn 241 1366LGA PDF

    Loctite 7452

    Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


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    631xESB/632xESB Loctite 7452 PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001 PDF

    lga1155 pinout

    Abstract: socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155
    Text: Desktop 3rd Generation Intel Core Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines TMSDG January 2013 Document Number: 326767-005


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    LGA1155 UL1439 lga1155 pinout socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155 PDF

    L1439

    Abstract: 3EE77-002 Motherboard Foxconn LS 36 2Z802 g2100c888 945GZ 3KS02-066 82945GC 945G Btx Motherboard pentium4 521
    Text: Intel 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical Design Guidelines TMDG - For the Intel® 82945G/82945GZ/82945GC Graphics Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH) February 2008


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    945G/945GZ/945GC/ 945P/945PL 82945G/82945GZ/82945GC 82945P/82945PL L1439 3EE77-002 Motherboard Foxconn LS 36 2Z802 g2100c888 945GZ 3KS02-066 82945GC 945G Btx Motherboard pentium4 521 PDF

    transistor c1419

    Abstract: MIL-C-26704 IXP2850 Fujikura fhp-3408 c1419 transistor IXP2800 c1419 INTEL fcBGA PACKAGE thermal resistance Fujikura IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification
    Text: Intel IXP2800 Network Processor Thermal/Mechanical Design Guideline Application Note August 2004 Order Number: 278895-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS


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    IXP2800 C20895 B2455-01 transistor c1419 MIL-C-26704 IXP2850 Fujikura fhp-3408 c1419 transistor c1419 INTEL fcBGA PACKAGE thermal resistance Fujikura IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification PDF

    d9258

    Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
    Text: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    82X38 d9258 d92580 Loctite 7452 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN PDF

    intel g31 chipset motherboard

    Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
    Text: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    82G35 OTH97; D29081 intel g31 chipset motherboard BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 PDF

    845GL

    Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
    Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard PDF

    82801DB

    Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
    Text: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    82801DB ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability PDF

    82801BA

    Abstract: 82801DB ATA-33 E7205 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
    Text: R Intel E7205 Chipset Thermal Design Guide Intel® E7205 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 251940-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    E7205 82801BA 82801DB ATA-33 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel PDF

    5 ball csp drawing

    Abstract: intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
    Text: 3.0 section will show some sample package dimensions. Please refer to the mechanical specification document on Intel’s website, or contact your Intel representative for the latest, complete package dimensions and schematics. PACKAGE PHYSICAL DIMENSIONS NOTE:


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    28F008Sckness 5 ball csp drawing intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 PDF

    BGA heatsink compressive force

    Abstract: E7520 HB96030-DW E7520 Chipset Platform Design Guide 6700PXH TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320
    Text: Intel E7520/E7320 Chipset Memory Controller Hub MCH and Intel® 6700PXH 64-Bit PCI Hub Thermal/Mechanical Design Guide for Embedded Applications February 2007 Reference Number: 304387-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELR PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


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    E7520/E7320 6700PXH 64-Bit BGA heatsink compressive force E7520 HB96030-DW E7520 Chipset Platform Design Guide TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320 PDF

    B1969

    Abstract: IXP2800 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28
    Text: Intel IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note August 2004 Order Number: 278844-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS


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    IXP2800 B1969 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28 PDF

    socket lga 1156 pinout

    Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155
    Text: Intel Core i5-600, i3-500 Desktop Processor Series, Intel® Pentium® Desktop Processor 6000 Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines January 2011 Document Number:322912-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


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    i5-600, i3-500 LGA1156 E58389 socket lga 1156 pinout intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155 PDF

    Intel socket 1366 PIN LAYOUT

    Abstract: LGA1366 core i7 2600 E29477-002 1366LGA PT44L12 foxconn LGA1366 socket LGA 1366 intel x58 db-aa
    Text: Intel Core i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series and LGA1366 Socket Thermal and Mechanical Design Guide March 2010 Document Number: 320837-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


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    i7-900 LGA1366 Intel socket 1366 PIN LAYOUT core i7 2600 E29477-002 1366LGA PT44L12 foxconn LGA1366 socket LGA 1366 intel x58 db-aa PDF

    IXP2400

    Abstract: BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel
    Text: Intel IXP2400 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note March 2003 Document Number: 301146-001 IXP2400 Network Processor EMTS INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    IXP2400 BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel PDF

    Loctite 7452

    Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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    315344-001US Loctite 7452 TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor PDF

    a74694

    Abstract: FC-mPGA4 i486 PC MOTHERBOARD CIRCUIT diagram G751 intel xeon socket 604 TMDG
    Text: Low Voltage Intel Xeon Processor with 800 MHz System Bus in Embedded Applications Thermal/Mechanical Design Guide October 2004 Revision 1.0 304061 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    hand movement based fan speed control

    Abstract: MPGA478 SOCKET intel fan motherboard mPGA478 circuit Sunon fan 4-wire DC copper core heatsink mpga478 FC-mPGA4 pentium4 478 avc fan 12V Pentium4
    Text: R Intel Pentium® 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines Design Guide February 2004 Document Number: 300564-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    Chomerics T710

    Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 Chomerics T710 PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2 PDF

    peci specification

    Abstract: AL322BL pentium dual core sensotec model LV flotherm LGA771 free circuit diagram of intel 915 motherboard 6010a Acoustics G751
    Text: Dual-Core Intel Xeon® Processor LV 5138 in Embedded Applications Thermal/Mechanical Design Guidelines September 2006 Order Number: 315225-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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    315225-001US ECC-0026701-GP CEK771 D13646 rev04 PCM45F peci specification AL322BL pentium dual core sensotec model LV flotherm LGA771 free circuit diagram of intel 915 motherboard 6010a Acoustics G751 PDF