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    IC42S32200 Search Results

    IC42S32200 Datasheets (38)

    Part ECAD Model Manufacturer Description Curated Type PDF
    IC42S32200 Integrated Circuit Solution DYNAMIC RAM Original PDF
    IC42S32200L Integrated Circuit Solution DYNAMIC RAM Original PDF
    IC42S32200/L-6B Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-6B Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6BG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6BI Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-6BI Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6BIG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6T Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-6T Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6TG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6TI Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-6TI Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-6TIG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-7B Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-7B Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-7BG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-7BI Integrated Circuit Solution 512K x 32 Bit x 4 Banks (64-MBIT) SDRAM Original PDF
    IC42S32200/L-7BI Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF
    IC42S32200/L-7BIG Integrated Circuit Systems 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM Original PDF

    IC42S32200 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: IC42S32200 IC42S32200L Document Title 512K x 32 Bit x 4 Banks 64-MBIT SDRAM Revision History Revision No History Draft Date 0A 0B Initial Draft Obselete partial refresh function Obselete 5ns speed grade Change ICC3P from 3mA to 5mA September 26,2002 September 05,2003


    Original     		PDF IC42S32200 IC42S32200L 64-MBIT) DR036-0B 166MHz 143MHz

    IC42S32200

    Abstract: IC42S32200L
    Text: IC42S32200 IC42S32200L Document Title 512K x 32 Bit x 4 Banks 64-MBIT SDRAM Revision History Revision No History Draft Date Remark 0A Initial Draft September 26,2002 Preliminary The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and


    Original     		PDF IC42S32200 IC42S32200L 64-MBIT) DR036-0A o66MHz 143MHz IC42S32200 IC42S32200L

    IC42S32200

    Abstract: IC42S32200L DR036-0D
    Text: IC42S32200 IC42S32200L Document Title 512K x 32 Bit x 4 Banks 64-MBIT SDRAM Revision History Revision No History Draft Date 0A 0B Initial Draft Obselete partial refresh function Obselete 5ns speed grade Change ICC3P from 3mA to 5mA Revise typo Revise p.20,p.22 data and p.28 typo


    Original     		PDF IC42S32200 IC42S32200L 64-MBIT) DR036-0D 512mperature 166MHz 143MHz IC42S32200 IC42S32200L

    k4s643232f

    Abstract: KS RMII Reduced MII aa2c "routing tables"
    Text: PacketTrunk-4 Device TDMoIP/MPLS Gateway Device TXC-05870 DESCRIPTION • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC, interface via MII/RMII/SMII/SSMII; HDX or FDX • VLAN support per IEEE 802.1 p & Q • Four independent advanced clock recovery blocks


    Original     		PDF TXC-05870 TXC-05870-MB, TXC-05870 k4s643232f KS RMII Reduced MII aa2c "routing tables"

    is25c64B

    Abstract: IC61C1024 IS25C128A IS42VM16800E IS42SM16800 IS24C16A Smart is62c1024al tsop2-54 4kx8 sram IS42S32800D
    Text: To our valued customers, Often times electronic systems are placed in harsh environments that test the limits of device quality and reliability. These harsh environments exist in many Industrial, Automotive, Networking, and Mobile Communication applications. Many of these applications are


    Original     		PDF

    IC1210-m128LQ

    Abstract: IC1114 IC1210-f128lq IC1230-M128LQ IC1110-F128LQ IC1210 M128LQ IC1110-M128LQ IC1210 xd card reader IC1230-F128LQ
    Text: ISSI Advanced Memory Solutions PRODUCT SELECTOR GUIDE JUNE 2006 DRAM SRAM EEPROM LOGIC ICSI PRODUCTS Dear Valued Customer, While many memory suppliers are discontinuing SRAM and low to medium density DRAM products, we at ISSI are not. While many memory suppliers are


    Original     		PDF

    TCXO A31 10MHZ

    Abstract: MT48LC4M32B2TG-6 L1V16 Datum OCXO
    Text: PRELIMINARY PRODUCT BRIEF: SUBJECT TO CHANGE Rev: 091407 DS34S108, DS34S104, DS34S102, DS34S101 Description Abridged General Description Features The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34S108 allows up to eight T1/E1 links or frame-based serial HDLC links to be


    Original     		PDF DS34S108, DS34S104, DS34S102, DS34S101 DS34S108 823/G board25 DS34S108 TCXO A31 10MHZ MT48LC4M32B2TG-6 L1V16 Datum OCXO

    Untitled

    Abstract: No abstract text available
    Text: Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial


    Original     		PDF DS34S101, DS34S102, DS34S104, DS34S108 823/G DS34S10x DS34S101 DS34S102

    TXC-06010-MB

    Abstract: TXC-06010 samsung Capacitance lables transwitch packettrunk fifo synchronus asynchronus PacketTrunk
    Text:  PacketTrunk-4 Plus Device TDMoIP/MPLS Gateway Device TXC-06010 DATA SHEET PRODUCT PREVIEW TXC-06010-MB, Ed. 2 June 2006 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII; HDX or


    Original     		PDF TXC-06010 TXC-06010-MB, TXC-06010-MB TXC-06010 samsung Capacitance lables transwitch packettrunk fifo synchronus asynchronus PacketTrunk

    Untitled

    Abstract: No abstract text available
    Text: Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial


    Original     		PDF DS34S101, DS34S102, DS34S104, DS34S108 DS34S101 DS34S102

    Untitled

    Abstract: No abstract text available
    Text: PacketTrunk-4 Device TDMoIP/MPLS Gateway Device TXC-05870 DESCRIPTION • Four T1/E1/Serial or one T3/E3/STS-1 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC, interface via MII/RMII/SMII/SSMII; HDX or FDX • VLAN support per IEEE 802.1 p & Q • Four independent advanced clock recovery blocks


    Original     		PDF TXC-05870 TXC-05870-MB,

    RFC-5087

    Abstract: TXC-06010AIBG TXC-06010-MB K4S283232E 0X0076 cesopsn TXC-06010
    Text: PacketTrunk-4 Plus Device TDM-over-Packet Gateway Device TXC-06010 DATA SHEET PRELIMINARY TXC-06010- MB, Ed. 6 December 2009 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII;HDX or


    Original     		PDF TXC-06010 TXC-06010- TXC-06010-MB, RFC-5087 TXC-06010AIBG TXC-06010-MB K4S283232E 0X0076 cesopsn TXC-06010

    um61256

    Abstract: um611024 SRAM 64KX8 5V A29F002 TC51V4265 rom at29c010 WINBOND cross reference MT48LC8M16A2 ks0723 k4s561632 IDT72V245
    Text: Cross Reference Your Memory Provider part number brand AMIC part number Description µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B µPD4504161 28F160S3/B3/C3 A29F002 AM29DL162C/D AM29DL163C/D


    Original     		PDF PD4218165 PD424260 PD431000A PD43256B PD441000L-B PD442000L-B PD442012L-XB PD444012L-B PD4504161 um61256 um611024 SRAM 64KX8 5V A29F002 TC51V4265 rom at29c010 WINBOND cross reference MT48LC8M16A2 ks0723 k4s561632 IDT72V245

    um61256

    Abstract: hynix hy57v281620 hy57v641620 cross reference WINBOND Serial flash cross reference UM611024 256k x8 SRAM 28F160S3 Samsung EOL "DDR1 SDRAM" 1MX8/512KX16
    Text: Cross Reference Your Memory Provider Part number µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B µPD4504161 28F160S3/B3/C3 A29F002 AM29DL162C/D AM29DL163C/D AM29DL164C/D AM29F002B AM29F010


    Original     		PDF PD4218165 PD424260 PD431000A PD43256B PD441000L-B PD442000L-B PD442012L-XB PD444012L-B PD4504161 um61256 hynix hy57v281620 hy57v641620 cross reference WINBOND Serial flash cross reference UM611024 256k x8 SRAM 28F160S3 Samsung EOL "DDR1 SDRAM" 1MX8/512KX16

    um61256

    Abstract: PM25LV040 SST25LF040B Pm25LV016 PM25LV010A PM25LV080 SST25LF512A HY514264 M5M418 hynix hy57v281620
    Text: Cross Reference Your Memory Supplier part number brand AMIC part number Description µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B A29F002 AM29DL162C/D AM29DL163C/D AM29DL164C/D AM29F002B


    Original     		PDF PD4218165 PD424260 PD431000A PD43256B PD441000L-B PD442000L-B PD442012L-XB PD444012L-B A29F002 um61256 PM25LV040 SST25LF040B Pm25LV016 PM25LV010A PM25LV080 SST25LF512A HY514264 M5M418 hynix hy57v281620

    TS21C

    Abstract: No abstract text available
    Text: 19-4835; 8/09 DS34T101, DS34T102, DS34T104, DS34T108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial


    Original     		PDF DS34T101, DS34T102, DS34T104, DS34T108 823/G DS34T108. DS34T104. TS21C

    TXC-06010

    Abstract: No abstract text available
    Text: PacketTrunk-4 Plus Device TDM-over-Packet Gateway Device TXC-06010 DATA SHEET PRELIMINARY TXC-06010- MB, Ed. 5 January 2008 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII;HDX or


    Original     		PDF TXC-06010 TXC-06010- TXC-06010

    hynix ddr ram

    Abstract: No abstract text available
    Text: PacketTrunk-4 Device TDMoIP/MPLS Gateway Device TXC-05870 DESCRIPTION • Four T1/E1/Serial or one T3/E3/STS-1 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC, interface via MII/RMII/SMII/SSMII; HDX or FDX • VLAN support per IEEE 802.1 p & Q • Four independent advanced clock recovery blocks


    Original     		PDF TXC-05870 TXC-05870-MB, hynix ddr ram

    e1 E2 e3 liu transceiver

    Abstract: No abstract text available
    Text: PRELIMINARY-SUBJECT TO CHANGE ABRIDGED DATA SHEET Rev: 091407 DS34S101//DS34S102/DS34S104/DS34S108 Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices General Description The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34S108 allows up to eight T1/E1


    Original     		PDF DS34S108 823/G DS34S101/DS34S102/DS34S104/DS34S108 e1 E2 e3 liu transceiver

    Untitled

    Abstract: No abstract text available
    Text: ABRIDGED DATA SHEET Rev: 040108 DS34S101//DS34S102/DS34S104/DS34S108 Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices General Description The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC RFC-compliant DS34S108 allows up to eight T1/E1 links or frame-based serial HDLC links to be


    Original     		PDF DS34S101//DS34S102/DS34S104/DS34S108 32-Bit 16-Bit

    IS23SC55160

    Abstract: is25c64B is61wv5128 is62c1024al TSOP2-44 IS61WV51216 is62c51216 tqfp-100 IS43DR16640A is45vs16160d
    Text: To our valued customers, Often times electronic systems are placed in harsh environments that test the limits of device quality and reliability. These harsh environments exist in many Industrial, Automotive, Networking, and Mobile Communication applications. Many of these applications are


    Original     		PDF