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    IBM DIE MOUNTING Search Results

    IBM DIE MOUNTING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd

    IBM DIE MOUNTING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PPC970FX

    Abstract: ablestik 8360 Ablestik underfill PPC970 PPC-970FX Thermacore
    Text: Application Note Thermal Considerations: PPC970FX Abstract The 64-bit IBM PowerPC 970FX PPC970FX enters a new era of processing power and thermal dissipation over earlier PowerPC products. The processor can operate at multiple GHz clock speeds and can dissipate relatively high levels of power through a very small processor die. The high power


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    PDF PPC970FX 64-bit 970FX PPC970FX) PPC970FX ablestik 8360 Ablestik underfill PPC970 PPC-970FX Thermacore

    "0.4mm" bga "ball collapse" height

    Abstract: cga 624 ibm semi reflow temperature bga
    Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the


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    PDF w/2116 "0.4mm" bga "ball collapse" height cga 624 ibm semi reflow temperature bga

    c557c

    Abstract: PPC970MP 970MP heat and mass transfer how to use silicon heat sink compound for planer PPC970FX heat pipes PowerPC-970mp PowerPC970MP ibm die mounting
    Text: Application Note PowerPC970MP Thermal Considerations PowerPC970MP Thermal Considerations Abstract The 64-bit PowerPC970MP 970MP is an enhanced dual processor version of the PPC970FX microprocessor. The 970MP contains two complete 64-bit microprocessor cores, dual 1-MB L2 caches, and


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    PDF PowerPC970MP 64-bit PowerPC970MPTM 970MP) PPC970FX 970MP 970MP c557c PPC970MP heat and mass transfer how to use silicon heat sink compound for planer heat pipes PowerPC-970mp ibm die mounting

    CPC945

    Abstract: PPC970 PPC970FX PowerPC 970 970MP IBM PPC970FX RISC Microprocessor and CPC945 Bridge Design Guidelines PowerPC 970 user manual PPC-970FX GD31244 IBM schematics t21
    Text: Title Page IBM PowerPC 970FX RISC Microprocessor and CPC945 Bridge and Memory Controller Design Guide SA14-970FXDG-03 October 31, 2007 Copyright and Disclaimer Copyright International Business Machines Corporation 2007 All Rights Reserved Printed in the United States of America October 2007


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    PDF 970FX CPC945 SA14-970FXDG-03 PPC970 PPC970FX PowerPC 970 970MP IBM PPC970FX RISC Microprocessor and CPC945 Bridge Design Guidelines PowerPC 970 user manual PPC-970FX GD31244 IBM schematics t21

    PowerPC-604e

    Abstract: Zo transistor h07 604e3 PPC604 666MHZ AC16 604E b09 n03 transistor PowerPC 604e3 255-Lead
    Text: PowerPC 604e RISC Microprocessor Preliminary Copy PowerPC 604e™ RISC Microprocessor Family: PID9q-604e Datasheet The PowerPC 604e microprocessor is an implementation of the PowerPC family of reduced instruction set computing RISC microprocessors. In this document, the term ‘604’ is used as an


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    PDF 604eTM PID9q-604e 604TM PPC604e. PID10q-604e. 604e3. PowerPC604 PowerPC604e PowerPC-604e Zo transistor h07 604e3 PPC604 666MHZ AC16 604E b09 n03 transistor PowerPC 604e3 255-Lead

    IBM25PPC750

    Abstract: IBM25PPC750GX IBM25PPC750G
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: SA14-2765-00 February 17, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2005 All Rights Reserved Printed in the United States of America February 2005.


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    PDF 750GX SA14-2765-00 SA14-2765-00 SA14-2765-00. IBM25PPC750 IBM25PPC750GX IBM25PPC750G

    PowerPC 750GL

    Abstract: IBM25PPC750GL PPC750GL IBM25PPC750 750GL powerpc 750l compatible IBM25PPC750GLECR IBM25PPC750G PowerPC-750GL LOCTITE 274
    Text: IBM PowerPC 750GL RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.2 Preliminary March 13, 2006 Copyright and Disclaimer Copyright International Business Machines Corporation 2005, 2006 All Rights Reserved Printed in the United States of America March 2006.


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    PDF 750GL is750GL PowerPC 750GL IBM25PPC750GL PPC750GL IBM25PPC750 powerpc 750l compatible IBM25PPC750GLECR IBM25PPC750G PowerPC-750GL LOCTITE 274

    250 mhz IBM PowerPC Processor

    Abstract: EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L
    Text: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the


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    PDF 740TM 750TM EMPPC740L EMPPC750L 250 mhz IBM PowerPC Processor EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L

    PPC750GL

    Abstract: PowerPC 750GL IBM25PPC750GL PowerPC 750 IBM25ppc750L PowerPC 750FX
    Text: IBM PowerPC 750GL RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.0 June 1, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2005 All Rights Reserved Printed in the United States of America June 2005.


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    PDF 750GL PPC750GL PowerPC 750GL IBM25PPC750GL PowerPC 750 IBM25ppc750L PowerPC 750FX

    PowerPC 750gx

    Abstract: IBM25PPC750GX IBM25PPC750GXE W12 FERRITE 750GX
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.1 Preliminary December 27, 2004 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2004 All Rights Reserved Printed in the United States of America March 2004.


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    PDF 750GX PowerPC 750gx IBM25PPC750GX IBM25PPC750GXE W12 FERRITE

    BGA heatsink compressive force

    Abstract: No abstract text available
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.0 Preliminary March 29, 2004 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2004 All Rights Reserved Printed in the United States of America March 2004.


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    PDF 750GX BGA heatsink compressive force

    EMPPC740

    Abstract: EMPPC750 PowerPC 740 reference manual EMPPC750L 250 mhz IBM PowerPC Processor interface 740 IBM k08 transistor 740BGA
    Text: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division This Material Copyrighted By Its Respective Manufacturer Notices Before using this information and the product it supports, be sure to read the general information on the


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    PDF 740TM 750TM EMPPC740L EMPPC750L EMPPC740 EMPPC750 PowerPC 740 reference manual EMPPC750L 250 mhz IBM PowerPC Processor interface 740 IBM k08 transistor 740BGA

    750GX

    Abstract: IBM25PPC750GX powerpc 750l compatible 292-CBGA IBM powerPC schematics 750FX BGA heatsink compressive force BGA Solder Ball compressive force LOCTITE 274 IBM25PPC750G
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: SA14-2765-02 September 2, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2005 All Rights Reserved Printed in the United States of America August 2005.


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    PDF 750GX SA14-2765-02 IBM25PPC750GX powerpc 750l compatible 292-CBGA IBM powerPC schematics 750FX BGA heatsink compressive force BGA Solder Ball compressive force LOCTITE 274 IBM25PPC750G

    Nippon capacitors

    Abstract: Loctite E04 PPC604E
    Text: Freescale Semiconductor, Inc. G522-0296-01 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 5/97 REV 1 RY IN A Advance Information IM PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications EL The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


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    PDF G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Nippon capacitors Loctite E04 PPC604E

    PROCESSOR

    Abstract: PPC604e Nippon capacitors
    Text: G522-0296-01 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 5/97 REV 1 Advance Information IN A RY IM PowerPC 604e™ RISC Microprocessor Family: PID9v-604e Hardware Specifications PR EL The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


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    PDF G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. PROCESSOR PPC604e Nippon capacitors

    PPC604e

    Abstract: b09 n03 transistor Nippon capacitors ABB ibis
    Text: G522-0319-00 IBM Order Number MPC604E9QEC/D (Motorola Order Number) 3/98 IN A RY ª Advance Information IM PowerPC 604eª RISC Microprocessor Family: EL PID9q-604e Hardware SpeciÞcations PR The PowerPC 604e microprocessor is an implementation of the PowerPC¨ family of reduced


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    PDF G522-0319-00 MPC604E9QEC/D PID9q-604e MPC604e PPC604e. PID10q-604e. PPC604e b09 n03 transistor Nippon capacitors ABB ibis

    1b07

    Abstract: Nippon capacitors
    Text: G522-0319-00 IBM Order Number MPC604E9QEC/D (Motorola Order Number) 3/98 IN A RY ª Advance Information IM PowerPC 604eª RISC Microprocessor Family: EL PID9q-604e Hardware SpeciÞcations PR The PowerPC 604e microprocessor is an implementation of the PowerPC¨ family of reduced


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    PDF G522-0319-00 MPC604E9QEC/D PID9q-604e MPC604e PPC604e. PID10q-604e. 1b07 Nippon capacitors

    Nippon capacitors

    Abstract: No abstract text available
    Text: Freescale Semiconductor, Inc. G522-0319-00 IBM Order Number MPC604E9QEC/D (Motorola Order Number) 3/98 IN A RY Advance Information IM PowerPC 604eª RISC Microprocessor Family: EL PID9q-604e Hardware SpeciÞcations The PowerPC 604e microprocessor is an implementation of the PowerPC¨ family of reduced


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    PDF G522-0319-00 MPC604E9QEC/D PID9q-604e MPC604e PPC604e. Nippon capacitors

    PCTL-900

    Abstract: No abstract text available
    Text: Amphenol RF Tools Tools Description Amphenol offers a full line of termination tooling to meet your specific production requirements. All tools meet Amphenol’s stringent design and quality requirements, including full cycle ratchet control, which prevents the connector from being removed


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    PDF M22520/5-29 M22520/5-32 M22520/5-37 M22520/5-57 M22520/5-59 M22520/5-61 M22520/5-01 227-1221-XX 227-980-X PCTL-900

    laser diode for free space communication

    Abstract: GD16521-48BA GD16521-D STM-16 DIODE h4 1027ib 50W 50 ohm termination
    Text: 2.5 Gbit/s Re-timing Laser Driver GD16521 an Intel company Preliminary General Description Features laser diode. A modulation current control loop maintains a constant modulation current for the laser diode, or alternatively maintains a constant extinction ratio of the laser diode.


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    PDF GD16521 GD16521 STM-16 OC-48 DK-2740 laser diode for free space communication GD16521-48BA GD16521-D DIODE h4 1027ib 50W 50 ohm termination

    Untitled

    Abstract: No abstract text available
    Text: 2.5 Gbit/s Re-timing Laser Driver GD16521 an Intel company Preliminary General Description Features laser diode. A modulation current control loop maintains a constant modulation current for the laser diode, or alternatively maintains a constant extinction ratio of the laser diode.


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    PDF GD16521 GD16521 STM-16 OC-48 DK-2740

    Nippon capacitors

    Abstract: b09 n03 transistor
    Text: Freescale Semiconductor, Inc. G522-0296-01 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 5/97 REV 1 RY C IN . A R, O CT U ND O IC EM EL IM IN S E L CA PowerPC 604e RISC Microprocessor Family: S E E PID9v-604e Hardware Specifications FR Y B D


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    PDF G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e Nippon capacitors b09 n03 transistor

    LOCTITE 234

    Abstract: LOCTITE 238 LOCTITE 222 wb ih surface mount transistor Thermagon thermal grease Loctite 401 data sheet ibm rev.1.5 LOCTITE 227 LOCTITE 239 ac t06
    Text: G522-0268-00 IBM Order Number MPC603EEC/D (Motorola Order Number) 12/96 REV 1 Advance Information PowerPC 603e ™ RISC Microprocessor Family: PID6-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


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    PDF G522-0268-00 MPC603EEC/D PID6-603e MPC603e PPC603e. LOCTITE 234 LOCTITE 238 LOCTITE 222 wb ih surface mount transistor Thermagon thermal grease Loctite 401 data sheet ibm rev.1.5 LOCTITE 227 LOCTITE 239 ac t06

    Untitled

    Abstract: No abstract text available
    Text: 3 RACK OR WALL MOUNTABLE 19” PATCH PANELS Product Facts • Higher density ■ Direct grounding to panel can eliminate grounding tower ■ Wall mounting requires less closet space These patch panels accept only AMP Universal Data Connector panel mount kits. Part Number 555707 & 558212


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