Helium Leak Rates and Testing
Abstract: No abstract text available
Text: Introduction to Hermetic Connectors A Helium Leak Rates and Testing Hermeticity Hermeticity is defined as “the state or condition of being airtight”. Sophisticated military electronics enclosures can experience electrical failure from ingress of moisture. System engineers can design the enclosure to withstand exposure
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cc/10
cc/100
cc/24
cc/30
cc/3000
Helium Leak Rates and Testing
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IEC749
Abstract: Hybrid Memory Products Krypton-85 202F leak
Text: Hybrid Memory Products Ltd Hermeticity Testing TECHNICAL NOTE Summary A large portion of the failure mechanisms which are most active in electronic packages are either initiated or accelerated by the presence of moisture. In hermetic packages ceramic or metal this moisture can be locked inside the case during
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consid5x10-8
1x10-7
1x10-6
IEC749
Hybrid Memory Products
Krypton-85
202F
leak
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Untitled
Abstract: No abstract text available
Text: Gla ss-to -m e ta l s e a l hermetic connectors military qpl and commercial connectors for harsh environment air-tight-seal applications APRIL 2013 mission critical high pressure hermetics Resolve gas, moisture, and particle ingress problems with advanced performance glasssealed hermetic connectors—the world’s
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Mil-DTL-38999
MIL-DTL-24308
1X10-7
1X10-10
comp100
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IPC-T-50
Abstract: JEDEC JESD22-B116 free NCSL Z540.3 MIL-STD-883H EIA/JESD22-B116 ultrasonic atomizer Infant Radiant Warmer JESD22-B116 JEDEC JESD22-B116 free download Hybrid Microcircuits GENERAL INSTRUMENT
Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 September 2010. INCH - POUND MIL-STD-883H 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD
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MIL-STD-883H
MIL-STD-883G
STD883
IPC-T-50
JEDEC JESD22-B116 free
NCSL Z540.3
MIL-STD-883H
EIA/JESD22-B116
ultrasonic atomizer
Infant Radiant Warmer
JESD22-B116
JEDEC JESD22-B116 free download
Hybrid Microcircuits GENERAL INSTRUMENT
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210895
Abstract: hfbr series LST282X LST292X LST3821 LST3921 197412 HFBR 5000 CMAC 20063
Text: Coaxial Pigtailed Laser Module Interim Qualification Report 2000 hours Reliability Data Summary This report summarizes the status of the LST292X Qualification testing to date (Up to and including 2000 hours). At the time of writing, the qualification has passed.
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LST292X
QP0044)
LST282X/LST292X
QB000217
QB000323
QB000324
QB000326
QB000415
QB000416
QB000426
210895
hfbr series
LST282X
LST3821
LST3921
197412
HFBR 5000
CMAC 20063
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in-process quality inspections
Abstract: mitsubishi metal oxide varistor 011AT phase controlled thyristers MITSUBISHI GATE TURN-OFF THYRISTOR gto thyristor handbook design GTO switching test mitsubishi conclusion of zener diode voltage report 4000BX-90DA zener diode reliability fit
Text: MITSUBISHI HIGH POWER SEMICONDUCTORS SEMICONDUCTOR DEVICE RELIABILITY 2. Basic Concepts of Semiconductor Device Reliability The failure rate of devices used in an average piece of equipment can be expressed by using the bathtub curve shown in Fig. 1, line a . Taken
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capture and electronic packaging
Abstract: teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA
Text: AG100714 Opto Optoelectronics Products, Packaging & Engineering Services Approved for Export COMPANY PROPRIETARY DAR 07/22/10 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • microelectronics@teledyne.com • www.teledynemicro.com
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AG100714
DAR090709
capture and electronic packaging
teledyne Microelectronics
microwave transceiver specification
Optical-Pressure-Sensor
Optic-Pressure-Sensor
military relay
pro mechanica
Arrayed Waveguide Grating
DAR090709
TOSA
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Pi filter array design
Abstract: Pi capacitor tubular Tubular Pi type capacitor LC PI FILTER DESIGN mil-dtl-38999 assembly procedures Beacon ferrite space qualified Pi tubular capacitor MIL-DTL-38999 series II
Text: Introduction MIL-DTL-38999 Type Filter Connectors Overview Hermetic seals are qualified via various methodologies including helium testing and dye penetrant. The purpose of both types of tests is to detect and measure leakage under pressure. The dye penetrant method has the advantage
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MIL-DTL-38999
Pi filter array design
Pi capacitor tubular
Tubular Pi type capacitor
LC PI FILTER DESIGN
mil-dtl-38999 assembly procedures
Beacon
ferrite space qualified
Pi tubular capacitor
MIL-DTL-38999 series II
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dlva
Abstract: transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex
Text: SC090624 RF & MW DAR060930 RF & Microwave Packaging Capabilities & Engineering Services Approved for Export DAR 6/30/09 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • microelectronics@teledyne.com • www.teledynemicro.com
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SC090624
DAR060930
MIL-PRF-38534,
MIL-STD-883
D6-82479
D1-9000
MIL-STD-790,
MIL-PRF-28750,
dlva
transmission line model orcad pspice
24 GHz Microwave Sensor
surface mount htcc
capture and electronic packaging
E8257C manual
86142B
8703A
E4407B
Flip Chip on flex
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Untitled
Abstract: No abstract text available
Text: Glossary Vishay Foil Resistors Bulk Metal Foil Technology Glossary of Terms ACCEPTABLE QUALITY LEVEL AQL : The maximum percent defective (or maximum number of defects per hundred units) that, for the purpose of sampling inspection, can be considered satisfactory as a process average. Defects may be
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he804
Abstract: ati connector HE809 smd diode ED MMSD32032602S-C-xx Microspire MB he807 eurofarad TCN30 MMEE08510804S-C-xx mmfl16016604s-c mmfl16016604s-d
Text: Edition 1.2. Space- & Military Level Components 2008/08 2 Introduction and Table of Contents If you are working on a program for military, industrial and/or space equipments & need product with extended temperature performance, MSA Components can help. To support the customer needs
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arstech
Abstract: No abstract text available
Text: Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33870 CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS Sukhvinder Kang kang@aavid.com David Miller John Cennamo Aavid Thermalloy LLC,
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IPACK2007
IPACK2007-33870
D2570-96
arstech
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210895
Abstract: 22-0150
Text: warn H EW LETT f t "KM PA CK A RD Coaxial Pigtailed Laser Module Interim Qualification Report 2000 hours Reliability Data Summary This report summarizes the status of the LST292X Qualification testing to date (Up to and including 2000 hours). At the time of writing, the
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lst292x
LST3821,
LST3921
LST292X
QP0044)
LST282X
QB000112
QB000211
QB000217
QB000323
210895
22-0150
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chn 610
Abstract: No abstract text available
Text: PRECISION BULK METAL FOIL “ TE CHN OL OG Y “ GLOSSARY a c o m p a n y V I S H A of Y VISHAY RESISTORS ACCURACY: The degree to which the measured value of resistance approximates the specified value of resistance. This is normally expressed in percent deviation but in precision resistor work, the percent is often so small that the results are
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K1135A
Abstract: K1135B K1135 K1135C 8210 microprocessor ultrasonic receiver MOTOROLA ultrasonic generator 1 Mhz 5A/K1135
Text: K1135Series re p re s e n te d k o ttm e ie r by ASS0 ^ ^ p E ' s u it e ?470 W N C H B « R b Lv d .,008 CAMPBELL, 408 866-5153 Dual Baud Rate Generator 16 Synchronous/Asynchronous Baud Rates from 50 to 19,200 1.035" X .530" AREA .200” SEATED HEIGHT + 5V, + 12V dc INPUTS
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K1135
K1135A,
K1135B,
K1135C.
K1135A
K1135B
R-29-3-24C
K1135C
8210 microprocessor
ultrasonic receiver MOTOROLA
ultrasonic generator 1 Mhz
5A/K1135
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TRU200D
Abstract: M1014 TRU200
Text: Data Sheet March 1992 H P AT&T TRU200 Clock Recovery and Data Retiming Modules Features • Output jitter typically 1 °rms ■ Low-cost modular solution ■ Choice of data rates from 44 Mbits/s to 315 Mbits/s ■ SONET compatible ■ 100K ECL compatible inputs and outputs
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TRU200
C105264493
C105313472
C105360424
C105264089
C106733587
C105659726
C106733595
TRU200D
TRU200D
M1014
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electrolytic ELITE
Abstract: No abstract text available
Text: QUALITY ASSURANCE and RELIABILITY PROGRAM 1. Introduction Samsung utilizes rigorous qualification and reliability programs to monitor the integrity of its devices. All industry stan dard {and various non-standard} stresses are run. Testing is done not only to collect data, but also to detect trends
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KSC945
KSD288
KSD288
168HRS)
200CYC)
electrolytic ELITE
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MIL-STD-883 PRESSURE COOKER
Abstract: No abstract text available
Text: QUALITY 1. ASSURANCE and R E L IA B IL IT Y PROGRAM Introduction Samsung utilizes rigorous qualification and reliability programs to monito the Integrity of its devices. All industry stan- dard and various non - standard stresses are run. Testing is done not only to collect data, but also to detect trends and produ
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168HRS)
1200cyc)
KSC945
KSD288
MIL-STD-883 PRESSURE COOKER
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K1135
Abstract: EK1135 K1135A K1135B
Text: K1135Series represented k o t t m e ie r - a sso ^ r ; r 408 BY T E S' 866-5153 s u it e Dual Baud Rate Generator 16 Synchronous/Asynchronous Baud Rates from 50 to 19,200 1 .0 3 5 " X . 530" A R E A .200" S E A T E D H E IG H T + 5V, + 1 2 V dc IN P U T S
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K1135Series
K1135
K1135A,
K1135B,
1135B
R-29-3-24C
EK1135
K1135A
K1135B
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Untitled
Abstract: No abstract text available
Text: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel opment, design and manufacturing. This section describes the methodology used by the IBM Micro electronics Division to achieve robust DRAM
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Untitled
Abstract: No abstract text available
Text: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel opment, design and manufacturing. This section describes the methodology used by the IBM Micro electronics Division to achieve robust DRAM
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cecc 50000
Abstract: No abstract text available
Text: RELIABILITY REPORT RELIABILITY AND FAILURE M ECHANISMS FUNDAM ENTALS In its sim plest form the failure rate at a given tem perature is: F.R. : -Through accelerated stresses we ascertain the value of the com ponents failure rates, in term s of how many devices (in percent) are expected to fail
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failures/10
cecc 50000
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Untitled
Abstract: No abstract text available
Text: QUARTZ CRYSTALS GTS Reeves FREQUENCY PRODUCTS Crystal Product Summary The following is a brief summary of the crystal units offered by CTS Reeves. We offer a broad range of crystal products that include: • Low Frequency Crystals; NT, DT, 5X10 kHz to 1 MHz
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atm lu 738
Abstract: No abstract text available
Text: RELIABILITY REPORT RELIABILITY AND FAILURE M ECHANISMS FUNDAM ENTALS -Through accelerated stresses we ascertain the value of the com ponents failure rates, in term s of how many devices in percent are expected to fail every 1000 hours of operation (X or F.R.)
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failures/10
100cC/watt
atm lu 738
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