16V8H-15
Abstract: 20-2136J res 10k sip 16V8H-15 pc IC 4020 pulse TRANSFORMER valor res 0402 MSL-260-G-H ic 0808 data sheet 16v8h
Text: PLX Technology PCI9060 DEMO List of Materials 06/16/96 Description Qty Vendor Vendor Part Reference Designator PCB,PCI9060 DEMO,Rev A IC,PCI9060,PQFP IC,80960CA,33 MHz,PQFP IC,82596CA,33 MHz,PFQP IC,82C503,PLCC IC,16550A,PLCC IC,Static Ram, 32Kx8, 15 nsec, 28 Pin 300 Mil SOJ
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PCI9060
80960CA
82596CA
82C503
6550A
32Kx8,
256Kx8
NS16550AV
16V8H-15
20-2136J
res 10k sip
16V8H-15 pc
IC 4020
pulse TRANSFORMER valor
res 0402
MSL-260-G-H
ic 0808 data sheet
16v8h
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OBGA
Abstract: No abstract text available
Text: iC-LSB, iC-LSC oBGA LS2C PHOTOSENSOR PACKAGE SPECIFICATION Rev B1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-LSB oBGA LS2C glass lid iC-LSB oBGA LS2C iC-LSB oBGA LS2C reticle iC-LSB oBGA LS2C-LSxR iC-LSC oBGA LS2C glass lid iC-LSC oBGA LS2C
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Power IC
Abstract: PB-102
Text: 6.7 Unit : mm 23.6 Length : 550±2.0 Thickness : 0.5 +2.0 −2.0 Tolerance : ±0.4 Material : Plastic with antistatic finish PB-102 Applied Package Quantity(pcs) 7 pin SIP (power IC) 25 8 pin SIP (power IC) 25 9 pin SIP (power IC) 20 10 pin SIP (S) (power IC)
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PB-102
Power IC
PB-102
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transistor current booster circuit
Abstract: pin configuration transistor BD139 SCHEMATIC mda monitor power booster circuit diagram WK4D RLD-65NE iC-WKN current booster schematic BD139 PIN DIAGRAM SCHEMATIC mda
Text: iC-WK DEMO WK4D DEMO BOARD DESCRIPTION Rev A1, Page 1/3 ORDERING INFORMATION Type Order Designation Description/Options iC-WK Demo iC-WKL Demo iC-WKN Demo WK4D DEMO WKL4D DEMO WKN4D DEMO Evaluation boards for iC-WK, iC-WKL and iC-WKN; easy to set up for the booster circuit
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ic type diagram
Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION
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optical rotary encoder
Abstract: Linear Rotary Encoder IHI magnetic linear ENCODER IC Magnetic Rotary Encoder iC-Haus Rotary Encoder switch A1 hall sensor iC-SM2L Optical encoder Sensor
Text: iC-MN AN5 APPLICATION CIRCUIT EXAMPLES Rev A2, Page 1/6 OPTICAL ROTARY ENCODER Disc iC-PNxxxx iC-MN Figure 1: Application circuit of iC-MN with iC-PNxxxx for optical rotary encoder featuring 3-channel nonius interpolation. Copyright 2010 iC-Haus http://www.ichaus.com
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DIAGRAM OF RJ45 to female usb
Abstract: iC-MB3 Power Distribution Board with line diagram RJ45-OUT iC-NQ DIAGRAM OF RJ45 to male usb
Text: iC-NQ EVAL NQ5D EVALUATION BOARD DESCRIPTION Rev A1, Page 1/3 ORDERING INFORMATION Type Order Designation Description iC-NQ, iC-MA EVAL NQ5D Evaluation Board ready-to-operate, equipped with iC-NQ and iC-MA angle sensor iC-NQ GUI Software Evaluation Board Software
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OF2RZ
Abstract: No abstract text available
Text: iC-OF BLCC OF3C PACKAGE SPECIFICATION Rev C2, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF BLCC OF3C none iC-OF BLCC OF3C iC-OF BLCC OF3C reticle iC-OF BLCC OF3C OF2RZ iC-OF BLCC OF3C-ET iC-OF BLCC OF3C-ET reticle Code Disc 1024 PPR, 18 mm
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"PNP Transistor"
Abstract: NPN PNP sot-563 npn-pnp-transistors transistor equivalent table ic marking z7 sot-563 Z7 TRANSISTOR sot-563 marking Z1 sot Marking z7 smd transistor 560
Text: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS IC MATERIAL USED CARRIES UL 94V-0 TYPE Marking Collector to Emitter Voltage Collector DC Current Gain Current VCEO IC V mA Saturation Voltage Collector to Emitter HFE @ VCE / IC VCE SAT @ IC / IB Typical
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OT-553
SC-88A
OT-563
SC-88
"PNP Transistor"
NPN PNP sot-563
npn-pnp-transistors
transistor equivalent table
ic marking z7
sot-563 Z7
TRANSISTOR sot-563
marking Z1 sot
Marking z7
smd transistor 560
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TSOP 32 thermal resistance
Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance
Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION
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iC-MB4
Abstract: smd diode IF usb lpt IC-MB4 ICSY MB4U 478M05 iC-MB3 ic-nqc IC-NQCEVALNQ6D IC 7805 description SMD 78m05
Text: iC-NQ, iC-NQC EVAL NQ6D EVALUATION BOARD DESCRIPTION Rev A3, Page 1/10 ORDERING INFORMATION Type Order Designation Description Options Evaluation Board iC-NQ EVAL NQ6D iC-NQC EVAL NQ6D iC-NQ Evaluation Board iC-NQC Evaluation Board ready to operate, accessible through GUI via PC adapter
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7805 smd
Abstract: Datasheet of ic 7805 SMD 78m05 IC 7805 pin diagram SMD Transistor A data sheet working principle of IC 7805 IC U4 7805 pin diagram labview 65LBC179 IC 7805 description
Text: iC-NQ, iC-NQC EVAL NQ6D EVALUATION BOARD DESCRIPTION Rev A2, Page 1/9 ORDERING INFORMATION Type Order Designation Description Options Evaluation Board iC-NQ EVAL NQ6D iC-NQC EVAL NQ6D iC-NQ Evaluation Board iC-NQC Evaluation Board ready to operate, accessible through GUI via PC adapter
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Untitled
Abstract: No abstract text available
Text: Amphenol IC Socket Interconnects G820 DIP IC Socket PCB Mount Screw Machine Type Low profile 2.54mm Pitch DIP IC Socket with screw-machine contacts. Materials Durability Housing Contacts – 94V-0 thermoplastic – P/B with 50µ” Ni Electrical Current Voltage
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250VAC/rms
PNS-818
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SC74A
Abstract: 74a diode 2SA20 chdtc114e transistor circuit BD NPN transistors CHUMH11 marking FG9 CIRCUIT79
Text: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS IC MATERIAL USED CARRIES UL 94V-0 TYPE Marking Equivalent Collector Collector to Current Emitter Voltage IC VCEO V mA DC Current Gain HFE @ VCE / IC Min-Max V / mA Saturation Voltage Collector to Emitter VCE SAT @ IC / IB
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CHUMD12
CHDTA114E
CHDTC114E
CHDTA114Y
CHDTC114Y
CHDTA124E
CHDTC124E
CHDTA144E
SC74A
74a diode
2SA20
chdtc114e
transistor circuit
BD NPN transistors
CHUMH11
marking FG9
CIRCUIT79
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MIFARE Card IC Coil Design Guide
Abstract: Mifare MF1 IC S 70 MIFARE s70 chip X118 AN MIFARE Card Coil Design Guide 101730 S7001
Text: MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader
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MF1ICS7001W/V9D
MIFARE Card IC Coil Design Guide
Mifare MF1 IC S 70
MIFARE s70 chip
X118
AN MIFARE Card Coil Design Guide
101730
S7001
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OBGA
Abstract: iC-Haus OF4C analog devices bottom mark
Text: iC-OF oBGA OF4C PACKAGE SPECIFICATION Rev C1, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF optoBGATM OF4C none leaded balls built-in reticle iC-OF oBGA OF4C iC-OF oBGA OF4C-1 iC-OF oBGA OF4C-OF2RY optoBGATM OF4C 5.4 mm x 4.2 mm
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Untitled
Abstract: No abstract text available
Text: Linear Charger for 1Cell Li-ion Battery with System-path IC MM3538AL Linear Charger for 1Cell Li-ion Battery with System-path IC Monolithic IC MM3538AL Outline This IC is a linear charging control IC with built-in system paths, and includes a chip with system path function
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MM3538AL
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diode wg
Abstract: 9958 MMA6
Text: iC-WG BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION Rev E1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-WG BLCC WGC Glass Lid iC-WG BLCC WGC-WG1L iC-WG BLCC WGC iC-WG BLCC WGC-WG1R Code Disc 13bit-Gray +2048 PPR A/B, d 44mm - reticle
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13bit-Gray
diode wg
9958
MMA6
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ic u11
Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Text: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work
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MF0ICU1001W/V1D
MF0ICU1101W/V1D
ic u11
MIFARE Card IC Coil Design Guide
74x74
LCR meter for ICs package
MIFARE Card Coil Design Guide
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29150
Abstract: Kombi
Text: austerlitz electronic Kühlkörper für IC und Plastik-Transistoren Heat sinks for IC and plastic-transistors. Dissipateurs pour des IC et transistors plastiques. KS 12.1 Material: ALMg Si 05 Oberfläche: schwarz eloxiert Gewicht g : 1 Gehäuse: TO 220 Bestell-Nr.: KS 12.1-(Länge) E 1 x M 3
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5/50/75/100/150/ieren
KS291-
29150
Kombi
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MIFARE Card IC Coil Design Guide
Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01
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SCA74
MIFARE Card IC Coil Design Guide
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MF1 IC S70
k 1356
12NC ordering code philips
MIFARE s70
philips application notes
philips 15601
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sanyo tv circuit diagram
Abstract: LA7846N
Text: Ordering number : ENN*5149C LA7846N Monolithic Linear IC Vertical Output IC Overview The LA7846N is a vertical deflection output IC for high-definition TV and CRT displays in systems that use a bus control system signal-processing IC. This IC can directly drive including the DC component the deflection yoke from the
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5149C
LA7846N
LA7846N
LA768X
LA769XX
sanyo tv circuit diagram
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SM 933
Abstract: No abstract text available
Text: M U LTILA Y E R CERAM IC CHIP CAPACITORS • INTRODUCTION The Multilayer Ceram ic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceram ic ic materials and firing into a concrete monolithic body, then com pleted by
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010/iF
1000pF
010/tF
SM 933
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788712-1
Abstract: tyco usb
Text: 16.00 FRONT EDGE OF CONNECTOR 9.58 9.00 NOTE: 1. MATERIAL: HOUSING: THERMOPLASTIC HIGH TEMPERATURE, UL 9 4 V —0, COLOR: BLACK. CONTACT: PHOSPHOR BRONZE, TH IC KN ESS=0.25m m . SHELL: PHOSPHOR BRONZE, TH IC KN ESS=0.30m m . REAR SHELL: STAINLESS, TH IC KN ESS=0.30m m .
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C--788712
788712-1
tyco usb
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