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    INTEL C4 PACKAGE Search Results

    INTEL C4 PACKAGE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL C4 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    82430FX

    Abstract: CY7C1199 CYM74C430 CYM74C430-50 CYM74C430-60 CYM74C430-65 CYM74C430PM-50C P54C CELP2X80SC3Z48
    Text: 1CY M74 C4 30 CYM74C430 Intel 82430FX PCIset Level II Cache Module Features Functional Description • Pin-compatible secondary cache module family that ad- This secondary cache module is designed for Intel P54C systems with the 82430FX Triton chip set. CYM74C430 is an


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    PDF CYM74C430 82430FX 82430FX CYM74C430 256-Kbyte CYM74C430) P54C-based CY7C1199 CYM74C430-50 CYM74C430-60 CYM74C430-65 CYM74C430PM-50C P54C CELP2X80SC3Z48

    underfill

    Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
    Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.


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    intel 845 schematic diagram

    Abstract: intel 845 circuit diagram all chip 845GL intel 845g schematics 845 VRM CHIP CIRCUIT diagram 82801DB 845 vrm circuit diagram intel cpu power section intel schematic diagram 82562ez
    Text: R Intel Pentium® 4 Processor in 478-pin Package and Intel® 845G/845GL/845GV Chipset Platform Design Guide Update August 2004 Notice: The Intel® 845 chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are


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    PDF 478-pin 845G/845GL/845GV intel 845 schematic diagram intel 845 circuit diagram all chip 845GL intel 845g schematics 845 VRM CHIP CIRCUIT diagram 82801DB 845 vrm circuit diagram intel cpu power section intel schematic diagram 82562ez

    intel i5 block diagram

    Abstract: INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5
    Text: E Micro Ball Grid Array Package Mechanical Specifications and Media Information December 1997 Revision 3.6 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


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    PDF 28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 intel i5 block diagram INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5

    8275 intel

    Abstract: intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications June 1998 Revision 3.9 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


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    PDF 28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 8275 intel intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3

    INTEL 28F640

    Abstract: 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
    Text: E µBGA* Package Mechanical and Shipping Media Specifications November 1998 Revision 3.12 11/12/98 2:37 PM REV3_12.doc INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by


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    PDF RD33708SW 28F640J5 28F160F3 RD33716SW INTEL 28F640 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram

    INTEL 28F640

    Abstract: Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications August 1998 Revision 3.11 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


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    PDF 28F640J5 RD33708SW RD33716SW NP291-04002-G4-BF-P 28F160B3 28F008S3 28F160F3 CBG060-044A INTEL 28F640 Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3

    INTEL 28F640

    Abstract: transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications March 1999 Revision 3.15 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


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    PDF RD33704SW RD33708SW 28F800B3 28F160B3 CBG060-044A 28F160B3 28F016B3 28F160C3 CBG048-035C INTEL 28F640 transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016S3

    C3216Y5V1C225Z

    Abstract: C2012Y5V1E224Z 9585 ceramic capacitor 10k tdk ceramic filters AB-59 AP-357 C2012Y5V1C105Z C2012Y5V1C105ZT MAX662A
    Text: E TECHNICAL PAPER Small and Low-Cost Power Supply Solution for Intel’s Flash Memory Products BILAL QURESHI MCD APPLICATIONS ENGINEER SALIM B. FEDEL SENIOR APPLICATIONS ENGINEER August 1994 Order Number: 297534-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    PDF C2012Y5V1C105Z AP-357, AB-59, C3216Y5V1C225Z C2012Y5V1E224Z 9585 ceramic capacitor 10k tdk ceramic filters AB-59 AP-357 C2012Y5V1C105Z C2012Y5V1C105ZT MAX662A

    9585

    Abstract: AB-59 AP-357 C2012Y5V1C105Z C2012Y5V1C105ZT C3216Y5V1C225Z MAX662A MAX662ACSA
    Text: E TECHNICAL PAPER Small and Low-Cost Power Supply Solution for Intel's Flash Memory Products BILAL QURESHI MCD APPLICATIONS ENGINEER SALIM B. FEDEL SENIOR APPLICATIONS ENGINEER August 1994 Order Number: 297534-001 Intel Corporation makes no warranty for the use of its products and assumes no responsibility for any errors which may appear


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    PDF AP-357, AB-59, 9585 AB-59 AP-357 C2012Y5V1C105Z C2012Y5V1C105ZT C3216Y5V1C225Z MAX662A MAX662ACSA

    LXD9781

    Abstract: HBLXT9781HC LXT9763 intel date code format
    Text: LXT9761/62/63/81/82 PHY Transceivers Specification Update July 2001 Notice: The LXT9761/81, LXT9762/82, and LXT9763 Multi-Port 10/100 PHY Transceivers may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification


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    PDF LXT9761/62/63/81/82 LXT9761/81, LXT9762/82, LXT9763 10BASE-T LXD9781 HBLXT9781HC intel date code format

    LXD9781

    Abstract: LXT9763 S E001
    Text: LXT9761/62/63/81/82 PHY Transceivers Specification Update November 2001 Notice: The LXT9761/81, LXT9762/82, and LXT9763 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification update.


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    PDF LXT9761/62/63/81/82 LXT9761/81, LXT9762/82, LXT9763 10BASE-T LXD9781 S E001

    Diode BFM

    Abstract: CK540 Z560
    Text: Intel Atom Processor Z5xx∆ Series Datasheet — For the Intel® Atom™ Processor Z560∆, Z550∆, Z540∆, Z530∆, Z520∆, Z515∆, Z510∆, and Z500∆ on 45 nm Process Technology June 2010 Document Number: 319535-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    PDF 319535-003US Diode BFM CK540 Z560

    z670

    Abstract: atom z670 FCMB3 intel g31 chipset motherboard sm35 Chipset Platform Design Guide NV12 CMOS18 CDVO Unicore Software
    Text: Intel Atom Processor Z6xx Series Datasheet For the Intel® Atom™ Processor Z670 on 45-nm Process Technology April 2011 Revision 001 Document Number: 325310-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    PDF 45-nm z670 atom z670 FCMB3 intel g31 chipset motherboard sm35 Chipset Platform Design Guide NV12 CMOS18 CDVO Unicore Software

    H1088

    Abstract: AP-391 821977-1 82559 93c46 atmel AP-392 intel bga196 panasonic capacitor date code eet AP391 atmel 93C46
    Text: 82559 LAN on Motherboard LOM Design Guide Application Note (AP-392) Revision 1.4 January 1999 Document Number: 718213-004 Revision History Revision Date Revision Description June 1998 1.0 First release. July 1998 1.1 Added Section 8.0, "Signal Descriptions" on page 12, Section 9.0, "Package


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    PDF AP-392) H1088 AP-391 821977-1 82559 93c46 atmel AP-392 intel bga196 panasonic capacitor date code eet AP391 atmel 93C46

    intel p4 motherboard power supply circuit diagram

    Abstract: toshiba MOTHERBOARD CIRCUIT diagram 93c46 atmel AP-391 821977-1 82559 AP-392 000M-20PF AP-393 intel DOC
    Text: 82559 LAN on Motherboard LOM Design Guide Application Note (AP-392) Revision 1.4 January 1999 Document Number: 718213-004 Revision History Revision Date Revision Description June 1998 1.0 First release. July 1998 1.1 Added Section 8.0, "Signal Descriptions" on page 12, Section 9.0, "Package


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    PDF AP-392) AP-393 intel p4 motherboard power supply circuit diagram toshiba MOTHERBOARD CIRCUIT diagram 93c46 atmel AP-391 821977-1 82559 AP-392 000M-20PF AP-393 intel DOC

    M28F512-12C3

    Abstract: 93C56P xicor 28C64 AT28C17-25PC 93C66P m5m28f102j AT28C16-20PC ATMEL serial EEPROM 32K 93C56SN eeprom 28c64
    Text: Main Menu September 2001 Cross Reference Guide Main Menu Main Menu Table of Contents Product Page Number Featured Product Information Serial EEPROM Atmel Fairchild Microchip ST Microelectronics Xicor 3-Wire/Microwire Serial EEPROM Atmel Microchip Fairchild


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    PDF 11F-16, M28F512-12C3 93C56P xicor 28C64 AT28C17-25PC 93C66P m5m28f102j AT28C16-20PC ATMEL serial EEPROM 32K 93C56SN eeprom 28c64

    xgold 118

    Abstract: No abstract text available
    Text: Intel Atom Processor S1200 Product Family for Microserver Datasheet, Volume 1 of 2 December 2012 Document Number: 328194-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    PDF S1200 S1200 xgold 118

    T7000

    Abstract: intel atom processor Z500 Z520 Z550 processor atom Intel atom Z530 Intel SSE2 intel atom 2008 processor SSE2
    Text: Intel Atom Processor Z5xx∆ Series Datasheet — For the Intel® Atom™ Processor Z550, Z540∆, Z530∆, Z520∆, Z515∆, Z510∆, and Z500∆ on 45 nm process technology March 2009 Document Number: 319535-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    PDF 319535-002US T7000 intel atom processor Z500 Z520 Z550 processor atom Intel atom Z530 Intel SSE2 intel atom 2008 processor SSE2

    cpu socket mPGA479m

    Abstract: Transistor C4E intel 945 MOTHERBOARD SERVICE MANUAL intel core solo
    Text: Intel Core Duo Processor and Intel® Core™ Solo Processor on 65 nm Process Datasheet September 2006 Document Number: 309221-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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    T2300E

    Abstract: Intel 945 150ghz cpu T2400 ICH7M Intel Core Duo T2600 2.16 GHz Dual Core U2400 T1400 T2700 intel CORE 2 duo instruction set
    Text: Intel Core Duo Processor and Intel® Core™ Solo Processor on 65 nm Process Datasheet January 2007 Document Number: 309221-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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    Z520

    Abstract: atom mother board ATOM 1.33 GHz Core Z520 ST Intel atom Z530 TM2 TRIGGER intel ATOM MOTHERBOARD pcb CIRCUIT diagram POULSBO AC80566UE036DW
    Text: Intel Atom Processor Z5xx∆ Series Datasheet Intel® Atom™ Processor Z540∆, Z530∆, Z520∆, Z510∆, and Z500∆ on 45 nm process technology April 2008 Document Number: 319535-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    PDF 319535-001US 17-Feb-2009 Z520 atom mother board ATOM 1.33 GHz Core Z520 ST Intel atom Z530 TM2 TRIGGER intel ATOM MOTHERBOARD pcb CIRCUIT diagram POULSBO AC80566UE036DW

    POULSBO

    Abstract: CK540
    Text: Intel Atom Processor Z5xx∆ Series Datasheet Intel® Atom™ Processor Z540∆, Z530∆, Z520∆, Z510∆, and Z500∆ on 45 nm process technology April 2008 Document Number: 319535-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


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    PDF 319535-001US POULSBO CK540

    PC intel 945 MOTHERBOARD CIRCUIT diagram

    Abstract: intel 8250 intel 945 945 MOTHERBOARD CIRCUIT diagram Diamondville 945 INTEL CIRCUIT DIAGRAM intel p4 motherboard power supply circuit diagram chipset 945 ck505 INTEL 82801GBM
    Text: Mobile Intel Atom Processor N270 Single Core Datasheet May 2008 Document Number: 320032-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT


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