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    HL832 PCB MATERIAL Search Results

    HL832 PCB MATERIAL Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    UE62B46230S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    UE62B46200S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions

    HL832 PCB MATERIAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG

    AU-85B

    Abstract: Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor
    Text: Specification for Approval Samsung Electro-Mechanics Co.,LTD PDF created with pdfFactory Pro trial version www.pdffactory.com Specification for Approval Revision History Rev. Date Description of Change Rev. Page 1 2005.07.30 The Primary Specification 1.0 Rev.


    Original     		PDF AU-85B MOMBD420G1A AU-85B Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor