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    IC121-5606-G4 Search Results

    IC121-5606-G4 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10136656-0612LF Amphenol Communications Solutions Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 6 Positions, Black Color, Non GW Compatible LCP, Tray packing. Visit Amphenol Communications Solutions
    75160-156-06LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,6 position, 2.54mm pitch Visit Amphenol Communications Solutions
    10136656-0611NLF Amphenol Communications Solutions Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 6 Positions, Natural Color, GW Compatible LCP, Tray packing. Visit Amphenol Communications Solutions
    10136656-0612NLF Amphenol Communications Solutions Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 6 Positions, Natural Color, Non GW Compatible LCP, Tray packing. Visit Amphenol Communications Solutions
    10073456-069LF Amphenol Communications Solutions Quickie Header, Wire to Board Connector, Double Row, 60 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating. Visit Amphenol Communications Solutions

    IC121-5606-G4 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IC121-5606-G4 Yamaichi Electronics Shrink Dual Inline Package (SDIP) Original PDF
    IC121-5606-G4L Yamaichi Electronics Shrink Dual Inline Package (SDIP) Original PDF
    IC121-5606-G4LMF Yamaichi Electronics Shrink Dual Inline Package (SDIP) Original PDF
    IC121-5606-G4MF Yamaichi Electronics Shrink Dual Inline Package (SDIP) Original PDF