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    INTEL 28 CERDIP Search Results

    INTEL 28 CERDIP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD80C51FB Rochester Electronics LLC Microcontroller, 8-Bit, CMOS, CDIP40, CERDIP-40 Visit Rochester Electronics LLC Buy
    D87C51FA Rochester Electronics Microcontroller, 8-Bit, UVPROM, CMOS, CDIP40, CERDIP-40 Visit Rochester Electronics Buy
    D8087-1 Rochester Electronics LLC Math Coprocessor, 16-Bit, NMOS, CDIP40, CERDIP-40 Visit Rochester Electronics LLC Buy
    MD28F020-90 Rochester Electronics LLC Flash, 256KX8, 90ns, CDIP32, CERDIP-32 Visit Rochester Electronics LLC Buy
    D8031AH Rochester Electronics LLC Microcontroller, 8-Bit, 6MHz, NMOS, CDIP40, CERDIP-40 Visit Rochester Electronics LLC Buy

    INTEL 28 CERDIP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    intel PLCC packaging draw

    Abstract: No abstract text available
    Text: Page 1 of 12 IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier


    Original     		PDF IA82510 intel PLCC packaging draw

    8251A

    Abstract: intel 8251a PSL 26 IA8251 IA8251-PDW28C IA8251-PDW28I IA8251-PLC28C IA8251-PLC28I 20 pin plcc ic base 64 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Page 1 of 4 IA8251 Advanced Information Sheet Programmable Communication Interface FEATURES • • • • • • • Form, Fit, and Function Compatible with the Intel 8251A Packaging options available: 28 Pin Plastic Dip or 28 Pin Plastic Leaded Chip Carrier


    Original     		PDF IA8251 IA8251 8251A intel 8251a PSL 26 IA8251-PDW28C IA8251-PDW28I IA8251-PLC28C IA8251-PLC28I 20 pin plcc ic base 64 CERAMIC LEADLESS CHIP CARRIER LCC

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    Triton P54C

    Abstract: cy7c37128 62128 SRAM adapter 48-pin TSOP CY7C37192 CYM74P436 CY3501A CY7C37512 MIB 30 Product Selector Guide
    Text: Product Selector Guide Fast Static RAMs Organization/Density Density X1 X4 X4 SIO X8 4K 7C147 2147 7C123 7C148 7C149 7C150 2148 2149 7C122 9122 93422 16K 7C167A 7C168A 7C128A 6116 64K to 72K 7C187 7C164 7C166 7C185 6264 7C182 256K to 288K 7C197 7C194 7C195


    Original     		PDF 7C147 7C123 7C148 7C149 7C150 7C122 7C167A 7C168A 7C128A 7C187 Triton P54C cy7c37128 62128 SRAM adapter 48-pin TSOP CY7C37192 CYM74P436 CY3501A CY7C37512 MIB 30 Product Selector Guide

    intel 27010 eprom

    Abstract: No abstract text available
    Text: INTEL CORP Intel* MEMORY/LOGIC 50E D • 4fiS bl7b O O b t Ja M l4 5 ■ /3 -2 9 27010 1M (128K x 8) BYTE-WIDE EPROM ■ Compatible with 28-Pin JEDEC EPROMs: 27256, 27512 ■ Complete Upgrade Capability — PGM “Don’t Care” Status Allows Wiring in Higher Order Addresses


    OCR Scan     		PDF 28-Pin intel 27010 eprom

    27C126

    Abstract: intel 27C011 27C011
    Text: intel, 27C011 PAGE-ADDRESSED 1M 8 x 16K x 8 EPROM • Paged Organization — Reduced Physical Address Requirement ■ Compatible with 28-Pin JEDEC EPROMs — Single-Trace Modification for Retrofitting 27128-Based Designs ■ No-Hardware-Change Upgrades — Drop-In 27513 Replacement


    OCR Scan     		PDF 27C011 28-Pln 27128-Based 27C126 intel 27C011

    intel 27C011

    Abstract: 27C126 intel 27C010 27C128 INTEL 27C128 st make eprom 27c64 PROGRAMMER CIRCUIT 27C011 intel EPROM 27128 27C010 29023
    Text: intel, 27C011 PAGE-ADDRESSED 1M 8 x 16K x 8 EPROM • Paged Organization — Reduced Physical Address Requirement ■ Compatible with 28-Pin JEDEC EPROMs — Single-Trace Modification for Retrofitting 27128-Based Designs ■ No-Hardware-Change Upgrades — Drop-In 27513 Replacement


    OCR Scan     		PDF 27C011 28-Pin 27128-Based 28-Pln intel 27C011 27C126 intel 27C010 27C128 INTEL 27C128 st make eprom 27c64 PROGRAMMER CIRCUIT 27C011 intel EPROM 27128 27C010 29023

    D2764

    Abstract: 2764A eprom
    Text: intei 2764A 64K 8K x 8 UV ERASABLE PROMs inteligent Fast Access Time—HMOS* II E — 180 ns Cerdip D2764A-1 Id e n tif ie r Mode Industry Standard Pinout. . . JEDEC Approved . . . 28 Lead Package Moisture Resistant (See Packaging Spec, Order #231369)


    OCR Scan     		PDF D2764A-1 536-bit 764A-1) D2764 2764A eprom

    EPROM 2764a

    Abstract: 2764a eprom PINOUT eprom 2716 2764A1 2764A eprom 2764A-25 2764A 27C128 INTEL Eprom B 2716 D 2764A-1
    Text: 2764A 64K 8K x 8 UV ERASABLE PROMs • Fast Access Tim e— HMOS* HE 180 ns Cerdip D2764A-1 ■ Moisture Resistant ■ inte ligent Id en tifier M ode a industry Standard Pinout. . . JEDEC Approved . . . 28 Lead Package ■ Two-line Control (SeePacka9ingSpec' ° rder #231369)


    OCR Scan     		PDF D2764A-1 536-bit 764A-1) EPROM 2764a 2764a eprom PINOUT eprom 2716 2764A1 2764A eprom 2764A-25 2764A 27C128 INTEL Eprom B 2716 D 2764A-1

    27C400 eprom

    Abstract: 27C400 AU-AIS intel i5 27C400-150V10 27C400-200V10 intel 2802 D814 diagram BY524 D814
    Text: 27C400 4M 256K x 16 or 512K x 8 CHMOS EPROM • . • Word-Wide or Byte-Wide Configurable ■ 4M 40-Pin Mask ROM Compatible -4 0 -L e a d CERDIP Package ■ Low Power Dissipation — 50 m A M ax A c tiv e @ 5 M H z — 100 ju.A Max Standby ■ High Performance


    OCR Scan     		PDF 27C400 40-Pin 40-Lead 27C400 27C400 eprom AU-AIS intel i5 27C400-150V10 27C400-200V10 intel 2802 D814 diagram BY524 D814

    27C2560

    Abstract: 27c256 intel intel EPROM 27128 27C256-2 27C256 27C2S6 23136 intel Automotive eprom 2716 eprom 27c256
    Text: in t e T 27C256 256K 32K x 8 CHMOS PRODUCTION AND UV ERASABLE PROMS Automotive Noise Immunity Features — ± 10% Vcc Tolerance — Maximum Latch-up Immunity Through EPI Processing New Qulck-Pulse Programming" Algorithm — 4 Second Programming Available In 28-Pin Cerdip Package


    OCR Scan     		PDF 27C256 28-Pin 27C256 27C2S6, 27C2560 27c256 intel intel EPROM 27128 27C256-2 27C2S6 23136 intel Automotive eprom 2716 eprom 27c256

    EPROM 2764a

    Abstract: 27C126 2764A1 2764A 2764A-1 eprom 2716 D2764A-1 2764A eprom 2764A-2 27C128 INTEL
    Text: 2764A 64K 8K x 8 UV ERASABLE PROMs • Fast Access Time— HMOS* H E — 180 ns Cerdip D2764A-1 ■ Moisture Resistant ■ inteligent Identifier Mode a |ndustry standard Pinout. . . JEDEC Approved . . . 28 Lead Package ■ Two-line Control <See Packagin9 Spec' ° rder #231369)


    OCR Scan     		PDF D2764A-1 536-bit 764A-1) EPROM 2764a 27C126 2764A1 2764A 2764A-1 eprom 2716 D2764A-1 2764A eprom 2764A-2 27C128 INTEL

    Untitled

    Abstract: No abstract text available
    Text: intei 27C400 4M 256K x 16 or 512K x 8 CHMOS EPROM Word-Wide or Byte-Wide Configurable 4M 40-Pin Mask ROM Compatible — 40-Lead CERDIP Package Low Power Dissipation — 50 mA Max Active @ 5 MHz — 100 juA Max Standby • High Performance — 150 ns Maximum Access Time


    OCR Scan     		PDF 27C400 40-Pin 40-Lead

    INTEL 2764A

    Abstract: 2764A1 EPROM 2764a eprom 2716 2764A-1 2764A-2 D2764A EPROM intel 27256 27C128 INTEL 2764A-20
    Text: intei 2764A 64K 8K x 8 UV ERASABLE PROMs inte ligent Id e n tifie r^ Mode Fast Access Time—HMOS* II E — 180 ns Cerdip D2764A-1 Industry Standard Pinout. . . JEDEC Approved . . . 28 Lead Package Moisture Resistant (S ee P acka g ing S pec, O rd e r # 2 3 1 3 6 9 )


    OCR Scan     		PDF D2764A-1 536-bit 764A-1) INTEL 2764A 2764A1 EPROM 2764a eprom 2716 2764A-1 2764A-2 D2764A EPROM intel 27256 27C128 INTEL 2764A-20

    27128A-1

    Abstract: 27128A-2 27C256 27C512 27C64 87C64 A12C LD27128A TD27128A 27128A
    Text: intei 27128A 128K 16K x 8 PRODUCTION AND UV ERASABLE PROMs Fast 150 nsec A cce ss Time — H M O S* ll-E Technology inteligent Identifier Mode — Automated Programming Operations Low Power — 100 mA Maximum Active — 40 mA Maximum Standby Available in 28-Pin Cerdip Package


    OCR Scan     		PDF 7128A 28-Pin 072-bit environ128A 7128A, 27128A-1 27128A-2 27C256 27C512 27C64 87C64 A12C LD27128A TD27128A 27128A

    EPROM 27128a

    Abstract: eprom 2716 27128A 27128A-2 2732A eprom 27c64 PROGRAMMER CIRCUIT intel 27256 intel 27c512 eprom 27128A-1 27128A-20
    Text: intei 27128A 128K 16K x 8 PRODUCTION AND UV ERASABLE PROMs Fast 150 nsec A cce ss Time — H M O S* ll-E Technology inteligent Identifier Mode — Automated Programming Operations Low Power — 100 mA Maximum Active — 40 mA Maximum Standby Available in 28-Pin Cerdip Package


    OCR Scan     		PDF 7128A 28-Pin 7128A 072-bit 7128A, EPROM 27128a eprom 2716 27128A 27128A-2 2732A eprom 27c64 PROGRAMMER CIRCUIT intel 27256 intel 27c512 eprom 27128A-1 27128A-20

    Untitled

    Abstract: No abstract text available
    Text: intJ 82C501AD ETHERNET SERIAL INTERFACE CHMOS Replacement for Intel 82C501, 82501, or SEEQ 8023A Manchester Encoding/Decoding and Receive Clock Recovery Conforms to IEEE 802.3 10BASE5 Ethernet and 10BASE2 (Cheapernet) Specifications 10-MHz Transmit Clock Generator


    OCR Scan     		PDF 82C501AD 82C501, 10BASE5 10BASE2 10-MHz 10-Mb/s 82C501AD 10BASE5 10BAody