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    Infineon Technologies AG IGC28T65T8MX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC28T65T8MX1SA2)
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    Avnet Americas IGC28T65T8MX1SA2 Waffle Pack 80
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    FS50R07N2E4

    Abstract: No abstract text available
    Text: IGC28T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		PDF IGC28T65T8M L7562M, FS50R07N2E4

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    Abstract: No abstract text available
    Text: IGC28T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		PDF IGC28T65T8M IEC62258-3: L7562M,