TE 555
Abstract: 10X10 13X13 14X14 BDN14-6CB 11X11
Text: Peel and Stick Heat Dissipators NOTES: • Thermal resistance of adhesive tape is included • Thermal resistance values based on power densityof 3 watts/in². • Part numbers listed for standard black anodized heat sinks with IERC adhesive tapes. SIZE HEAT SINK
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BDN09-3CB/A01
BDN12-3CB/A01
BDN12-5CB/A01
BDN13-3CB/A01
BDN13-5CB/A01
BDN14-3CB/A01
BDN14-6CB/A01
BDN15-3CB/A01
BDN15-5CB/A01
BDN16-3CBA/01
TE 555
10X10
13X13
14X14
BDN14-6CB
11X11
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TX0522B
Abstract: APR27-27-20CB TXBF 032025B
Text: Heat Sinks IERC HEAT SINKS Figure 1 FIGURE 1 Figure FIGURE 2 FIGURE 3 2 FIGURE 4 FIGURE 5 Figure FIGURE 6 3 FIGURE 7 4 Figure FIGURE 8 5 6 7 8 Description Dimensions - Inches LxWxH BDN09-3CB/A01 BDN10-3CB/A01 BDN10-5CB/A01 BDN11-3CB/A01 BDN12-3CB/A01 BDN12-5CB/A01
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BDN09-3CB/A01
BDN10-3CB/A01
BDN10-5CB/A01
BDN11-3CB/A01
BDN12-3CB/A01
BDN12-5CB/A01
BDN13-3CB/A01
BDN14-3CB/A01
BDN15-3CB/A01
BDN15-5CB/A01
TX0522B
APR27-27-20CB
TXBF 032025B
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PDF
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CU1100
Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Text: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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CPR19-19-12U
CPR19-19-15U
CPR19-19-20U
CPR19-19-25U
CU1100
CPR19-19-12U
C2525M
C1919S
C2121M
CPR19-19-15U
CPR19-19-20U
CPR19-19-25U
c2929m
C2121M cts
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PDF
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C2121M
Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
Text: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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APR19-19-12CB
APR19-19-15CB
APR19-19-20CB
APR19-19-25CB
C4040T
C4343T
C4545T
C2121M
APR27-27-12CB
C2727M
APR19-19-12CB
APR19-19-15CB
APR19-19-20CB
APR19-19-25CB
C4040T
APR35
C2727S
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PDF
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Chomerics Thermattach
Abstract: T412 T411 APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB T410 Chomerics
Text: Series APF Low Height Thin-Fin Forged Heat Sinks Technical Data Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select from Multiple Fin Heights • Improved Thermal Performance
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APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
APF30-30-10CB
APF30-30-13CB
APF40-40-06CB
APF40-40-10CB
APF40-40-13CB
APF19-19-10CB/A01
Chomerics Thermattach
T412
T411
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
T410
Chomerics
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PDF
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AER25-25-12CB
Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
Text: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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AER19-19-12CB
AER19-19-15CB
AER19-19-18CB
AER19-19-21CB
AER19-19-23CB
AER19-19-28CB
AER19-19-33CB
C4040T
C4343T
C4545T
AER25-25-12CB
AER19-19-12CB
AER19-19-15CB
AER19-19-18CB
AER19-19-21CB
c2525
AER21-21-23CB
C1919S
C2121M
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PDF
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elina fan
Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
Text: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of
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VSC870,
VSC880
AN-36
VSC870
VSC880
G53034-0,
elina fan
3dfx
heat sink for 304 point BGA
2319B
658-35AB
100C
G53034-0
192 BGA PACKAGE thermal resistance
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PDF
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AN1010
Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
Text: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and
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AN1010
BCM8320
AN1010
BGA and QFP Package 14x14
BGA Package 14x14
BGA PACKAGE thermal resistance
QFP PACKAGE thermal resistance
BGA 15X15
BDN14-6CB
EXTRUDED ALUMINUM
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PDF
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AN1018
Abstract: heat sink Chomerics Thermattach T412 APF19-19-13CB APF30-30-06CB APF19-19-06CB APF19-19-10CB
Text: Technical Brief AN1018 Low Height Thin-Fin Forged Heat Sink Introduction Board space constraints and increased demands for thermal management control are challenges that engineers must consider with each new application. Unused input power is lost as heat, which can destroy
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AN1018
/T410,
AN1018
heat sink
Chomerics Thermattach
T412
APF19-19-13CB
APF30-30-06CB
APF19-19-06CB
APF19-19-10CB
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PDF
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to66 socket
Abstract: 66s 66 HP1-436-B to66 T0-66s dissipator LM25775 TO-66 SOCKET transistor t06 19 HP1-000-B
Text: Series HP1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss.
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HP1-000-U
HP1-TO3-33U
HP1-TO3-44U
HP1-436-U
HP1-TO15-U
HP1-420-U
HP1-000-CB
HP1-TO3-33CB
HP1-TO3-44CB
HP1-436-CB
to66 socket
66s 66
HP1-436-B
to66
T0-66s
dissipator
LM25775
TO-66 SOCKET
transistor t06 19
HP1-000-B
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PDF
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diode t03
Abstract: transistor t06 19 dissipator T066 HP3-000-B HP3-000-CB HP3-000-U HP3-T03-33U HP3-T03-U T0-66s
Text: Series HP3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP3 Series for Single TO-3 or Stud Mount DESCRIPTION OF CURVES A. B. C. D. E. • • N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss.
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HP3-000-U
HP3-T03-U
HP3-T03-33U
HP3-000-CB
HP3-T03-CB
HP3-T03-33CB
HP3-000-B
HP3-T03-B
HP3-T03-33B
T0-36s.
diode t03
transistor t06 19
dissipator
T066
HP3-000-B
HP3-000-CB
HP3-000-U
HP3-T03-33U
HP3-T03-U
T0-66s
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PDF
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LAT03B7B
Abstract: LA394B5CB JE3055 LA394B2CB LAIC3B2B HP3-T0127-CB insultek 445 TBA810 semi catalog LA394B2B
Text: WE STOP HEAT COLD MEOT SINK/DISSIPATOR PRODUCTS AND THERMAL MANAGEMENT GUIDE 5672 M cAdam Road Mississauga, O ntario L4Z 1T2 Telephone 416 890-0221 Fax (416) 890-1628 UliHWT I UfUUfW-Mi fr z r r r T ] , INTERNATIONAL ELECTRONIC RESEARCH CORPORATION The most comprehensive line
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OCR Scan
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PDF
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dell
Abstract: Dell Dimension 28 pin zif socket
Text: 1 2 3 ZONE REY A B C 4 DESCRIPTION INITIAL DRAWING RELEASE PROVIDED TWO SOLDER TAIL LENGTHS. ADDED NOTE 5 & 6 PROVIDED FOUR CUT-OUT RELIEF ON THE COVER: ADDED NEW PART NO. ECO. NO. DATE 1655 1735 2072 11/28/94 4/12/95 9/5/95 18 EQUAL SPACES 82.54*0.13=45.72
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OCR Scan
|
SPACES82
OWUMX33
dell
Dell Dimension
28 pin zif socket
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PDF
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Untitled
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
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2002/95/EC
2002/95/EC.
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PDF
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|
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TX0522B
Abstract: TXP0508B TX0506-1B VME card cage TXP0503B TX050 TX0547 TXP0508ND tx1807b-1b TXB2P-055-037B
Text: HEAT FRAMES GENERAL DESCRIPTION Custom aluminum heat frames are designed for ruggedized military and industrial circuit card applications in harsh environments. These frames can be sized to fit small daughter cards up to 9U VME and may be used with a bottom plate to stiffen circuit
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O-18mium
TXBE-050-028
TXB2P-050-037
TXBE-045-028B
TXB2P-045-037B
TXBE-050-028B
TXB2P-050-037B
TXBE-055-028B
TXB2P-055-037B
TXBE-045-028ND
TX0522B
TXP0508B
TX0506-1B
VME card cage
TXP0503B
TX050
TX0547
TXP0508ND
tx1807b-1b
TXB2P-055-037B
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PDF
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BA 7277
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
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Original
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2002/95/EC
2002/95/EC.
BA 7277
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PDF
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transistor A21
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
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Original
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2002/95/EC
2002/95/EC.
transistor A21
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PDF
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dissipator
Abstract: No abstract text available
Text: Series UP10 for TO-3 Dual Mount Applications Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP10 Series for TO-3 Dual Mount Applications Natural Conv. °C/W : 7.7 Forced Air (°C/W): 2 Mounting Envelope: 3.38" x 1.40" x .44" DESCRIPTION OF CURVES A. B.
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UP10-TO3-2U
UP10-426-2U
UP10-428-2U
UP10-TO-3-2CB
UP10-TO3-2B
UP10-426-2B
UP10-426-2CB
UP10-428-2CB
UP10-428-2B
dissipator
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PDF
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TO-66 SOCKET
Abstract: to66 TO-66 dissipator to66 socket weight TO66 UP-TO66-47B IERC heat sinks
Text: Series UP for TO-66 Outline Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP Series for TO-66 Outline Natural Conv. °C/W : 7.1 Forced Air (°C/W): 2.5 Mounting Envelope: 1.78" x 1.78" x 1.00" DESCRIPTION OF CURVES A. B. C. D. E. • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
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UP-TO66-U
UP-TO66-47U
UP-TO66-52U
UP-TO66-CB
UP-T66-B
UP-TO66-47CB
UP-TO66-47B
UP-TO66-52CB
UP-TO66-52B
TO-66 SOCKET
to66
TO-66
dissipator
to66 socket
weight TO66
UP-TO66-47B
IERC heat sinks
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PDF
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CTS Electronic Components
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
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Original
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2002/95/EC
2002/95/EC.
CTS Electronic Components
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
|
Original
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2002/95/EC
2002/95/EC.
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical
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Original
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2002/95/EC
2002/95/EC.
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PDF
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dissipator
Abstract: LA000B3B LA000B3CB LA000B3U LAT03B3U LAIC3B3B IERC heat sinks FPM Series
Text: Series LA-B3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-B3 Natural Conv. °C/W : 12 Forced Air (°C/W): 3.7 Mounting Envelope: 1.63" x 1.29" x .75" DESCRIPTION OF CURVES A. B. C. D. E. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
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LA000B3U
LAT03B3U
LA407B3U
LA394B3U
LA000B3CB
LAT03B3CB
LA407B3CB
LA394B3CB
LA000B3B
LAT03B3B
dissipator
LA000B3B
LA000B3CB
LA000B3U
LAT03B3U
LAIC3B3B
IERC heat sinks
FPM Series
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PDF
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dissipator
Abstract: LB-Series LAD66A1U LAIC66A1U LA000A1B LA000A1CB LA000A1U IERC heat sinks
Text: Series LA-A1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-A1 Natural Conv. °C/W : 28.9 Forced Air (°C/W): 8.1 Mounting Envelope: 1.31" x .90" x .25" DESCRIPTION OF CURVES A. B. C. D. E. • • • N.C. Horiz. Device Only Mounted to G-10.
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LA000A1U
LAD66A1U
LAIC66A1U
LA000A1CB
LA000A1B
LAD66A1CB
LAD66A1Bg
dissipator
LB-Series
LAD66A1U
LAIC66A1U
LA000A1B
LA000A1CB
LA000A1U
IERC heat sinks
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PDF
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