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    HEATSINK FOR STUD DEVICES Search Results

    HEATSINK FOR STUD DEVICES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4204F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation

    HEATSINK FOR STUD DEVICES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: P 4SEMIKRON, leading manufacturer of diode thyristor power semicondictor modules !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features   


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P 1,2SEMIKRON, leading manufacturer of diode thyristor power semicondictor modules       *(## (   ! "#$%     '$ ()( ()**## * ()#   & '$  #)+ (),* Dimensions in mm Heatsink For stud devices P 1,2 Features   


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P 30       " #$%&$ " #$%+$ " #$&$$ % & #      ! %'$ $!* %') (##!* &'$ (#$!* " #$#$$ # %') (#-!*    !  % %', %') &', Heatsink Dimensions in mm For stud devices P 30 Features         


    Original     		PDF

    semikron

    Abstract: No abstract text available
    Text: P 30       " #$%&$ " #$%+$ " #$&$$ % & #      ! %'$ $!* %') (##!* &'$ (#$!* " #$#$$ # %') (#-!*    !  % %', %') &', Heatsink Dimensions in mm For stud devices P 30 Features         


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P 31       " #$$%& " #$%&& $ %      ! $'&# &!* $'#& (+&!* " #$#&& # $'#- (.+!*  Heatsink   !  $'$ $', %'- Dimensions in mm For stud devices P 31 Features               


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P 31       " #$$%& " #$%&& $ %      ! $'&# &!* $'#& (+&!* " #$#&& # $'#- (.+!*  Heatsink   !  $'$ $', %'- Dimensions in mm For stud devices P 31 Features               


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P 0,8     #*+",# #*+"'#   "   !"##$%     $ #*-,  & ! '  %     )$ #*".  "*/' " #*'0 #*" "*+  Dimensions in mm Heatsink For stud devices P 0,8 Features         1    


    Original     		PDF

    SEMIKRON

    Abstract: No abstract text available
    Text: P 0,8     #*+",# #*+"'#   "   !"##$%     $ #*-,  & ! '  %     )$ #*".  "*/' " #*'0 #*" "*+  Dimensions in mm Heatsink For stud devices P 0,8 Features         1    


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: K 1,1        % ( *  (+       %& ()( !,-&#   !" #     %& -).+ !(/- . # $ ' -)0 Dimensions in mm Heatsink For stud devices K 1,1 Publish Data Features         1          


    Original     		PDF

    P-12

    Abstract: No abstract text available
    Text: P 1,2       *(## (   ! "#$%     '$ ()( ()**## * ()#   & '$  #)+ (),* Dimensions in mm Heatsink For stud devices P 1,2 Features         1              


    Original     		PDF

    P-12

    Abstract: No abstract text available
    Text: P 1,2       *(## (   ! "#$%     '$ ()( ()**## * ()#   & '$  #)+ (),* Dimensions in mm Heatsink For stud devices P 1,2 Features         1              


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P4 !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features             1            


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: P4 !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features             1            


    Original     		PDF

    heatsink

    Abstract: No abstract text available
    Text: K9        % *       %& (+, !,&#   !" #     %& $ ' -+-, Dimensions in mm Heatsink For stud devices K9 Publish Data Features         1               


    Original     		PDF

    semikron K3

    Abstract: No abstract text available
    Text: K3        %  *+       %& (,* !*- &#   !" #     %& $ ' .,+ Dimensions in mm Heatsink For stud devices K3 Publish Data Features         1               


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: C3        * +,"# ,   ! "#$%     $  & ! '  %     )$  "-" #-.+ #-. Dimensions in mm Heatsink For stud devices C3 Features         1              


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: C3        * +,"# ,   ! "#$%     $  & ! '  %     )$  "-" #-.+ #-. Dimensions in mm Heatsink For stud devices C3 Features         1              


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    DIN ISO 1302

    Abstract: ISO 1302 DC340
    Text: Mounting Instructions Montagehinweise The IXYS Semiconductor devices are thoroughly checked before leaving the factory. To avoid any damage during mounting, please note the following instructions. IXYS Leistungshalbleiter verlassen das Werk nach Prüfung in


    Original     		PDF DC340. DIN ISO 1302 ISO 1302 DC340

    IXAN0027

    Abstract: DIN iso 1302 ISO 1302 DC340 DIN ISO 965 DIN 1302
    Text: IXAN0027 Mounting Instructions Montagehinweise The IXYS Semiconductor devices are thoroughly checked before leaving the factory. To avoid any damage during mounting, please note the following instructions. IXYS Leistungshalbleiter verlassen das Werk nach Prüfung in


    Original     		PDF IXAN0027 DC340. IXAN0027 DIN iso 1302 ISO 1302 DC340 DIN ISO 965 DIN 1302

    SOT333

    Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
    Text: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage


    Original     		PDF

    P4855-1

    Abstract: Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a
    Text: Order this document by AN1040/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1040 MOUNTING CONSIDERATIONS FOR POWER SEMICONDUCTORS Prepared by: Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF AN1040/D AN1040 P4855-1 Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a

    thermafilm

    Abstract: 2088AB thermasil EB107/D sync nut eb107 ierc heatsink richco Silicone Rubber 35 Shore A thermafilm 1 mhw 592
    Text: AN1040/D Mounting Considerations For Power Semiconductors http://onsemi.com Prepared by: Bill Roehr APPLICATION NOTE INTRODUCTION Current and power ratings of semiconductors are inseparably linked to their thermal environment. Except for lead–mounted parts used at low currents, a heat exchanger


    Original     		PDF AN1040/D r14525 thermafilm 2088AB thermasil EB107/D sync nut eb107 ierc heatsink richco Silicone Rubber 35 Shore A thermafilm 1 mhw 592

    2088AB

    Abstract: eb107 TO-210AA Package AAVID THERMALLOY COMPOUND 250 814a TO-210AB TRANSISTOR SUBSTITUTION DATA BOOK 1993 AN1040 DO-203AA DO-203AB
    Text: Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE . Archived 2005 MOTOROLA Order this document by AN1040/D AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power


    Original     		PDF AN1040/D AN1040 2088AB eb107 TO-210AA Package AAVID THERMALLOY COMPOUND 250 814a TO-210AB TRANSISTOR SUBSTITUTION DATA BOOK 1993 AN1040 DO-203AA DO-203AB

    Penetrox A-13

    Abstract: CMK450B19M CMK450B25M penetrox A SCX13 penetrox a 13 450B19M 1500B34M CMK1500B34M 450B25M
    Text: M ounting Procedures It is important to observe the correct mounting procedures when using Power Semiconductors to ensure effective cooling, good current conduction and reliability. Heatsink preparation is a vital part of the procedure . 1 ALUMINIUM HEATSINKS w for CAPSULE and FLAT BASE devices:Apply a small amount of mounting grease(b) to the heatsink. Scrub the heatsink area with a wire brush (a


    OCR Scan     		PDF 450B19M 450x56M 450B25M 550x56M 1130x76M 1500B34M 2100x76M 2140x76M 2500x116M 3000x116M Penetrox A-13 CMK450B19M CMK450B25M penetrox A SCX13 penetrox a 13 CMK1500B34M