Z9015-1
Abstract: RAW MATERIAL INSPECTION procedure Z8115
Text: [ 6 ] Appendix Contents 1. Sampling Inspection . 1 1.1 Sampling Inspection . 1 1.2 1.3 Sampling Inspection Methods . 1
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Z8115
MIL-HDBK-217F
Z9015-1
RAW MATERIAL INSPECTION procedure
Z8115
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Abstract: No abstract text available
Text: MIL-STD-1553 TRANSFORMERS QPL Interface Transformers Overview MIL-PRF-21038/27 Inspection, Sampling, Testing Table 1 — Group A Inspection Level “C”* Level “M” Level “T” Tests Sampling Plan Tests Sampling Plan Tests Sampling Plan N/A N/A Electrical Characteristics
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MIL-STD-1553
MIL-PRF-21038/27
MIL-PRF-21038/27
MIL-PRF-21038
MC118
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Abstract: No abstract text available
Text: back to “Contents” PULSE SPECIALTY COMPONENTS MIL-PRF-21038/27 Inspection, Sampling, Testing Table 1: Group A Inspection Level "C" * Tests Level " M" S ampling Plan Level " T" Tests S ampling Plan Tests Sampling Plan NA Electrical Characteristics per
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MIL-PRF-21038/27
MIL-PRF-21038/27
MIL-PRF-21038
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LA 7340
Abstract: SAE j 726 aol nby ITT LMT N 413 af 321 tlt 149 GS 393s CCT-D LTWF
Text: NOT MEASUREMENT MVF MIL-STO-1D5E 10 MAY 1989 SUPERSEDING MIL-STD-1D5D 29 APRIL 1963 MILITARY’ STANDARD SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY AITRIBUTES I AMSC ~~. N/A AREA Approved for public releese; dlstrlbutlon is QCIC unlimited. MIL-STO-1O5E
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SN-lPL13K
LA 7340
SAE j 726
aol nby
ITT LMT
N 413 af
321 tlt 149
GS 393s
CCT-D
LTWF
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Abstract: No abstract text available
Text: Glossary Vishay Foil Resistors Bulk Metal Foil Technology Glossary of Terms ACCEPTABLE QUALITY LEVEL AQL : The maximum percent defective (or maximum number of defects per hundred units) that, for the purpose of sampling inspection, can be considered satisfactory as a process average. Defects may be
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INCOMING RAW MATERIAL INSPECTION procedure
Abstract: INCOMING MATERIAL INSPECTION procedure MATERIAL INSPECTION procedure aql incoming inspection
Text: Quality Details Quality Details 2 Quality Details 2.1 Quality Assurance For our small-signal semiconductor division supplying Quality means satisfying our customers’ present and future expectations. Our strategic goal is the zero-defect principle, which we have largely achieved by a
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EHA07240
INCOMING RAW MATERIAL INSPECTION procedure
INCOMING MATERIAL INSPECTION procedure
MATERIAL INSPECTION procedure
aql incoming inspection
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INCOMING RAW MATERIAL INSPECTION procedure
Abstract: INCOMING MATERIAL INSPECTION procedure inspection sampling plan
Text: Quality Assurance 1 General The high demands the world market places on the quality of products and services to be supplied by us make a thorough, comprehensive and modern quality assurance and management system QM indispensable. The quality assurance system enforced in the Capacitors Division has been
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siemens spc 2
Abstract: aql incoming inspection siemens spc-2
Text: Quality 1 Typical production sequence / inspection plan Supplied parts Coil formers, cores Incoming inspection Automatic winding Check of machine settings Visual inspection Soldering / tinning Check of, soldering temperature, flux and soldering time Visual inspection of appearance
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ISO STANDARDS SHEET METAL THINNING
Abstract: MIL-STD-883H Ultrasonic Cleaning Transducer IPC-4101-92 MIL-T-27730 SEM 2006 IPC-4101-95 AL wire bond spool color code ultrasonic transducer 150 khz ultrasonic proximity detector report file
Text: MIL-STD-883H * METHOD 2018.5 SCANNING ELECTRON MICROSCOPE SEM INSPECTIONS 1. PURPOSE. This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice. SEM inspection is not required on planar oxide interconnect
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MIL-STD-883H
ISO STANDARDS SHEET METAL THINNING
MIL-STD-883H
Ultrasonic Cleaning Transducer
IPC-4101-92
MIL-T-27730
SEM 2006
IPC-4101-95
AL wire bond spool color code
ultrasonic transducer 150 khz
ultrasonic proximity detector report file
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Abstract: No abstract text available
Text: Quality Specifications 1 General The high demands made of us by the world market for product and service quality make a comprehensive, thorough and up-to-date quality management system indispensable. The QM system introduced in Capacitors Division was certified to EN ISO 9001 in June 1992.
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QFN-0601
Abstract: No abstract text available
Text: 管理計画 QFN-0601 CONTROL PLAN (QFN-0601) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 TOREX SEMICONDUCTOR LTD. 代表例 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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QFN-0601)
QFN-0601
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USP-4D
Abstract: No abstract text available
Text: 管理計画 USP-4D CONTROL PLAN (USP-4D) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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USP-4
Abstract: No abstract text available
Text: 管理計画 USP-4 CONTROL PLAN (USP-4) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 TOREX SEMICONDUCTOR LTD. 代表例 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ ◇
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USP-6C
Abstract: No abstract text available
Text: 管理計画 USP-6C CONTROL PLAN (USP-6C) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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SOD-323A
Abstract: No abstract text available
Text: 管理計画 SOD-323A CONTROL PLAN (SOD-323A) ﾄﾚｯｸｽｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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OD-323A)
SOD-323A
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INCOMING RAW MATERIAL INSPECTION procedure
Abstract: circuit diagram of QS 8005
Text: Quality Assurance 1 General The quality of our products and services is an essential part of our corporate strategy the prime objective being maximum benefit to our customers world-wide. The high demand we fulfill by consistent application of – a Quality Management System which is always in line with the most stringent international standards,
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USP-3
Abstract: No abstract text available
Text: 管理計画 USP-3 CONTROL PLAN (USP-3) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ ◇
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SOD-723
Abstract: No abstract text available
Text: 管理計画 SOD-723 CONTROL PLAN (SOD-723) ﾄﾚｯｸｽｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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OD-723)
SOD-723
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Untitled
Abstract: No abstract text available
Text: 管理計画 SMA CONTROL PLAN (SMA) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 TOREX SEMICONDUCTOR LTD. 代表例 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ ◇ Oxide check
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USP-10
Abstract: No abstract text available
Text: 管理計画 USP-10 CONTROL PLAN (USP-10) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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USP-10)
USP-10
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QFN-24
Abstract: No abstract text available
Text: 管理計画 QFN-24 CONTROL PLAN (QFN-24) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 TOREX SEMICONDUCTOR LTD. 代表例 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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QFN-24)
QFN-24
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USP-12B01
Abstract: No abstract text available
Text: 管理計画 USP-12B01 CONTROL PLAN (USP-12B01) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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USP-12B01)
USP-12B01
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SOD-523
Abstract: No abstract text available
Text: 管理計画 SOD-523 CONTROL PLAN (SOD-523) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 代表例 TOREX SEMICONDUCTOR LTD. 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ
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OD-523)
SOD-523
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Y parameters of transistors
Abstract: SAMPLING PLAN
Text: Philips Semiconductors Product specification Microwave Transistors General BATCH RELEASE TESTS FOR GRADE “X” AND "Y” EQUIVALENTS Group B; note 1. INSPECTIONS MIL STD 750 METHOD CONDITIONS SAMPLING PLAN LTPD<2> SMALL LOT QUALITY CONFORMANCE INSPECTION
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