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    HPI_FEATURES Search Results

    HPI_FEATURES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ADM1073ARUZ Analog Devices Full Featured -48V Hot Swap Ct Visit Analog Devices Buy
    ADM1073ARUZ-REEL Analog Devices Full Featured -48V Hot Swap Ct Visit Analog Devices Buy
    ADZS-A2B-ANALYZER Analog Devices Full-featured Emulator AND Mon Visit Analog Devices Buy
    DC2937A Analog Devices Multi-topo high eff Cnv featur Visit Analog Devices Buy
    ADM1073ARUZ-REEL7 Analog Devices Full Featured -48V Hot Swap Ct Visit Analog Devices Buy

    HPI_FEATURES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MTfc8g

    Abstract: MTFC32GJTED regulator 2gb smd MTFC4GMTEAWT MTFC4GMTEA-WT MTFC16
    Text: Micron Confidential and Proprietary 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e•MMC Features e·MMC Memory MTFC2GMTEA-WT, MTFC4GMTEA-WT, MTFC8GLTEA-WT, MTFC16GLTAM-WT, MTFC16GLTDV-WT, MTFC16GJTEC-WT, MTFC32GLTDM-WT, MTFC32GLTDI-WT, MTFC32GJTED-WT, MTFC64GJTEF-WT


    Original     		PDF MTFC16GLTAM-WT, MTFC16GLTDV-WT, MTFC16GJTEC-WT, MTFC32GLTDM-WT, MTFC32GLTDI-WT, MTFC32GJTED-WT, MTFC64GJTEF-WT 169-ball 09005aef8495885a n2m400 MTfc8g MTFC32GJTED regulator 2gb smd MTFC4GMTEAWT MTFC4GMTEA-WT MTFC16

    H26M* hynix

    Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
    Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title


    Original     		PDF 150ms) 512KB 220ms 247ms 262ms H26M* hynix Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5

    SEM64G

    Abstract: sandisk eMMC 4.41 Sandisk emmc SEM32G SDIN5C1-16G-L SEM16G SEM08G emmc 4.41 SEM04G sdin5d2
    Text: Standard and Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03462 V1.4 December 2011 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03462 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet


    Original     		PDF 14-Mar-11 11-Nov 15-Dec SDIN5D1-16G-L SEM64G sandisk eMMC 4.41 Sandisk emmc SEM32G SDIN5C1-16G-L SEM16G SEM08G emmc 4.41 SEM04G sdin5d2

    MTFC4GACAANA-4M IT

    Abstract: MTFC4GACAANA MTFC8GACAANA-4M IT micron marking code information MTFC8GLDDQ-4M IT MTFC4GAC MTFC4GACA JESD84-B451 4gb nand flash MTFC4G MTFC4GACAANA-4M
    Text: Preliminary‡ Micron Confidential and Proprietary 4GB, 8GB: e•MMC Features e·MMC Memory MTFC4GACAANA-4M IT, MTFC8GACAANA-4M IT Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 100-ball TBGA (RoHS compliant, "green" package)


    Original     		PDF 100-ball 51-compliant 84-B451) 11-signal 09005aef856fbc21 ps8210 MTFC4GACAANA-4M IT MTFC4GACAANA MTFC8GACAANA-4M IT micron marking code information MTFC8GLDDQ-4M IT MTFC4GAC MTFC4GACA JESD84-B451 4gb nand flash MTFC4G MTFC4GACAANA-4M

    KLM4G1FE3B-B001

    Abstract: KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5
    Text: Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e•MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		PDF KLMxGxFE3B-x00x KLM4G1FE3B-B001 KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5

    KLM8G2FEJA-A001

    Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
    Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.


    Original     		PDF 8/16/32GB KLMXGXFEJA-X001 KLM8G2FEJA-A001 KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMCGAFEJA-B001

    32GB eMMC

    Abstract: MTFC8GLDEA-4M IT micron eMMC 5.0 emmc bga 162 BGA 221 eMMC micron emmc application note 221 ball eMMC memory emmc 4.41 firmware operation MTFC4G micron emmc 4.5
    Text: Micron Confidential and Proprietary 4GB, 8GB, 16GB, 32GB, 64GB: e•MMC Features e·MMC Memory MTFC4GMDEA-4M IT, MTFC8GLDEA-4M IT, MTFC16GJDEC-4M IT, MTFC32GJDED-4M IT, MTFC64GJDDN-4M IT Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash


    Original     		PDF MTFC16GJDEC-4M MTFC32GJDED-4M MTFC64GJDDN-4M 169-ball 09005aef8523ca91 4gb-64gb 441-it 32GB eMMC MTFC8GLDEA-4M IT micron eMMC 5.0 emmc bga 162 BGA 221 eMMC micron emmc application note 221 ball eMMC memory emmc 4.41 firmware operation MTFC4G micron emmc 4.5

    MTFC4G

    Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
    Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)


    Original     		PDF MTFC16GKQDI, MTFC32GKQDH 153-ball 169-ball 41-compliant 84-A441) 09005aef838eabba j534q567r MTFC4G MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB

    hynix emmc

    Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
    Text: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History


    Original     		PDF H26M31001EFR fig13 25Mhz, 52MHz, 64Kbyte hynix emmc h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31

    emmc bga 162

    Abstract: BGA 221 eMMC MTFC4GLDDQ-4M IT MTFC32GJDDQ-4M IT emmc CID eMMC 4.41 application note MTFC4GLDDQ-4M MMC04G 221 ball eMMC memory MMC08G
    Text: Micron Confidential and Proprietary 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GLDDQ-4M IT, MTFC8GLDDQ-4M IT MTFC16GJDDQ-4M IT, MTFC32GJDDQ-4M IT Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 100-ball LBGA (RoHS 6/6compliant)


    Original     		PDF MTFC16GJDDQ-4M MTFC32GJDDQ-4M 100-ball 09005aef8523caab 4-32gb 100b-it emmc bga 162 BGA 221 eMMC MTFC4GLDDQ-4M IT MTFC32GJDDQ-4M IT emmc CID eMMC 4.41 application note MTFC4GLDDQ-4M MMC04G 221 ball eMMC memory MMC08G

    SEM32G

    Abstract: sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash
    Text: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet


    Original     		PDF 25-Feb-10 SEM32G sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G

    SEM08G

    Abstract: SDIN7DU2-16G sandisk 8GB Nand flash sandisk emmc sandisk Nand flash part number BGA 221 eMMC emmc Pin assignment emmc bga 162 SDIN7DU2-8G sandisk 32GB Nand flash
    Text: Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03666 V1.2 May 2012 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03666 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet


    Original     		PDF 22-Jan-12 20-Feb-12 29-May-12 30-May-12 SEM08G SDIN7DU2-16G sandisk 8GB Nand flash sandisk emmc sandisk Nand flash part number BGA 221 eMMC emmc Pin assignment emmc bga 162 SDIN7DU2-8G sandisk 32GB Nand flash