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    INTEL BGA TOPSIDE MARK Search Results

    INTEL BGA TOPSIDE MARK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy

    INTEL BGA TOPSIDE MARK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    intel topside mark

    Abstract: Qualcomm MSM2300 intel date code marking intel topside mark BGA MSM2300 qualcomm ww transistor conversion codes intel marking diode T3 Marking marking 82
    Text: Product Change Notification Please contact your distributor with any questions. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s


    Original     		PDF

    heller 1700

    Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
    Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse

    Intel reflow soldering profile BGA

    Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
    Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular


    Original     		PDF CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal

    B5589-01

    Abstract: UCLXT312E b5589 LXT315ANE LXT312ANE PDLXT312ANE.A2 INTEL LOT NUMBER code label LXT315ANE-A2 PDLXT315ANE PDLXT315ANE.A2
    Text: Intel LXT312A/LXT315A Low Power T1 PCM Repeaters/Transceivers Datasheet The LXT312A and LXT315A are integrated repeater/transceiver circuits for T1 carrier systems. The LXT312A is a dual repeater/transceiver and the LXT315A is a single repeater/transceiver.


    Original     		PDF LXT312A/LXT315A LXT312A LXT315A B5589-01 B5589-01 UCLXT312E b5589 LXT315ANE LXT312ANE PDLXT312ANE.A2 INTEL LOT NUMBER code label LXT315ANE-A2 PDLXT315ANE PDLXT315ANE.A2

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    intel 810 MOTHERBOARD pcb CIRCUIT diagram

    Abstract: intel packaging handbook 240800 intel 810 MOTHERBOARD pcb CIRCUIT txc 14.318MHZ intel MOTHERBOARD pcb CIRCUIT diagram 242557 273105 EMBMOD133 R-033 430HX
    Text: Intel Embedded Processor Module EMBMOD133 and EMBMOD166 Preliminary Datasheet Product Features • ■ ■ ■ Intel Pentium Processor with Voltage Reduction Technology with internal/bus frequency of 133/66 MHz EMBMOD133 Intel Mobile Pentium® Processor with


    Original     		PDF EMBMOD133 EMBMOD166 EMBMOD133) EMBMOD166) 82439HX intel 810 MOTHERBOARD pcb CIRCUIT diagram intel packaging handbook 240800 intel 810 MOTHERBOARD pcb CIRCUIT txc 14.318MHZ intel MOTHERBOARD pcb CIRCUIT diagram 242557 273105 R-033 430HX

    mobile MOTHERBOARD CIRCUIT diagram

    Abstract: intel MOTHERBOARD pcb CIRCUIT diagram AP-757 12MHZ 24MHZ 430HX 82371SB 82439HX EMBMOD133 txc 14.318MHZ
    Text: ADVANCE INFORMATION Intel Embedded Processor Module EMBMOD133 and EMBMOD166 • Intel Pentium Processor with Voltage Reduction Technology with internal/bus frequency of 133/66 EMBMOD133 ■ Intel Mobile Pentium® Processor with MMX Technology with internal/bus


    Original     		PDF EMBMOD133 EMBMOD166 EMBMOD133) EMBMOD166) 82439HX mobile MOTHERBOARD CIRCUIT diagram intel MOTHERBOARD pcb CIRCUIT diagram AP-757 12MHZ 24MHZ 430HX 82371SB txc 14.318MHZ

    PPGA-B615

    Abstract: CKDM66-M Intel Mobile Celeron Processor BGA
    Text: MOBILE INTEL CELERON® PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET + Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz + Supports Intel Architecture with


    Original     		PDF 16-Kbyte 128Kbyte) PPGA-B615 CKDM66-M Intel Mobile Celeron Processor BGA

    intel packaging handbook 240800

    Abstract: intel MOTHERBOARD pcb CIRCUIT diagram 12MHZ 24MHZ 430HX 82371SB 82439HX EMBMOD133 EMBMOD166 243292
    Text: Intel Embedded Processor Module EMBMOD133 and EMBMOD166 Preliminary Datasheet Product Features • ■ ■ ■ Intel Pentium Processor with Voltage Reduction Technology with internal/bus frequency of 133/66 MHz EMBMOD133 Intel Mobile Pentium® Processor with


    Original     		PDF EMBMOD133 EMBMOD166 EMBMOD133) EMBMOD166) 82439HX intel packaging handbook 240800 intel MOTHERBOARD pcb CIRCUIT diagram 12MHZ 24MHZ 430HX 82371SB EMBMOD166 243292

    443BX

    Abstract: 041H 245112 Intel Celeron D43 M4 DIODE V001000
    Text: MOBILE CELERON PROCESSOR IN BGA PACKAGE AT 300 MHZ AND 266 MHZ DATASHEET + + + + Available at 266 MHz and 300 MHz Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction cache and 16-Kbyte write back data cache + Integrated second level cache 128-Kbyte


    Original     		PDF 16-Kbyte 128-Kbyte) USA/96/POD/PMG 443BX 041H 245112 Intel Celeron D43 M4 DIODE V001000

    443BX

    Abstract: 245103 pbga-b615
    Text: MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ + + + Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz + — Binary compatible with all applications Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) 443BX 245103 pbga-b615

    pin diagram i3 processor

    Abstract: basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II
    Text: MOBILE PENTIUM II PROCESSOR IN Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz, 333 MHz, 300PE MHz, AND 266PE MHz      Available at 400 MHz, 366 MHz, 333 MHz, 300PE MHz, and 266PE MHz  Fully compatible with previous Intel microprocessors — Binary compatible with all applications


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) pin diagram i3 processor basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II

    400 mhz filter

    Abstract: diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge
    Text: MOBILE CELERON PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET      Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz Supports Intel Architecture with Dynamic


    Original     		PDF 16-Kbyte 128-Kbyte) 400 mhz filter diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge

    Intel Mobile Celeron Processor BGA

    Abstract: ink cartridge chip block diagram of pentium D capacitor AA8 pentium II Sensor Cement Capacitor Swatch Group 443BX V0027-00
    Text: MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHz, 333 MHz, 300PE MHz, AND 266PE MHz + + + + Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz — Binary compatible with all applications Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) Intel Mobile Celeron Processor BGA ink cartridge chip block diagram of pentium D capacitor AA8 pentium II Sensor Cement Capacitor Swatch Group 443BX V0027-00

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    JS28F320C3

    Abstract: No abstract text available
    Text: Intel Advanced+ Boot Block Flash Memory C3 28F800C3, 28F160C3, 28F320C3 (x16) Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V read/program/erase — 12 V for fast production programming 1.65 V to 2.5 V or 2.7 V to 3.6 V I/O


    Original     		PDF 28F800C3, 28F160C3, 28F320C3 RC28F160C3TC70 RC28F160C3BC70 RC28F160C3TC80 RC28F160C3BC80 RC28F160C3TC90 RC28F160C3BC90 RC28F160C3TA90 JS28F320C3

    JS28F320C3BD70

    Abstract: JS28F160C3TD70 PH28F320C3BD70 JS28F320C3TD70 PH28F320C3TD70 TE28F160C3TD70 JS28F160C3BD70 js28f800 pc28f320c3td70 ph28f160c3bd70
    Text: Intel Advanced+ Boot Block Flash Memory C3 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V read/program/erase — 12 V for fast production programming


    Original     		PDF 28F800C3, 28F160C3, 28F320C3, 28F640C3 protection70 RC28F160C3BD70 RC28F160C3TC70 RC28F160C3BC70 RC28F160C3TC80 RC28F160C3BC80 JS28F320C3BD70 JS28F160C3TD70 PH28F320C3BD70 JS28F320C3TD70 PH28F320C3TD70 TE28F160C3TD70 JS28F160C3BD70 js28f800 pc28f320c3td70 ph28f160c3bd70

    intel bga topside mark

    Abstract: date code marking intel strataflash
    Text: Intel IXF1010 100/1000 Mbps Ethernet Media Access Controller Specification Update August 2004 Notice: The Intel® IXF1010 Media Access Controller may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current


    Original     		PDF IXF1010 B3534-02 10-Port intel bga topside mark date code marking intel strataflash

    E11663-001

    Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
    Text: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original     		PDF 5M-1994 E11663-001 Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force

    JS28F320C3BD70

    Abstract: pc28f320c3td70 js28f160c3td70 js28f800c3td70 JS28F160C3BD70 JS28F320C3TD70 PH28F320C3BD70 JS28F320C3 PH28F160C3BD70 JS28F800C3BD70
    Text: Intel Advanced+ Boot Block Flash Memory C3 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V read/program/erase — 12 V for fast production programming


    Original     		PDF 28F800C3, 28F160C3, 28F320C3, 28F640C3 F800C3TA70 GE28F800C3BA70 GE28F800C3TA90 GE28F800C3BA90 RC28F160C3TD70 RC28F160C3BD70 JS28F320C3BD70 pc28f320c3td70 js28f160c3td70 js28f800c3td70 JS28F160C3BD70 JS28F320C3TD70 PH28F320C3BD70 JS28F320C3 PH28F160C3BD70 JS28F800C3BD70

    te28f320c3bd70

    Abstract: te28f160c3bd70 te28f320c3-bd70 TE28F320C3BD TE28F160C3BD te28f320c3td GE28F160C3TD70 BGA PACKAGE TOP MARK intel 28F320C3 intel Easy BGA TOP MARK
    Text: Intel£ Advanced+ Boot Block Flash Memory C3 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V Read/Program/Erase — 12 V for Fast Production Programming


    Original     		PDF 28F800C3, 28F160C3, 28F320C3, 28F640C3 L60C3TC70 GE28F160C3BC70 GE28F160C3TC80 GE28F160C3BC80 GE28F160C3TC90 GE28F160C3BC90 te28f320c3bd70 te28f160c3bd70 te28f320c3-bd70 TE28F320C3BD TE28F160C3BD te28f320c3td GE28F160C3TD70 BGA PACKAGE TOP MARK intel 28F320C3 intel Easy BGA TOP MARK

    RJ80530

    Abstract: CK-408 CK-Titan Clock Synthesizer S 1357 intel rj80530vy650256 mmc-1 celeron mmc-1 pentium 1168-ball micro-FCBGA package
    Text: R Mobile Intel Celeron® Processor 0.13 µ in Micro-FCBGA and Micro-FCPGA Packages at 1.33 GHz, 1.20 GHz, 1.13 GHz, 1.06 GHz, 1.00 GHz; Low Voltage 866 MHz, 733 MHz, 650 MHz; and Ultra Low Voltage 800 MHz, 733 MHz, 700 MHz, and 650 MHz Datasheet January 2003


    Original     		PDF KC80524KX400128 MPPM1PDA400B MPPM1PDA400A MPM21PDA400B MPM21PDA400A KP80524KX366128 KC80524KX366128 MPPM1PDA366B MPPM1PDA366A MPM21PDA366B RJ80530 CK-408 CK-Titan Clock Synthesizer S 1357 intel rj80530vy650256 mmc-1 celeron mmc-1 pentium 1168-ball micro-FCBGA package

    WJLXT384E B1

    Abstract: FLLXT384BE WJLXT384LE.B1 WJLXT384E ATT Preliminary Technical reference pub 62411 BGA PACKAGE TOP MARK intel LXT384BE B1 FLLXT384 248994 LXT384BE
    Text: Intel LXT384 Octal T1/E1/J1 Short-Haul PCM Transceiver with Jitter Attenuation JA Datasheet Product Features • ■ ■ ■ ■ ■ ■ Octal T1/E1/J1 Pulse-Code Modulation (PCM) Transceiver with Jitter Attenuation for use in both 1.544 Mbps (T1) and 2.048


    Original     		PDF LXT384 048-MHz WJLXT384E B1 FLLXT384BE WJLXT384LE.B1 WJLXT384E ATT Preliminary Technical reference pub 62411 BGA PACKAGE TOP MARK intel LXT384BE B1 FLLXT384 248994 LXT384BE