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    Infineon Technologies AG IGC99T120T8RMX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC99T120T8RMX1SA1)
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    Avnet Americas IGC99T120T8RMX1SA1 Waffle Pack 2,322
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    EBV Elektronik IGC99T120T8RMX1SA1 53 Weeks 1
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    Untitled

    Abstract: No abstract text available
    Text: IGC99T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications 1 Recommended for:


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    PDF IGC99T120T8RM L7683U, L7683O,

    FS300R12KE4

    Abstract: No abstract text available
    Text: IGC99T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications 1 Recommended for:


    Original
    PDF IGC99T120T8RM L7683U, L7683O, FS300R12KE4