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    IGC189T120T6RL Search Results

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    Infineon Technologies AG IGC189T120T6RLX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC189T120T6RLX1SA)
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    Avnet Americas IGC189T120T6RLX1SA1 Waffle Pack 19
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    Abstract: No abstract text available
    Text: IGC189T120T6RL IGBT4 Low Power Chip Features: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives


    Original     		PDF IGC189T120T6RL L7703C,