PCM45
Abstract: INTEL 5520 honeywell 95C TCONTROL PCM45F honeywell pcm45 foxconn motherboard la 7630
Text: Intel 5520 and Intel® 5500 Chipsets Thermal/Mechanical Design Guidelines November 2009 Document Number: 321330, Revision: -003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
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honeywell pcm45
Abstract: PCM45 HB9703E-M3W HB9703E-DW A13494008 HB9703EDW A13494-008 BGA heatsink compressive force PCM45F D82348-004
Text: Intel 7500 Chipset Thermal/Mechanical Design Guidelines March 2010 Reference Number: 322825-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
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Loctite 7452
Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
Text: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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315344-001US
Loctite 7452
TT 2206 datasheet
TT 2206
transistor tt 2206
motherboard with multimeter
pcm45
PCM45F
Loctite 3733
631X
TT 2206 transistor
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Loctite 7452
Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001
Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
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631xESB/632xESB
Loctite 7452
PCM45
6700PXH
6702PXH
INTEL 5000P Chipset Platform Design Guide
PCM45F
631xesb
D12403-001
D10234-001
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PCM45F
Abstract: intel core 2 duo e7500 T9400 atom intel Honeywell TIM2 3185* Intel METRIX+ox+5100
Text: Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Thermal/Mechanical Design Guide July 2008 Revision 003US Order Number: 318676-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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003US
318676-003US
x1131
D10234-001
A13494-005
HB96030-DW)
PCM45F
intel core 2 duo e7500
T9400
atom intel
Honeywell TIM2
3185* Intel
METRIX+ox+5100
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CPU COOLER
Abstract: WIESON 2510c888-001 2510c888-001 109X9112PT0H016 775 cpu connector wieson intel 775 775-LAND san ace cpu lga
Text: CPU Cooler SAN ACE MC Intel 775-land LGA Package CPU Cooler • General Specifications ・Material ……… Frame: Plastics Flammability: UL94V-0 , Impeller: Plastics (Flammability: UL94V-1) Heatsink: Aluminum (Core: Copper) ・Lead Wire …… yellow (Connector No.2 side)
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775-land
UL94V-0)
UL94V-1
2510C888-001
5159PBT
2511-T1
109X9112PT0H016
HoneywellPCM45F
AWG26
CPU COOLER
WIESON 2510c888-001
109X9112PT0H016
775 cpu connector
wieson
intel 775
san ace
cpu lga
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CPU COOLER
Abstract: PCM45F 2510c888-001 WIESON 2510c888-001 wieson 109X9212PT0H016 San Ace 200 775-LAND
Text: CPU Cooler SAN ACE MC Intel Pentium® 4 Processor （775-land LGA Package） CPU Cooler • General Specifications ・Material ……… Frame: Plastics Flammability: UL94V-0 , Impeller: Plastics (Flammability: UL94V-1) Heatsink: Aluminum (Core: Copper)
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775-land
UL94V-0)
UL94V-1
2510C888-001
5159PBT
2511-T1
PCM45F
VoltageDC12V
Frequency25kHz
AWG26
CPU COOLER
PCM45F
WIESON 2510c888-001
wieson
109X9212PT0H016
San Ace 200
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109X9912T0D516
Abstract: PCM45F
Text: MPU coolers SAN ACE MC Intel Pentium®4 Processor Socket478 Compatible General specifications MPU Coolers Life expectancy ‥‥‥‥‥‥ 40,000 hours, indoor environment(survival rate: 90% at 60℃, rated voltage, and continuously run in a free air state)
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Socket478)
UL1430
AWG26
HoneywellPCM45F
Soket478
109X9912T0D516
PCM45F
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C40682-002
Abstract: BGA Ball Crack honeywell pcm45hd intel 3001 processor cross reference honeywell pcm45 B2567-02 B3541 INTEL application notes 80333
Text: Intel 80333 I/O Processor Thermal Design Guidelines Application Note May 2005 Document Number: 306630002US Intel® 80333 I/O Processor INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
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306630002US
rights100%
C40682-002
BGA Ball Crack
honeywell pcm45hd
intel 3001
processor cross reference
honeywell pcm45
B2567-02
B3541
INTEL application notes
80333
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2510c888-001
Abstract: CPU COOLER 775 cpu connector PCM45F honeywell pcm45 molex connector catalog 12V cooler MOTOR 2511-T1 WIESON 2510c888-001 pcm45
Text: SAN ACE MC CPU Cooler For Intel Pentium® 4 Processor 775-land LGA Package CPU Cooler " SanAce MC" PWM Control Function and Thermally Speed Control General specifications CPU Coolers Material ‥‥‥‥‥‥‥‥‥Fream,impeller:resin mold Heatsink:alminum (core:copper)
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775-land
500VAC,
PCM45F
AWG26
2510c888-001
CPU COOLER
775 cpu connector
PCM45F
honeywell pcm45
molex connector catalog
12V cooler MOTOR
2511-T1
WIESON 2510c888-001
pcm45
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CPU COOLER
Abstract: LGA 1151 775 cpu connector 109X9112PT0H016 2510c888-001 2511-T1 lga 775 PCM45F San Ace 40 intel CPU COOLER 775
Text: SAN ACE MC CPU Cooler For Intel 775-land LGA Package CPU Cooler " SAN ACE MC" PWM Control Function and Thermally Speed Control General specifications Specifications Model No. Rated Voltage （V） Operating Voltage Range （V） Rated Current （A） Rated Speed
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775-land
109X9112PT0H016
HoneywellPCM45F
AWG26
775-lamd
CPU COOLER
LGA 1151
775 cpu connector
109X9112PT0H016
2510c888-001
2511-T1
lga 775
PCM45F
San Ace 40
intel CPU COOLER 775
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BTX LGA 775
Abstract: PCM45F 2510C888-001 CPU COOLER WIESON 2510c888-001 12V cooler MOTOR LGA 1151 109X7912P1H012 San Ace 40 109X7912PT1H012
Text: SAN ACE MC CPU Cooler For Intel 775 land-LGA Package CPU Cooler " SAN ACE MC" Thermal Module Type II for BTX General specifications Specifications Rated Voltage Operating Voltage Range Rated Current （V ） （V ） （A ） Model No. 109X7912P1H012*
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109X7912P1H012*
109X7912PT1H012*
AWG26
UL1430
PCM45F
775-lamd
BTX LGA 775
PCM45F
2510C888-001
CPU COOLER
WIESON 2510c888-001
12V cooler MOTOR
LGA 1151
109X7912P1H012
San Ace 40
109X7912PT1H012
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82915GV
Abstract: 915Gv Intel 915G Intel 915p Intel desktop design guide intel 915g express PCM45F Passive Heatsink FCBGA intel server board xeon lga 775 775 Intel Processor
Text: Intel 82915GV Express Chipset Thermal Design Guide for Embedded Applications September 2004 Revision 1.0 Reference Number: 303729 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
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82915GV
915GV
Intel 915G
Intel 915p
Intel desktop design guide
intel 915g express
PCM45F
Passive Heatsink FCBGA
intel server board xeon lga 775
775 Intel Processor
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PCM45F
Abstract: 2510C888-001 775 cpu connector CPU COOLER WIESON 2510c888-001 BTX LGA 775 San Ace 40 2511-T1 9G0912P2E012 9G0912PT2E012
Text: SAN ACE MC CPU Cooler For Intel 775 land-LGA Package CPU Cooler " SAN ACE MC" Thermal Module Type I for BTX General specifications Specifications Model No. Rated Voltage （V） Operating Voltage Range （V） Rated Current （A） Rated Speed （min-1）
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9G0912P2E012*
9G0912PT2E012*
AWG26
UL1430
PCM45F
775-lamd
PCM45F
2510C888-001
775 cpu connector
CPU COOLER
WIESON 2510c888-001
BTX LGA 775
San Ace 40
2511-T1
9G0912P2E012
9G0912PT2E012
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100C
Abstract: PCM45 PCM45F moc 7002
Text: Intel 81341 and 81342 I/O Processors Thermal Design Considerations Application Note July 2007 Order Number: 315051-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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SU200-150513
etaC--24318
100C
PCM45
PCM45F
moc 7002
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intel 82945g chipset motherboard layout
Abstract: socket lga 1156 945P 945G intel ICH7 air velocity sensors 82945 intel 945G transistor 945P GMCH of motherboard
Text: Intel 945G Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide August 2005 Order #308643-001 Intel® 945G Express Chipset GMCH Thermal Design Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
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bcp 846
Abstract: 100C PCM45 PCM45F HT 7002
Text: Intel 413808 and 413812 SAS/ SATA I/O Controllers Thermal Design Considerations Application Note July 2007 Order Number: 315052-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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SU200-250513
54MCP
mm01x05x05
etaC--218314
bcp 846
100C
PCM45
PCM45F
HT 7002
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pcm45
Abstract: PCM45F G751 x23-7783D honeywell pcm45 copper thermal thermal test vehicle -intel
Text: Heat Sink for Intel Nocona 3.6 to 3.8GHz 800FSB in 1U Servers PASSIVE HEAT SINK FOR INTEL® NOCONA 3.6 TO 3.8GHz 800FSB PROCESSORS Aavid’s solution for Nocona 3.6 to 3.8GHz processors is designed specifically for thermal engineers who require high performance solution for dual and multi processor
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800FSB
pcm45
PCM45F
G751
x23-7783D
honeywell pcm45
copper thermal
thermal test vehicle -intel
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PCM45F
Abstract: X23-7783D intel 830 pcm45 G751
Text: Xeon MP 2.8 GHz,™ Nocona 3.2GHz 2U Heat Sink Preliminary PASSIVE HEAT SINK FOR INTEL XEON™ MP 2.8 GHz, NOCONA™ 533FSB 3.2GHz PROCESSORS Aavid’s solution for Xeon™ MP 2.8 GHz, Nocona™ 3.2GHz processor is designed specifically for thermal engineers
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533FSB
PCM45F
X23-7783D
intel 830
pcm45
G751
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x23-7783D
Abstract: thermal test vehicle -intel PCM45F 7783D G751
Text: Heat Sink for Intel Nocona 3.6 to 3.8GHz 800FSB in 2U Servers PASSIVE HEAT SINK FOR INTEL® NOCONA 3.6 TO 3.8GHz 800FSB PROCESSORS Aavid’s solution for Nocona 3.6 to 3.8GHz processors is designed specifically for thermal engineers who require high performance solution for dual and multi processor
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800FSB
x23-7783D
thermal test vehicle -intel
PCM45F
7783D
G751
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LGA775
Abstract: prescott intel lga775 PCM45F LGS775 G751 aavid thermal test vehicle -intel
Text: Heat Sink for Intel Prescott LGA775 in 1U Servers PASSIVE HEAT SINK FOR INTEL® PRESCOTT PROCESSORS Aavid’s solution for Prescott LGA775 processors is designed specifically for thermal engineers who require a high performance solution for single processor 1U servers.
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LGA775
LGA775
prescott
intel lga775
PCM45F
LGS775
G751
aavid
thermal test vehicle -intel
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honeywell pcm45
Abstract: CEK 550 PCM45F G751 thermal test vehicle -intel
Text: Heat Sink for Intel Xeon Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT SINK FOR INTEL® XEON™ POTOMAC MP AND NOCONA DP PROCESSORS Aavid’s solution for Xeon™ Potomac MP and Nocona DP processors is designed specifically for thermal engineers
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PCM45F
Abstract: AL6063T5 335C RANT honeywell pcm45F
Text: /? z INSPECTION DIMENSION, USE HIGHLIGHTED INSPECTION DIMENSIONS AS BASIC DIMENSIONS EOR GEOMETRIC TOLERANCING (53,00 [ 2,087 ] a H m (35,10 ) [1,382 ] (.80 ) [,032 ] C to I 40,05 ±1 & OJ J 5,33 [,210 ] CD È _ d OU \1l1 sQ£ (60,10 ) [ 2,366 ] ¡3 CD
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PCM45F
55901A
85590EI
333C855902B
PAD8559D2B
D6/24/
PCM45F
AL6063T5
335C
RANT
honeywell pcm45F
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intel mark 164997
Abstract: TDP 245 Y
Text: NOTES' 1. CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PROCESS. 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FROM CENTERLINE DF HEATSINK. Ld I- 1 1 1 3 2 1 TDP 335C872401A 334C872401A 333C872401A 00C872401
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335C872401A
334C872401A
333C872401A
00C872401
PCM45F
20X20
00C872401A
334C87E401A
intel mark 164997
TDP 245 Y
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