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    HMP SOLDER Search Results

    HMP SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    HMP SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Blank Sn63 / HMP Compatible Sn63 or HMP (150°C / 200°C) Not Compliant X Sn96 / HMP Compatible


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    MABACT0051

    Abstract: HMP Europe
    Text: Broadband CATV 1:1 Transmission Line Transformer 50-1200MHz Features • SMT unit • 1:1 impedance • Available on tape & reel, reel qty. 900 • Excellent temperature stability • All wires soldered to substrate using HMP solder MABACT0051 V1 SM-118A Case Style


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    PDF 50-1200MHz MABACT0051 SM-118A MABACT0051 HMP Europe

    EMDC-17-8-75

    Abstract: M513
    Text: Broadband CATV, Coupler 5-1000MHz EMDC-17-8-75 V7 Features • • • • • Schematic Surface Mount Typical Coupling +17dB 260°C Reflow Compatible Available on Tape and Reel, reel qty. 900 All wires are soldered to the substrate using HMP solder Description


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    PDF 5-1000MHz EMDC-17-8-75 EMDC-17-8-75 SM-127 M513

    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Attachment Method Recommended Max. Temp. Blank Standard 60%Sn 40% Pb coated lead frames Sn63 or HMP


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Attachment Method Recommended Max. Temp. Summary Standard 60%Sn 40% Pb coated lead frames Sn63 or HMP


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    PDF Sn96/HMP

    ELDC-20TR

    Abstract: ELDC-20 M513
    Text: Broadband CATV, Coupler 5-1000MHz ELDC-20 V8 Features • • • • • Schematic Surface Mount Typical Coupling 20dB 260°C Reflow Compatible Available on Tape and Reel, reel qty. 900 All wires are soldered to the substrate using HMP solder Description


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    PDF 5-1000MHz ELDC-20 ELDC-20 SM-55 SM-127 ELDC-20TR M513

    solder wire HMP

    Abstract: EMDC-17-5-75 M513
    Text: Broadband CATV, Coupler 5-1000MHz EMDC-17-5-75 V6 Features • • • • • Schematic Surface Mount Typical Coupling +17dB 260°C Reflow Compatible Available on Tape and Reel, reel qty. 900 All wires are soldered to the substrate using HMP solder Description


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    PDF 5-1000MHz EMDC-17-5-75 EMDC-17-5-75 SM-127 solder wire HMP M513

    Untitled

    Abstract: No abstract text available
    Text: REV. LET. REVISION A MODIFIED THE LEAD FORM BY DATE APPR. DATE PBOHN 2/7/14 SCYGAN 2/7/14 PBOHN 2/14/14 SCYGAN 2/14/14 WITH EXEMPTION7 a for HMP SOLDER RADIAL LEADED, UNCOATED LENGTH (L) = 0.300 MAX. HEIGHT (H) = 0.350 MAX. THICKNESS (T) = 0.100 MAX. LEAD SPACING (LS) = 0.200 ± .031


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    PDF Sn10Pb88Ag2 MIL-PRF-49470 125CEMPERATURE SK035X105KHAUNCOATED AOL-2742-01

    MYXD30600-10CEN

    Abstract: silicon carbide
    Text: SiC Schottky 3 Phase Diode Bridge 600 Volt 10 Amp Hermetic MYXD30600-10CEN y r a in Product Overview Features Benefits • Essentially no switching losses • High voltage 600V isolation • 6 off high current 10A diodes • High temperature 210°C • HMP solder tinned leads available


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    PDF MYXD30600-10CEN O-258 MYXD30600-10CEN silicon carbide

    MACP-008125-CK07F0

    Abstract: ELDC-20 M513 MACP-008125-CK07TB SM55
    Text: RoHS Compliant Broadband CATV, Coupler 5-1000MHz Schematic Features • • • • • • • MACP-008125-CK07F0 V1 Surface Mount Typical Coupling 20dB RoHS* Compliant RoHS version of ELDC-20. 260°C Reflow Compatible Available on Tape and Reel. All wires are soldered to the substrate using HMP solder


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    PDF 5-1000MHz MACP-008125-CK07F0 ELDC-20. MACP-008125-CK07F0 SM-55 SM-127 ELDC-20 M513 MACP-008125-CK07TB SM55

    ELDC-20

    Abstract: M513 MACP-008125-CK07F0 MACP-008125-CK07TB
    Text: RoHS Compliant Broadband CATV, Coupler 5-1000MHz Schematic Features • • • • • • • MACP-008125-CK07F0 V1 Surface Mount Typical Coupling 20dB RoHS* Compliant RoHS version of ELDC-20. 260°C Reflow Compatible Available on Tape and Reel. All wires are soldered to the substrate using HMP solder


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    PDF 5-1000MHz MACP-008125-CK07F0 ELDC-20. MACP-008125-CK07F0 SM-55 SM-127 ELDC-20 M513 MACP-008125-CK07TB

    SAC387

    Abstract: BS219 SAC387 solder multicore solder wire Multicore 96SC 97Cu3 LMP62 solder wire HMP Loctite 414 MSDS Multicore savbit
    Text: Technical Data Sheet Properties of Alloys of Multicore“ Solder Wires August 2007 # This data sheet lists the most popular solders supplied as flux-cored wire and can be used in addition to the separate Technical Data Sheets for Multicore cored solder wire fluxes.


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C GENERAL RECOMMENDATIONS FOR SOLDERING CERAMIC STACKED CAPACITORS In general, Presidio recommends against hand soldering for this type of large ceramic device. However, if the


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    PDF HT0805XHT473K1Q5R

    Untitled

    Abstract: No abstract text available
    Text: FlipChip series FC platinum sensor For the automatic assembling on PCB by soldering or bonding Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Optimal price-performance ratio ▪▪ Minimum space consumption on PCB ▪▪ Bondable versions available


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    din 43760

    Abstract: DIN IEC 68 din IEC 68 soldering
    Text: Nickel Temperature Sensors FC – Product Series Temperature Range: –60°C.+200°C Nickel temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable) Technical Data Specification: DIN 43760 Temperature range:


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    PDF T2-20, 1000h din 43760 DIN IEC 68 din IEC 68 soldering

    DIN EN 60751

    Abstract: No abstract text available
    Text: Platinum Temperature Sensors FC – Product Series Temperature Range: –50°C.+150/250/400/600°C Platinum temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable) Technical Data Specification: DIN EN 60751


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms of the inherent


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    hmp solder

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CAPACITORS Consult factory for requirements above 250°C * Contact factory regarding NPQ dielectric DIELECTRIC CHARACTERISTICS CHARACTERISTICS NPO/NPQ* DIELECTRIC XHT DIELECTRIC X7R DIELECTRIC OPERATING TEMPERATURE RANGE -55°C to 250°C


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    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms of the inherent


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms


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    PDF HT0805XHT473K1Q5R

    dielectric

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CAPACITORS Consult factory for requirements above 250°C * Contact factory regarding NPQ dielectric DIELECTRIC CHARACTERISTICS CHARACTERISTICS NPO/NPQ* DIELECTRIC XHT DIELECTRIC X7R DIELECTRIC OPERATING TEMPERATURE RANGE -55°C to 250°C


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    presidio X7R

    Abstract: No abstract text available
    Text: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C


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    PDF SOLDERING/T08 presidio X7R