110621
Abstract: SOT617-3
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm D B SOT617-3 A terminal 1 index area A A1 E detail X C e1 e 9 16 L y1 C C A B C v w 1/2 e b y 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area
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HVQFN32:
OT617-3
OT617-3
MO-220
sot617-3
110621
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hvqfn32
Abstract: HVQFN-32 solder paste SOT617-3
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN32 package SOT617-3 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN32
OT617-3
OT617-3
HVQFN-32
solder paste
SOT617-3
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Untitled
Abstract: No abstract text available
Text: +9 4 1 SOT617-1 HVQFN32; Reel pack; SMD, 7"; standard product orientation Orderable part number ending, 115 or X Ordering code 12NC) ending 115 Rev. 1 — 16 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal
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OT617-1
HVQFN32;
001aak603
OT617-1
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HVQFN32
Abstract: SOT617-3
Text: 4 1 SOT617-3 +9 HVQFN32; Reel pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,118 or J Ordering code 12NC) ending 118 Rev. 1 — 2 April 2014 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT617-3
HVQFN32;
001aak603
OT617-3
HVQFN32
SOT617-3
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A E detail X e1 e ∅v ∅w b C A B C C 1/2 e L1 9 y y1 C 16 L 8 17 e Eh e2 1/2 e
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HVQFN32R:
OT1152-1
sot1152-1
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SOT617-1
Abstract: HVQFN32 HVQFN-32 MO-220
Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 16 y y1 C v M C A B w M C
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HVQFN32:
OT617-1
MO-220
SOT617-1
HVQFN32
HVQFN-32
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm B D SOT865-3 A terminal 1 index area E A c A1 detail X C e1 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1 index area 32
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HVQFN32:
OT865-3
MO-220
sot865-3
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT617-9 Hx Gx D P 0.025 0.025 C nSPy Hy Gy SPx tot SPy tot 3.20 SLy By Ay SPy X nSPx SPx 0.80 3.10 SLx solder land Bx 0.6 Ax 0.3 detail X solder paste deposit solder land plus solder paste
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HVQFN32
OT617-9
sot617-9
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y y1 C C A B C L 17 8 e e2 Eh 1/2 e 1 24 terminal 1
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HVQFN32:
OT865-1
MO-220
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HVQFN32
Abstract: sot617-3 MO-220 E241
Text: PDF: 2002 Oct 22 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 y1 C v M C A B w M C b
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HVQFN32:
OT617-3
MO-220
HVQFN32
sot617-3
MO-220
E241
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HVQFN-32
Abstract: SOT617-2 HVQFN32 MO-220
Text: PDF: 2003 May 02 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 v M C A B w M C b
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HVQFN32:
OT617-2
MO-220
HVQFN-32
SOT617-2
HVQFN32
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm SOT865-2 B D D1 A terminal 1 index area E1 E A A2 c A1 detail X e1 C 1/2 e 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1
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HVQFN32:
OT865-2
sot865-2
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e v M C A B w M C b 1/2 e 9 16 y1 C y L 17 8 e e2 Eh 1/2 e 1 24
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HVQFN32:
OT617-2
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 L M M y y1 C C A B C 17 8 e e2 Eh 1/2 e 1 24 terminal 1
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HVQFN32:
OT866-1
Plastic075
MO-220
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Untitled
Abstract: No abstract text available
Text: +9 4 1 SOT617-1 HVQFN32; Reel pack; SMD, 13"; standard product orientation Orderable part number ending, 118 or J Ordering code 12NC) ending 118 Rev. 1 — 12 June 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal
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OT617-1
HVQFN32;
001aak603
OT617-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN32
OT865-2
sot865-2
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN32 package SOT617-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN32
OT617-1
OT617-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-9 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C Øv Øw b y y1 C L 8 17 e e2 Eh 1/2 e 24 1 terminal 1
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HVQFN32:
OT617-9
protrusion075
MO-220
sot617-9
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT1030-1 terminal 1 index area E A A1 c detail X e1 1/2 e v w b e L 9 16 C C A B C M M y1 C y 17 8 e e2 Eh 1/2 e 1 24 terminal 1
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HVQFN32:
OT1030-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-5 terminal 1 index area A E A1 c detail X e1 1/2 e L1 C v w b e 9 16 M M C A B C y y1 C e L 17 8 e2 Eh b c 1/2 e 1 24 terminal 1
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HVQFN32:
OT617-5
MO-220
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HVQFN32
Abstract: MO-220 sot866
Text: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2
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HVQFN32:
OT866-1
MO-220
HVQFN32
MO-220
sot866
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HVQFN32
Abstract: MO-220 Thin Quad flat package 44 mo-220 sot865
Text: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2
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HVQFN32:
OT865-1
MO-220
HVQFN32
MO-220
Thin Quad flat package 44 mo-220
sot865
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 3 x 6 x 0.85 mm A B D SOT1185-1 terminal 1 index area E A A1 c detail X e e1 12 16 C C A B C v w b y y1 C L 17 11 e e2 Eh 27 1 terminal 1 index area 32 28
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HVQFN32:
OT1185-1
07per
sot1185-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-7 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C v w b y y1 C L 8 17 e e2 Eh 1/2 e 1 24 terminal 1 index area
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HVQFN32:
OT617-7
sot617-7
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